1. | EXECUTIVE SUMMARY |
1.1. | 5G, next generation cellular communications network |
1.2. | What can 5G offer: high speed, massive connection and low latency |
1.3. | Two types of 5G: Sub-6 GHz and high frequency |
1.4. | Sub-6 GHz will be the first option for most operators |
1.5. | 5G is live globally |
1.6. | 5G for consumers overview |
1.7. | 5G market forecast for services 2018-2030 |
1.8. | 5G Capex 2020-2025 |
1.9. | Global trends and new opportunities in 5G |
1.10. | 5G new radio technologies |
1.11. | 5G core network technologies |
1.12. | 5G base station types |
1.13. | Evolution of the cellular base station: overview |
1.14. | Trends in 5G network: easier for carriers to deploy |
1.15. | 5G infrastructure: Huawei, Ericsson, Nokia, ZTE and Samsung |
1.16. | Global market share of 5G base station shipment in 2019 |
1.17. | Competition landscape for key 5G infrastructure vendors |
1.18. | Trends in 5G: small cells will see a rapid growth |
1.19. | 5G station number forecast (2020-2030) by region |
1.20. | 5G station instalment forecast (2020-2030) by type of cell (macro, micro, pico/femto) |
1.21. | Trends in 5G antennas: active antennas and massive MIMO |
1.22. | Structure of massive MIMO system |
1.23. | Key challenges for massive MIMO deployment |
1.24. | Main suppliers of 5G active antennas unit (AAU) |
1.25. | Global market share and historic shipment of base station antennas and active antennas |
1.26. | Top infrastructure venders are now equipped with antennas capabilities |
1.27. | 5G System on chip global market share 2019 |
1.28. | List of 5G modems and SoC |
1.29. | 5G user equipment landscape |
1.30. | 5G smartphones vendors and devices |
1.31. | 5G mobile shipment units 2018-2030 |
1.32. | Market overview of the 5G CPE |
1.33. | Shipment of customer promised equipment and hotspots by units 2018-2030 |
1.34. | Overview of challenges, trends and innovations for high frequency 5G |
1.35. | Dielectric constant: benchmarking different substrate technologies |
1.36. | Loss tangent: benchmarking different substrate technologies |
1.37. | Moisture uptake: benchmarking different substrate technologies |
1.38. | Radio frequency front end module (RF FEM) |
1.39. | Power amplifier and beamforming component forecast |
1.40. | Filter technologies that can work at mmWave 5G and which one will be the future |
1.41. | Benchmarking different transmission lines filters |
1.42. | The choice of the semiconductor technology for power amplifiers |
1.43. | Key semiconductor properties |
1.44. | Summary of RF GaN Suppliers |
1.45. | Semiconductor choice forecast |
1.46. | Semiconductor forecast (2020-2030) for power amplifiers (GaN, LDMOS, SiGe/Si) by die area |
1.47. | What is Electromagnetic interference shielding and why it matters to 5G |
1.48. | Challenges and key trends for EMI shielding for 5G devices |
1.49. | Optical devices key players and their market share |
1.50. | Optical transceiver module supply chain and key players |
1.51. | TIM considerations |
1.52. | Properties of Thermal Interface Materials |
1.53. | Total TIM forecast for 5G stations |
1.54. | 5G now incorporates NB-IoT and LTE-M |
1.55. | Global deployment of NB-IoT and LTE-M |
1.56. | Key players |
1.57. | Overview of the 5G forecast |
2. | INTRODUCTION TO 5G |
2.1. | 5G, next generation cellular communications network |
