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1. | INTRODUCTION |
1.1. | Carbon Nanotubes |
1.1. | Structure of single-wall carbon nanotubes |
1.2. | The chiral vector is represented by a pair of indices (n, m). T denotes the tube axis, and a1 and a2 are the unit vectors of graphene in real space |
1.2. | Graphene |
2. | PROPERTIES |
2.1. | Properties of CNTs |
2.1. | Charge carrier mobility of carbon nanotubes compared with alternatives |
2.1. | Atomic Force Microscope image of carbon nanotubes before and after processing. |
2.2. | Potential applications are flexible solar cells, displays and touch screens. |
2.2. | Typical Sheet Resistivity figures for conductors |
2.2. | Metallic/semiconducting CNT separation |
2.3. | CNTs as conductors |
2.3. | Comparison of the main options for semiconductors |
2.3. | Targeted applications for carbon nanotubes by Eikos |
2.4. | Conductance in ohms per square for the different printable conductive materials, at typical thicknesses used, compared with bulk metal |
2.4. | Properties of carbon nanotubes compared with graphene |
2.4. | Comparison to other conductors |
2.5. | Comparison to other semiconductors |
2.6. | Properties of graphene |
2.7. | Creating a band gap in graphene |
3. | MANUFACTURE |
3.1. | Manufacture of CNTs |
3.1. | Traditional CNT film processes are complex |
3.1.1. | Arc Method |
3.1.2. | Laser Ablation Method |
3.1.3. | Chemical Vapor Deposition (CVD) |
3.2. | Manufacture of Graphene |
3.2.1. | Scotch tape method |
3.2.2. | Epitaxial Graphene - grown on silicon-carbide crystals |
3.2.3. | Expanded Graphene |
3.2.4. | Templated growth |
3.2.5. | Other Approaches |
3.2.6. | New Process from UCSB - LPCVD |
4. | APPLICATIONS |
4.1. | Developers of Carbon Nanotubes for Printed Electronics |
4.1. | Developers of Carbon Nanotubes for Printed Electronics |
4.1. | New printable elastic conductors made of carbon nanotubes are used to connect OLEDs in a stretchable display that can be spread over a curved surface |
4.2. | Stretchable mesh of transistors connected by elastic conductors |
4.2. | Main applications of conductive inks and some major suppliers today |
4.2. | Printing Carbon Nanotubes and Graphene |
4.2.1. | Latest progress |
4.3. | Conductors |
4.3. | Comparison of some of the main options for the semiconductors in printed and potentially printed transistors |
4.3. | Hybrid graphene-carbon nanotube G-CNT conductors |
4.3.1. | Deposition technologies and main applications |
4.3.2. | Latest progress with CNT conductors |
4.3.3. | Challenges |
4.3.4. | First commercialisation of Graphene based ink by MWV |
4.4. | Anti tamper / theft packaging thanks to graphene based ink |
4.4. | Comparison of the three types of capacitor when storing one kilojoule of energy. |
4.4. | Semiconductors |
4.5. | Transistors |
4.5. | Traditional geometry for a field effect transistor |
4.5.1. | CNT Transistors |
4.5.2. | Graphene Transistors |
4.5.3. | Challenges |
4.6. | CNT Transistors through Specialized Printing Processes from NEC Corporation |
4.6. | OLEDs and flexible displays |
4.6.1. | Latest progress |
4.6.2. | Surface-Mediated Cells, SMCs |
4.7. | Lighting |
4.7. | IBM has patterned graphene transistors with a metal top-gate architecture (top) fabricate on 2-inch wafers (bottom) created by the thermal decomposition of silicon carbide. |
4.8. | Carbon nanotube Field Effect transistors |
4.8. | Energy storage devices |
4.8.1. | Batteries |
