Semiconductors - IDTechEx Reports and Subscriptions

Sustainable Electronics Manufacturing 2023-2033 

The report assesses sustainable methods of electronics manufacturing. It evaluates how sustainable innovations within printed circuit boards and integrated circuits can drive forward a new era of electronics. Featuring granular market forecasts, the report covers different materials and manufacturing processes that can deliver environmental improvements in a way that is scalable and cost-effective. IDTechEx expects that within a decade, 20% of PCBs could be manufactured using more sustainable methods.
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Thin Film & Flexible Photovoltaics 2023-2033 

The future of solar technology extends far beyond silicon, with numerous alternative materials that belong to a certain class called 'thin film'. These can deliver several unique advantages such as higher efficiency indoor energy harvesting, simpler manufacturing, and potentially lower costs than conventional silicon PV. A particularly exciting opportunity is their role in powering Internet of Things devices - a rapidly growing market following the increasing smartification of home and retail electronics.
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Advanced Semiconductor Packaging 2023-2033 

A new market research report from IDTechEx, "Advanced Semiconductor Packaging 2023-2033," has been published. This report covers the latest advanced semiconductor packaging technology development trends, key player analysis, and market outlook. In addition, this report delivers a profound analysis of the semiconductor industry in general. IDTechEx draws on its data center, autonomous vehicle, 5G, and consumer electronics expertise to offer the reader with an in-depth insight of how advanced semiconductor packaging is affecting these sectors and what their future may hold.
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Perovskite Photovoltaics 2023-2033 

Perovskite photovoltaics have already demonstrated remarkable efficiencies, with new applications enabled by their low cost, thin film architecture and tuneable absorption. This IDTechEx report explores the suitability and market opportunities of perovskite PV as well as the innovation opportunities and barriers to entry. It evaluates methods to resolve the main challenge of stability, as well as manufacturing methods and requirements for speciality materials.
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Thermal Management for 5G 2022-2032 

5G deployment is in full swing with continued deployment of infrastructure and 5G compatible devices. However, there are still many challenges to address with many material level challenges around thermal management. This report considers the evolution of 5G antenna design and components to analyse trends in semiconductor technology, the associated die attach materials, power supplies and thermal interface materials. Current and emerging technologies are described along with forecasts across these categories through to 2032.
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Automotive Radar 2022-2042 

IDTechEx estimates that today over 50% of new vehicles are shipped with radar, making it a key sensor. Start-ups such as Arbe, Metawave and Oculii are achieving new performance heights, while established suppliers such as Continental, Infineon and NXP are going through a key semiconductor transition. As high levels of autonomy and active safety become more common, IDTechEx's forecast show a radar market 10-year CAGR of 14%.
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Power Electronics for Electric Vehicles 2022-2032 

Electric vehicles are taking the world by storm with BEV and PHEV cars expected to grow at 25% CAGR through 2032. Advancements to automotive power electronics are critical for improving range and charging times. The new IDTechEx report provides analysis and forecasts for three key devices: inverters, onboard chargers (OBC), and DC-DC converters, split by voltage (including 800V) and semiconductor technology (silicon carbide SiC MOSFET and silicon Si IGBTs).
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Electrically Conductive Adhesives 2022-2032: Technologies, Markets, and Forecasts 

Electrically conductive adhesive (ECAs) are a competitor to solder. ECAs are set to become a key conductive joining technology across several industries, such as flexible electronics, in-mold electronics, and wearable technologies. This report includes key insights and commercial outlooks for the global electrically conductive adhesive market. The report considers electrically conductive adhesives (ECAs), including isotropic conductive adhesives (ICAs), anisotropic conductive pastes (ACPs) and anisotropic conductive films (ACFs). 10-year ECA market forecasts are given for each application area.
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Emerging Image Sensor Technologies 2021-2031: Applications and Markets 

The market for emerging image sensors technologies includes hybrid image sensors, event-based vision, large-area solution-processable photodetectors, flexible x-ray detectors, hyperspectral imaging and extended range silicon detectors, which should both reduce costs and enable adoption within new applications. The report outlines the emerging image sensor landscape, providing an extensive technical and commercial assessment along with market forecasts.
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Micro-LED Displays 2021-2031: Technology, Commercialization, Opportunity, Market and Players 

This report provides a detailed technological analysis with available options and emerging possibilities across the whole manufacturing process, from epitaxy, chip manufacturing, mass transfer and assembly, bonding and interconnection, testing, defect management, repair, light management, full colour realization, to backplane and driving. With addressing the challenges and opportunities, together with the supply chain evaluation, market status assessment & prediction, and player activity analysis, it helps the readers to make better strategic decisions, to find the best technological road map, to seek commercialization and new business opportunities, to know reliable partners, to track the activities of key players, and to get the latest industry progress.
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Flexible Hybrid Electronics 2020-2030: Applications, Challenges, Innovations and Forecasts 

This IDTechEx Research report covers all aspects of Flexible Hybrid Electronics, including an assessment of the enabling technologies and challenges, over 30 prototype case studies, technology adoption roadmaps, and detailed market forecasts. FHE is set to disrupt the existing electronics landscape, finally realizing the vision of ubiquitous electronics and facilitating novel applications. The trends, forecasts and innovation opportunities outlined in this report provide a roadmap to this transition.
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Die Attach Materials for Power Electronics in Electric Vehicles 2020-2030 

This report investigates the market for various die and substrate attach materials used in power electronics in various electric vehicles. It builds a detailed quantitative model to forecast the addressable market size for die as well as substrate attach materials in various power electronic functions in all manners of electric vehicles. It also develops ten-year market forecasts, in value and mass, segmenting the market by material type. The materials considered herein include nano silver sintering, micro-silver sintering, Cu sintering, SAC and other solders, and transient liquid phase bonding materials.
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