2.2. | Evolution of mobile communications |
2.3. | What can 5G offer: high speed, massive connection and low latency |
2.4. | 5G is suitable for vertical applications |
2.5. | 5G for consumers overview |
2.6. | Two types of 5G: Sub-6 GHz and high frequency |
2.7. | Sub-6 GHz will be the first option for most operators |
2.8. | Why does 5G have lower latency radio transmissions |
2.9. | 5G is built on LTE (4G) technology |
2.10. | The main technique innovations |
2.11. | 5G supply chain |
2.12. | Two waves of 5G |
2.13. | First wave of 5G smartphones |
2.14. | Fixed wireless access to 5G / customer-premises equipment (CPE) |
2.15. | 5G investments at three stages |
2.16. | Capex spend for 5G infrastructure |
2.17. | Case study: expected 5G investment for infrastructure in China |
2.18. | Key players in 5G technologies |
2.19. | 5G patents by countries |
2.20. | 5G patents by companies |
2.21. | 5G is live globally |
2.22. | Charge for 5G service |
2.23. | 5G Capex 2020-2025 |
2.24. | Global trends and new opportunities in 5G |
3. | 5G TECHNOLOGY INNOVATIONS |
3.1. | End-to-end technology overview |
3.2. | 5G new radio technologies |
3.3. | Large number of antennas: massive MIMO |
3.4. | Massive MIMO enables advanced beam forming |
3.5. | Massive MIMO challenges and possible solutions |
3.6. | Massive MIMO requires active antennas |
3.7. | High frequency communication: mmWave |
3.8. | New multiple access methods: Non-orthogonal multiple-access techniques (NOMA) |
3.9. | Advanced waveforms and channel coding |
3.10. | Comparison of Turbo, LDPC and Polar code |
3.11. | Ultra dense network |
3.12. | Challenges for UDN |
3.13. | 5G core network technologies |
3.14. | Comparison of 4G core and 5G core |
3.15. | Service based architecture (SBA) |
3.16. | Edge-computing |
3.17. | Network slicing |
3.18. | Spectrum sharing |
4. | 5G INFRASTRUCTURE AND USER EQUIPMENT |
4.1. | Base station |
4.1.1. | 5G base station types |
4.1.2. | Evolution of the cellular base station: overview |
4.1.3. | Trends in 5G: base station architecture |
4.1.4. | Architecture of macro cell |
4.1.5. | Key challenges for 5G macro cell |
4.1.6. | Trends in 5G network: easier for carriers to deploy |
4.1.7. | 5G infrastructure: Huawei, Ericsson, Nokia, ZTE and Samsung |
4.1.8. | Global market share of 5G base station shipment in 2019 |
4.1.9. | Competition landscape for key 5G infrastructure vendors |
4.1.10. | 5G contracts landscape for key 5G infrastructure vendors |
4.1.11. | Trends in 5G: small cells will see a rapid growth |
4.1.12. | Case study: Ericsson 5G radio dot |
4.1.13. | Case study: Ericsson rural coverage solutions |
4.2. | Active antennas and beam forming ICs |
4.2.1. | What are active antennas |
4.2.2. | Trends in 5G antennas: active antennas and massive MIMO |
4.2.3. | Antenna array architectures for beam forming |
4.2.4. | Approach to beam forming |
4.2.5. | Structure of massive MIMO system |
4.2.6. | Key challenges for massive MIMO deployment |
4.2.7. | LTE antenna tear down |
4.2.8. | Active antennas design: planar vs non-planar |
4.2.9. | 5G base station teardown |
4.2.10. | Sub-6 GHz antenna teardown |
4.2.11. | mmWave antenna teardown |
4.2.12. | 28GHz all-silicon 64 dual polarized antenna |
4.2.13. | IDT (Renesas) has a strong position in beam-forming ICs |
4.2.14. | IDT (Renesas) 28Ghz 2x2 4-channel SiGe beamforming IC |