4.8.2. | Supercapacitors |
4.9. | Photovoltaics |
4.9. | Epitaxial graphene FETs on a two-inch wafer scale |
4.9.1. | Organic Photovoltaics |
4.9.2. | Hybrid organic-inorganic photovoltaics |
4.9.3. | Infrared solar cells |
4.9.4. | CNT Solar Cell |
4.9.5. | Photodiode |
4.10. | An enlarged photo of a several-millimeter square chip with graphene transistors. The graphene transistors can be seen in the enlarged photo of the tips of the two electrodes |
4.10. | NRAM data storage device |
4.11. | Sensors and Smart Textiles |
4.11. | An LSI mounted on a flexible substrate by using CNT bumps |
4.12. | Two types of OLED construction |
4.12. | TCF for Touch Screens |
4.13. | Thin film speakers |
4.13. | CNT networks for flexible displays |
4.14. | Surface mediated cells |
4.14. | CNTs for Touch Screens |
4.15. | Graphene for Touch Screens |
4.15. | ANI: proof of concept CNT lamp |
4.16. | Internal structure of Power Paper Battery. |
4.17. | Proposed battery design from UCLA |
4.18. | Energy density vs power density for storage devices |
4.19. | The carbon nanotube supercapacitor versus batteries and traditional capacitors |
4.20. | The process. The resulting film is photographed atop a color photo to show its transparency |
4.21. | Georgia Tech Research Institute (GTRI) scientists have demonstrated an ability to precisely grow "towers" composed of carbon nanotubes atop silicon wafers. The work could be the basis for more efficient solar power for soldiers in |
4.22. | Flinders University prototype CNT solar cell |
4.23. | A three-terminal memory cell based on suspended carbon nanotubes: (a) nonconducting state '0', (b) conducting state '1', and (c) Nantero's NRAM™. |
4.24. | Stanford ultra-stretchy skin-like pressure sensor |
4.25. | The main options for organic sensors |
4.26. | Four scanning electron microscope images of the spinning of carbon nanotube fibres |
4.27. | Photographs of CNT-cotton yarn. (a) Comparison of the original and surface modified yarn. (b) 1 meter long piece as made. (c) Demonstration of LED emission with the current passing through the yarn. |
4.28. | Thin, almost transparent sheets of multi-wall (MWNT) nanotubes are connected to an electrical source, which rapidly heats the nanotubes causing a pressure wave in the surrounding air to produce sound. |
4.29. | The CNT thin film was put on a flag to make a flexible flag loudspeaker |
4.30. | Carbon nanotube thin film loudspeakers |
4.31. | Seoul National University Graphene-PVDF loudspeaker |
4.32. | An electron microscope image of a hybrid electrode developed at Rice University shows solid connections after 500 bends. The transparent material combines single-atom-thick sheets of graphene and a fine mesh of aluminum nanowire o |
4.33. | Left: A transparent graphene film transferred on a 35-inch PET sheet. Right: A graphene-based touchscreen panel connected to a computer |
5. | COMPANY PROFILES |
5.1. | Main Suppliers of Carbon Nanotubes, Graphene and Related Materials |
5.1. | Hormone Sensing using CNT Printed Integrated Circuits |
5.1. | Aneeve Nanotechnologies LLC, USA |
5.2. | Angstron Materials LLC., USA |
5.2. | ANI: proof of concept CNT lamp |
5.2. | Baytubes product specifications |
5.3. | Results of pulse-heat CVD |
5.3. | Fully printed CNT FET-based switch |
5.3. | Applied Nanotech, USA |
5.4. | Arry International Group, Hong Kong |
5.4. | Fully printed TFT device schematic |