4.2.15. | Anokiwave: Tx/Rx 4-element 3GPP 5G band all in silicon |
4.2.16. | Anokiwave: 256-element all-silicon array |
4.2.17. | Sivers IMA: dual-quad 5G dual-polarized beam forming IC |
4.2.18. | Analog: a 16-channel dual polarized beam-forming IC? |
4.2.19. | NEC's new antenna technology |
4.2.20. | Case study: Ericsson antenna systems for 5G |
4.2.21. | Main suppliers of 5G active antennas unit (AAU) (1) |
4.2.22. | Case study: NEC 5G Radio Unit |
4.2.23. | Case study: Nokia AirScale mMIMO Adaptive Antenna |
4.2.24. | Case study: Samsung 5G Access solution for SK telecom |
4.2.25. | Global market share and historic shipment of base station antennas and active antennas |
4.2.26. | Top infrastructure venders are now equipped with antenna capabilities |
4.2.27. | 5G antennas for smartphone |
4.3. | Chipsets and modules |
4.3.1. | 5G Chipsets |
4.3.2. | System on chip global market share 2019 |
4.3.3. | Landscape of different types of chipsets |
4.3.4. | Examples: 5G chipset and module |
4.3.5. | List of 5G modems and SoC |
4.3.6. | List of 5G modules |
4.3.7. | Case study: MediaTek 5G Modem Helio M70 |
4.3.8. | Case study: Huawei 5G modem Balong 5000 |
4.3.9. | Case study: Qualcomm 5G modem Snapdragon X55 |
4.3.10. | Case study: Qualcomm Snapdragon 855 SoC |
4.3.11. | Case study: Qualcomm small cell 5G platform (FSM 100xx) |
4.4. | User equipment |
4.4.1. | 5G user equipment landscape |
4.4.2. | 5G smartphone overview |
4.4.3. | 5G smartphones vendors and devices |
4.4.4. | 5G mobile shipment units 2018-2030 |
4.4.5. | 2019 shipment of smartphone by venders |
4.4.6. | Case study: Huawei Mate X 5G smartphone |
4.4.7. | Case study: ZTE Axon 10 Pro 5G smartphone |
4.4.8. | Case study: Motorola 5G mod Moto5G smartphone |
4.4.9. | Case study: Samsung Galaxy S10 5G smartphone |
4.4.10. | Market overview of the 5G CPE |
4.4.11. | List of 5G CPE and Hotspot |
4.4.12. | Shipment of customer promised equipment and hotspots by units 2018-2030 |
4.4.13. | 5G fixed wireless devices |
4.4.14. | Case study: Huawei CPE Pro |
4.4.15. | Case study: Nokia FastMile 5G Gateway |
5. | CHALLENGES FOR MMWAVE 5G MATERIALS AND COMPONENTS |
5.1. | Low-loss materials for 5G |
5.1.1. | Overview of the high level requirements for high frequency operation |
5.1.2. | Dielectric constant: benchmarking different substrate technologies |
5.1.3. | Effect of low dielectric constant (I): feature sizes |
5.1.4. | Effect of low dielectric constant (II): thinness |
5.1.5. | Loss tangent: benchmarking different substrate technologies |
5.1.6. | Loss tangent: stability vs frequency for different substrates |
5.1.7. | Dielectric constant and loss tangent stability: behaviour at mmWave frequencies and higher |
5.1.8. | Temperature stability of dielectric constant: benchmarking organic substrates |
5.1.9. | Moisture uptake: benchmarking different substrate technologies |
5.2. | Radio frequency (RF) Front-end module and optical components |
5.2.1. | Trend in 5G: Radio Frequency devices moves to new materials and technologies |
5.2.2. | Radio frequency front end module (RF FEM) |
5.2.3. | Density of components in RFFE |
5.2.4. | RF module design architecture |
5.2.5. | Trend in 5G: antennas integrated with mmWave RFFE |
5.2.6. | Key players for RF FEM (smartphone) by the component types |
5.2.7. | RF FEM suppliers for LTE-advanced smartphone |
5.2.8. | Case study: Qorvo's GaN RF FEMs for mmWave |
5.2.9. | Case study: Qualcomm 5G NR Modem-to-Antenna module |
5.2.10. | Case study: MediaTek RFFE solution for 5G NR sub-6 GHz |
5.2.11. | Optical devices key players and their market share |
5.2.12. | Optical transceiver module supply chain and key players |
5.2.13. | Case study: SK Telecom 5G 5G-PON to reduce the use of fiber |
5.3. | mmWave 5G filters |
5.3.1. | Filter technologies that can work at mmWave 5G and which one will be the future |
5.3.2. | Challenge and requirements for filters to work at mmWave 5G |
5.3.3. | SAW and BAW filters are incumbent technologies but not suitable for mmWave 5G |
5.3.4. | What are waveguide filters and their pros and cons |
5.3.5. | What are transmission lines filter and overview of different technologies |
5.3.6. | Substrate integrated waveguide filters (SIW) |
5.3.7. | Single-layer transmission-line filters on PCB |
5.3.8. | Single-layer transmission-line filters on ceramic |
5.3.9. | Other substrate options: thin or thick film and glass |
5.3.10. | Multilayer low temperature co-fired ceramic (LTCC) filters |
5.3.11. | Multilayer LTCC: production challenge |
5.3.12. | Examples of multilayer LTCC from key suppliers |
5.3.13. | Benchmarking different transmission lines filters |
5.4. | mmWave 5G Power amplifier |
5.4.1. | The choice of the semiconductor technology for power amplifiers |
5.4.2. | Key semiconductor properties |
5.4.3. | GaN to win in sub-6 GHz 5G |
5.4.4. | GaN is promising for mmWave 5G power amplifiers |
5.4.5. | GaAs vs GaN for RF power amplifiers |
5.4.6. | GaAs vs GaN: power density and footprint |
5.4.7. | GaAs vs GaN: reliability and dislocation density |
5.4.8. | Why GaN and GaAs both have their place? |
5.4.9. | Power vs frequency map of power amplifier technologies |
5.4.10. | GaN-on-Si, SiC or Diamond for RF |
5.4.11. | Summary of RF GaN Suppliers |
5.4.12. | Semiconductor choice forecast |
5.4.13. | Semiconductor forecast (2020-2030) for amplifiers (GaN, LDMOS, SiGe/Si) by die area |
5.5. | Ink-based conformable package-level electromagnetic interference shielding |
5.5.1. | What is electromagnetic interference shielding and why it matters to 5G |
5.5.2. | Challenges and key trends for EMI shielding for 5G devices |
5.5.3. | Package-level EMI shielding |
5.5.4. | Conformal coating: increasingly popular |
5.5.5. | Has package-level shielding been adopted? |
5.5.6. | Examples of package-level shielding in smartphones |
5.5.7. | Which suppliers and elements have used EMI shielding? |
5.5.8. | Overview of conformal shielding process |
5.5.9. | What is the incumbent process for PVD sputtering? |
5.5.10. | Screen printed EMI shielding: process and merits |
5.5.11. | Spray-on EMI shielding: process and merits |
5.5.12. | Suppliers targeting ink-based conformal EMI shielding |
5.5.13. | Henkel: performance of EMI ink |
5.5.14. | Duksan: performance of EMI ink |
5.5.15. | Ntrium: performance of EMI ink |
5.5.16. | Clariant: performance of EMI ink |
5.5.17. | Fujikura Kasei: performance of EMI ink |
5.5.18. | Spray machines used in conformal EMI shielding |
5.5.19. | Particle size and morphology choice |
5.5.20. | Ink formulation challenges: thickness and Ag content |
5.5.21. | Ink formulation challenges: sedimentation prevention |
5.5.22. | EMI shielding: inkjet printed particle-free Ag inks |