5.4. | Characteristics of the CNT-FED compared with LEDs |
5.5. | Transparent conductive material roadmap: Gen 1 at the moment; Gen 2 is the goal for end of 2010, Gen 3 is the long term target |
5.5. | BASF, Germany |
5.6. | Bayer MaterialScience, Germany |
5.6. | Directly produced prepatterned films |
5.7. | Cap-XX supercapacitor technology with carbon coating. |
5.7. | Berkeley Lab, USA |
5.8. | Brewer Science, USA |
5.8. | Layout of CNT-FE BLU fabricated through pulse |
5.9. | Schematic illustration of experimental setup |
5.9. | Cabot Corp., USA |
5.10. | Canatu Ltd., Finland |
5.10. | Illustrations of micro-patterned cathodes |
5.11. | SEM images of CNTs on Samples C, D and E |
5.11. | Carben Semicon Ltd, Russia |
5.12. | Carbon Solutions, Inc., USA |
5.12. | Field emission properties of CNT-emitters patterned on a glass substrate by pulse-heat CVD. Luminescence images from the backsides of the cathode at various applied voltages are indicated in inset. |
5.13. | SEM images of CNTs on the micro-patterned electrodes with interline spacing (a) 20, (b) 50, (c) 100 and (d)200 !m (top view). |
5.13. | CarboLex, Inc., USA |
5.14. | Cap-XX Australia |
5.14. | CNT Ink Production Process |
5.15. | Target application areas of Eikos |
5.15. | Case Western Reserve University, USA |
5.16. | Catalyx Nanotech Inc. (CNI), USA |
5.16. | IBM has patterned graphene transistors with a metal top-gate architecture (top) fabricate on 2-inch wafers (bottom) created by the thermal decomposition of silicon carbide. |
5.17. | The graphene microchip mostly based on relatively standard chip processing technology |
5.17. | CheapTubes, USA |
5.18. | Chengdu Organic Chemicals Co. Ltd. (Timesnano), China |
5.18. | Cncept version of the photoelectrochemical cell |
5.19. | This filament containing about 30 million carbon nanotubes absorbs energy from the sun |
5.19. | CNano Technology Ltd, USA |
5.20. | Cornell University, USA |
5.20. | Density gradient ultracentrifugation |
5.21. | Color pixel; 3mm, display area; 48mm x480mm |
5.21. | CSIRO, Australia |
5.22. | C3Nano, Inc., USA |
5.22. | Color pixel; 1.8mm, display area; 57.6mm x 460.8mm. |
5.23. | A prototype display of digital signage. |
5.23. | Dainippon Screen Mfg. Co., Ltd., Japan |
5.24. | DuPont Microcircuit Materials (MCM), USA |
5.24. | Application images of public displays. |
5.25. | Schematic structure of CNT-FED using line rib spacer. |
5.25. | Durham Graphene Sciences |
5.26. | Eden Energy Ltd., Australia |
5.26. | Phosphor-dot pattern and conductive black-matrix pattern. |
5.27. | An application on the information desk. The color pixel pitch were 3mm(left) and 1.8mm (right). |
5.27. | Eikos, USA |
5.28. | Focus Metals |
5.28. | A photograph of a displayed color character pattern in two lines. The color pixel pitch was 1.8mm. |
5.29. | SEM images of CNT deposited metal electrode.(a) A photograph of the CNT deposited metal frame. (b) SEM image; boundary of barrier area. (c) SEM image; surface of the CNT layer. (d) SEM image; a surface morphology of CNT. |
5.29. | Frontier Carbon Corporation (FCC), Japan |
5.30. | Fujitsu Laboratories, Japan |
5.30. | One of prototype displays on the vending machine. The display was under field-testing in out-door. The CNT-FED and display module were under testing continuously during ca.15months in Osaka-city up to date, and they were still con |
5.31. | A photograph of driving system. A solar cell and the charging controller, yellow small battery and CNT-FED module. |
5.31. | Future Carbon GmbH, Germany |
5.32. | Georgia Tech Research Institute (GTRI), USA |
5.32. | A photograph of a displayed color character which was driven by solar cell and small battery. The color pixel pitch was 1.8mm. |
5.33. | High density SWCNT structures on wafer-scale flexible substrate. |
5.33. | Grafen Chemical Industries (GCI) |
5.34. | Grafoid |
5.34. | SEM micrographs of assembled SWNT structures on a soft polymer surface. (a) Patterned SWNT arrays on parylene-C substrate; (b) high magnification view of a typical central area; (c) SWNT micro-arrays that are 4 μm wide with 5 μm s |
5.35. | A new method for using water to tune the band gap of the nanomaterial graphene |
5.35. | GRAnPH Nanotech |
5.36. | Graphene Energy Inc., USA |
5.36. | A mesh of carbon nanotubes supports one-atom-thick sheets of graphene that were produced with a new fluid-processing technique. |
5.37. | A three-terminal single-transistor amplifier made of graphene |
5.37. | Graphene Frontiers |
5.38. | Graphene Industries Ltd., UK |
5.38. | CNT films from Rutgers University |
5.39. | Printed CNT transistor |
5.39. | Graphene Laboratories |
5.40. | Graphene Square |
5.40. | A 16 bit HF RFID inlay |
5.41. | The one bit commercial display tag |
5.41. | Graphene Technologies (GT) |
5.42. | Graphenea |
5.42. | Graphene OPV |
5.43. | The resulting film is photographed atop a color photo to show its transparency |
5.43. | Graphensic |
5.44. | Hanwha Nanotech Corporation, Korea |
5.44. | Fabrication steps, leading to regular arrays of single-wall nanotubes (bottom) |
5.45. | The colourless disk with a lattice of more than 20,000 nanotube transistors in front of the USC sign |
5.45. | Harbin Mulan |
5.46. | HDPlas |
5.46. | Thin, almost transparent sheets of multi-wall (MWNT) nanotubes are connected to an electrical source |
5.47. | HeJi, Inc., China |
5.48. | Helix Material Solutions Inc., USA |
5.49. | Hodogaya Chemical Co., Ltd., Japan |
5.50. | Honda Research Institute USA Inc. (HRI-US), USA |
5.51. | Honjo Chemical Corporation, Japan |
5.52. | HRL Laboratories, USA |
5.53. | Hyperion Catalysis International, Inc. |
5.54. | IBM, USA |
5.55. | Intelligent Materials PVT. Ltd. (Nanoshel), India |
5.56. | Lawrence Berkeley National Laboratory, USA |
5.57. | Massachusetts Institute of Technology (MIT), USA |
5.58. | Max Planck Institute for Solid State Research, Germany |
5.59. | MER Corporation, USA |
5.60. | Mitsui Co., Ltd, Japan |
5.61. | Mknano, Canada |
5.62. | Nano-C, USA |
5.63. | NanoCarbLab (NCL), Russia |
5.64. | Nano Carbon Technologies Co., Ltd. (NCT) |
5.65. | Nanocomb Technologies, Inc. (NCTI), USA |
5.66. | Nanocs, USA |
5.67. | Nanocyl s.a., Belgium |
5.68. | NanoIntegris, USA |
5.69. | NanoLab, Inc., USA |
5.70. | NanoMas Technologies, USA |
5.71. | Nano-Proprietary, Inc., USA |
5.72. | Nanoshel, Korea |
5.73. | Nanostructured & Amorphous Materials, Inc., USA |
5.74. | Nanothinx S.A. , Greece |
5.75. | Nantero, USA |
5.76. | National Institute of Advanced Industrial Science and Technology (AIST), Japan |
5.77. | National Institute of Standards & Technology (NIST), USA |
5.78. | NEC Corporation, Japan |
5.79. | NEDO |
5.80. | New Jersey Institute of Technology (NJIT), USA |
5.81. | NineSigma Inc., USA |
5.82. | Nissha Printing, Japan |
5.83. | Noritake Co., Japan |
5.84. | North Carolina State University, USA |
5.85. | North Dakota State University (NDSU), USA |