5.5.23. | EMI shielding: inkjet printed particle-free Ag inks |
5.5.24. | Agfa: EMI shielding prototype |
5.5.25. | Has there been commercial adoption of ink-based solutions? |
5.5.26. | Compartmentalization of complex packages is a key trend |
5.5.27. | The challenge of magnetic shielding at low frequencies |
5.5.28. | Value proposition for magnetic shielding using printed inks |
5.6. | 5G Thermal management |
5.6.1. | TIM considerations |
5.6.2. | Properties of Thermal Interface Materials |
5.6.3. | TIM forecast for 5G |
5.6.4. | Thermal considerations for cell towers and base stations |
5.6.5. | Thermal considerations for small cells |
5.6.6. | Board-level heat dissipation: thermal interface materials |
5.6.7. | Indium foils as a good board-level TIM option |
5.6.8. | Thermal management for antennas |
5.6.9. | Thermal management for smartphone: typical path for heat |
5.6.10. | Thermal management for smartphone: thermal throttling |
5.6.11. | Thermal management for smartphone: Materials selection |
5.6.12. | Thermal management for smartphone: Heat dissipation |
5.6.13. | Thermal management for smartphone: Heat sinks and heat spreaders |
5.6.14. | Thermal management for smartphone: Heat pipes/ vapour chambers |
5.6.15. | Thermal management for smartphone: Vapour chambers OEMs |
5.6.16. | Thermal management for smartphone: Thermoelectric Cooling (TEC) |
5.6.17. | Smartphone cooling now and in the future |
5.6.18. | Smartphone thermal interface material (TIM) estimate summary |
5.6.19. | Thermal interface material and heat spreader forecast in smartphones by area |
6. | 5G VERTICAL APPLICATIONS BEYOND MOBILE |
6.1. | 5G for consumers |
6.1.1. | 5G for TV service and internet at home |
6.1.2. | 5G for XR (AR and VR) |
6.1.3. | Computers integrated with 5G connectivity |
6.1.4. | 5G for AR sports viewing platform based on cloud computing |
6.1.5. | 5G cloud game streaming |
6.1.6. | 5G for connected plane |
6.1.7. | LiFi: complementary to 5G system |
6.1.8. | Other 5G use cases |
6.1.9. | Case study: Vodafone 5G live commercial network |
6.2. | 5G for healthcare |
6.2.1. | 5G for automation: remote surgery |
6.2.2. | Case study: China Mobile 5G for remote medical services |
6.2.3. | Case study: Smart Cyber Operating Theater (SCOT) |
6.3. | 5G for industrial |
6.3.1. | 5G smart manufacturing overview |
6.3.2. | 5G for Industrial Internet of Things (IIoT) |
6.3.3. | Selected use cases of 5G in future factory |
6.3.4. | 5G alliance for connected industries and automation (5G ACIA) |
6.3.5. | Connectivity options for IoT |
6.3.6. | 5G for connected industries |
6.3.7. | Case study: 5G for Industry 4.0 in Nokia Factory |
6.3.8. | Case study: Nokia Future X architecture |
6.3.9. | Case study: Nokia automated harbour operation |
6.3.10. | Case study: Ericsson 5G for smart manufacturing |
6.3.11. | Case study: NTT docomo smart construction powered by 5G & IoT |
6.4. | 5G for autonomous driving and C-V2X |
6.4.1. | Why Vehicle-to-everything (V2X) is important for future autonomous vehicles |
6.4.2. | Two type of V2X technology: Wi-Fi vs cellular |
6.4.3. | Regulatory: Wi-Fi based vs C-V2X |
6.4.4. | C-V2X assist the development of smart mobility |
6.4.5. | How C-V2X can support smart mobility |
6.4.6. | C-V2X includes two parts: via base station or direct communication |
6.4.7. | C-V2X via base station: vehicle to network (V2N) |
6.4.8. | 5G technology enable direct communication for C-V2X |
6.4.9. | Architecture of C-V2X technology |
6.4.10. | Use cases and applications of C-V2X overview |
6.4.11. | C-V2X for automated driving use case |
6.4.12. | Use cases of 5G NR C-V2X for autonomous driving |
6.4.13. | Other use cases |
6.4.14. | Case study: 5G to provide comprehensive view for autonomous driving |
6.4.15. | Case study: 5G to support HD content and driver assistance system |
6.4.16. | Timeline for the deployment of C-V2X |
6.4.17. | Progress so far |
6.4.18. | Landscape of supply chain |
6.4.19. | 5G for autonomous vehicle: 5GAA |
6.4.20. | Ford C-V2X from 2022 |
7. | ROADMAP AND IMPLEMENTATION |
7.1. | 5G roadmap and timeline: finalising standardisation |
7.2. | 5G deployment: standalone vs non-standalone |
7.3. | 5G deployment options and migration strategy |
7.4. | Different deployment types in the same network |
7.5. | Technical comparison of NSA and SA 5G |
7.6. | Economic comparison of NSA and SA 5G |
7.7. | 5G migration strategies for some key players |
7.8. | Overview of global 5G roll-out |
7.9. | Global 5G roll-out outlook |
7.10. | Charges for 5G mobile service |
7.11. | Considerations in deployment of 5G network |
7.12. | What do we expect for 5G |
7.13. | 5G in USA |
7.14. | 5G in China: overview |
7.15. | Base station in China by Telecoms |
7.16. | Base station in China by Cities |
7.17. | 5G in China: 5G station deployment forecast 2020-2030 |
7.18. | 5G impact in Chinese economic |
7.19. | 5G investment in China |
7.20. | 4G still dominates the Chinese telecom investment in 2019 |
7.21. | 5G in Europe |
7.22. | 5G in South Korea |
7.23. | 5G in South Korea: KT case study |
7.24. | 5G in Japan |
7.25. | 5G in Canada |
7.26. | 5G in Australia |
7.27. | 5G in The Philippines |
7.28. | Challenges and future |
8. | NB-IOT AND LTE-M |
8.1. | 5G now incorporates NB-IoT and LTE-M |
8.2. | Global deployment of NB-IoT and LTE-M |
8.3. | Key players |
8.4. | NB-IoT revenue 2018-2030 |
8.5. | NB-IoT module shipment 2018-2030 |
8.6. | NB-IoT, eMTC and 5G will cover different aspects |
8.7. | Comparison to other LPWAN technologies |
8.8. | NB-IoT is a better solution for LPWAN |
8.9. | Porters five force analysis of the LPWAN industry |
8.10. | LTE-M vs NB-IoT |
8.11. | Huawei & Vodafone leading the way in NB-IoT |
8.12. | Examples of companies partnering with Huawei on NB-IoT |
8.13. | Inside the Vodafone NB-IoT open lab |
8.14. | T-Mobile rolls the dice on NB-IoT |
8.15. | NB-IoT driven by the Chinese market |
8.16. | ARM backs NB-IoT |
8.17. | NB-IoT networks can be deployed by using the existing sites |
8.18. | Target market segments for NB-IoT |
8.19. | Use cases of NB-IoT: B2G (government) |
8.20. | Use cases of NB-IoT: B2B (1) |
8.21. | Use cases of NB-IoT: B2B (2) animal tracking |
8.22. | Use cases of NB-IoT: B2B (3) logistics tracking |
8.23. | Use cases of NB-IoT: B2C |
8.24. | Use cases of LTE-M: smartwatch industry |
8.25. | Case study: T-Mobile trial of NB-IoT for smart city |
8.26. | Examples of NB-IoT modules |
8.27. | Case study: Quectel LTEBG96 system on a chip |
8.28. | Hurdles to NB-IoT rollout |
8.29. | NB-IoT/LTE-M global implementation |
8.30. | NB-IoT trials |
8.31. | Examples of Cellular operators trialling or deploying NB-IoT |
8.32. | The first commercial NB-IoT network launches in Europe |