5.86. | Northeastern University, Boston, USA |
5.87. | Optomec, USA |
5.88. | PARU, Korea |
5.89. | Pennsylvania State University, USA |
5.90. | PETEC (Printable Electronics Technology Centre), UK |
5.91. | Purdue University, USA |
5.92. | Pyrograf Products, Inc., USA |
5.93. | Quantum Materials Corp |
5.94. | Rensselaer Polytechnic Institute (RPI), USA |
5.95. | Rice University, USA |
5.96. | Rutgers - The State University of New Jersey, USA |
5.97. | Samsung Electronics, Korea |
5.98. | Sang Bo Corporation (SBK), Korea |
5.99. | SES Research, USA |
5.100. | Shenzhen Nanotechnologies Co. Ltd. (NTP) |
5.101. | Showa Denko Carbon, Inc. (SDK), USA |
5.102. | ST Microelectronics, Switzerland |
5.103. | SouthWest NanoTechnologies (SWeNT), USA |
5.104. | Sunchon National University, Korea |
5.105. | Sungkyunkwan University Advanced Institute of Nano Technology (SAINT), Korea |
5.106. | Sun Nanotech Co, Ltd., China |
5.107. | Surrey NanoSystems, UK |
5.108. | Thomas Swan & Co. Ltd., UK |
5.109. | Toray Industries, Japan |
5.110. | Tsinghua University, China |
5.111. | Unidym, Inc., USA |
5.112. | University of California Los Angeles (UCLA), USA |
5.113. | University of California, San Diego, USA |
5.114. | University of California, Santa Barbara (UCSB), USA |
5.115. | University of Central Florida, USA |
5.116. | University of Cincinnati (UC), USA |
5.117. | University of Manchester, UK |
5.118. | University of Michigan, USA |
5.119. | University of Pittsburgh, USA |
5.120. | University of Southern California (USC), USA |
5.121. | University of Stanford, USA |
5.122. | University of Stuttgart, Germany |
5.123. | University of Surrey, UK |
5.124. | University of Texas at Austin, USA |
5.125. | University of Texas at Dallas, USA |
5.126. | University of Tokyo, Japan |
5.127. | University of Wisconsin-Madison, USA |
5.128. | Vorbeck Materials Corp, USA |
5.129. | Wisepower Co., Ltd., Korea |
5.130. | XG Sciences, USA |
5.131. | XinNano Materials, Inc., Taiwan |
5.132. | Xolve |
5.133. | XP Nano Material |
5.134. | Y-Carbon |
5.135. | Zoz GmbH, Germany |
5.136. | Zyvex, Inc., USA |
6. | NETWORK PROFILES |
6.1. | CONTACT |
6.2. | Inno.CNT |
6.3. | National Technology Research Association (NTRA) |
6.4. | TRAMS - Tera-scale reliable Adaptive Memory Systems |
7. | FORECASTS AND COSTS |
7.1. | Market forecast by component type for 2012-2022 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites |
7.1. | Supercapacitors |
7.1. | Market Opportunity and roadmap for Carbon Nanotubes and Graphene |
7.2. | Costs comparison |
7.2. | Market forecast by component type for 2012-2022 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites |
7.2. | Costs Comparison of Carbon Nanotubes, Graphene and Related Materials |
7.3. | Conductance in ohms per square for the different printable conductive materials, at typical thicknesses used, compared with bulk metal |
7.3. | New focus for Printed Electronics - the importance of flexible electronics |
7.4. | Focus on invisible electronics |
7.4. | The percentage of printed and partly printed electronics that is flexible 2012-2022 |
7.5. | Evolution of printed electronics structures |
7.5. | Shakeout in organics |
7.6. | Market pull |
EXECUTIVE SUMMARY | |
APPENDIX 1: GLOSSARY | |
APPENDIX 2: IDTECHEX PUBLICATIONS AND CONSULTANCY | |
TABLES | |
FIGURES |
Pages | 328 |
---|---|
Tables | 14 |
Figures | 91 |
Companies | 100+ |
Forecasts to | 2022 |