8.33. | LTE-M rolls out in America |
8.34. | Case study: China Mobile IoT |
8.35. | NB-IoT innovators: 500+ |
9. | 5G MARKET FORECAST |
9.1. | 5G forecast by services |
9.1.1. | Forecast methodology |
9.1.2. | 5G market forecast for services 2018-2030 |
9.1.3. | 5G subscription to mobile service by geography 2018-2030 |
9.1.4. | 5G mobile shipment units 2018-2030 |
9.1.5. | Fixed wireless access service revenue 2018-2030 |
9.1.6. | Shipment of customer promised equipment and hotspots by units 2018-2030 |
9.1.7. | NB-IoT revenue 2018-2030 |
9.1.8. | NB-IoT module shipment 2018-2030 |
9.2. | 5G forecast by infrastructure |
9.2.1. | Forecast methodology |
9.2.2. | 5G station number forecast (2020-2030) by region |
9.2.3. | 5G station installation forecast (2020-2030) by frequency |
9.2.4. | 5G station instalment number forecast (2020-2030) by type of cell (macro, micro, pico/femto) |
9.3. | 5G forecast by infrastructure components and materials |
9.3.1. | Power amplifier and beamforming component forecast |
9.3.2. | MIMO size forecast (2020-2030) |
9.3.3. | Antenna elements forecast |
9.3.4. | Antenna PCB material forecast |
9.3.5. | Thermal interface material and heat spreader forecast in smartphones by area |
10. | COMPANY PROFILES |
10.1. | Huawei: Overview |
10.2. | Huawei: ten year revenue, market segments and geography |
10.3. | Huawei core suppliers and their products for Huawei |
10.4. | Nokia: Overview |
10.5. | Nokia: ten year revenue, market segments and geography |
10.6. | Nokia 5G technologies |
10.7. | Ericsson: overview |
10.8. | Ericsson: ten year revenue, market segments and geography |
10.9. | Ericsson: history from AXE to 5G |
10.10. | Ericsson: FDD and spectrum sharing |
10.11. | ZTE: 5G Overview (1) |
10.12. | ZTE: 5G Overview (2) |
10.13. | Samsung: 5G overview |
10.14. | Samsung: 5G Access solutions for SK telecom |
10.15. | Qualcomm: overview |
10.16. | Qualcomm: ten year revenue, market segments and geography |
10.17. | Qualcomm: use cases overview |
10.18. | Qualcomm: 5G devices / infrastructure overview |
10.19. | 5G and NB-IoT in Qualcomm |
10.20. | Qualcomm for IoT |
10.21. | Intel: Overview |
10.22. | Intel: ten year revenue, market segments and geography |
10.23. | Qorvo: overview |
10.24. | Qorvo: 5G products |
10.25. | Qorvo: ten year revenue, market segments and geography |
10.26. | Qorvo sub-6 GHz products |
10.27. | Qorvo mmWave products |
10.28. | Qorvo and Gapwaves mmWave antenna |
10.29. | Qorvo 39 GHz antenna |
10.30. | Skyworks Solutions: overview |
10.31. | Skyworks solution : ten year revenue and geography |
10.32. | NXP Semiconductors: overview |
10.33. | NXP: ten year revenue, market segments and geography |
10.34. | NXP Semiconductor |
10.35. | NXP Semiconductor |
10.36. | MediaTek: 5G overview |
10.37. | NEC: 5G overview |
10.38. | NEC: 5G vertical business platform |
10.39. | China Mobile: 5G overview |
10.40. | NTT docomo: 5G overview |
10.41. | DOCOMO: patent in 5G |
10.42. | Docomo: partners for 5G |
10.43. | Docomo: partners for 5G |
10.44. | AT&T: 5G overview |
10.45. | Verizon: 5G overview |
10.46. | SK Telecom: 5G overview |
10.47. | KT Corporation: 5G overview |
10.48. | Vodafone: 5G overview |
10.49. | Orange: 5G overview |
10.50. | Telefónica: 5G overview |
10.51. | Ooredoo: 5G overview |
10.52. | Saudi Telecom Company (STC): 5G overview |