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EXECUTIVE SUMMARY AND CONCLUSIONS | |
1. | INTRODUCTION |
1.1. | Results achieved in studies of both cost reduction and increase in sales achievable with item level RFID in the supermarket. |
1.1. | Malaysian project for Ubiquitous Sensor Networks etc |
1.1. | Roadmap for RFID 2010-2021 |
1.2. | What are printed and chipless RFID tags? |
1.2. | What is USN in Korea? |
1.2. | The main impediments to highest volume RFID |
1.3. | Ultimate potential annual global sales by 2030 of some of the most promising tagged things that have potential for up to one billion tags used yearly. |
1.3. | The attributes of the main types of chipless tag compared with silicon chip alternatives |
1.3. | Why are they needed in supply chains? |
1.3.1. | Consumer Packaged Goods (CPG) |
1.3.2. | Pharmaceuticals |
1.4. | Ultimate potential annual global sales by 2030 for some of the most promising tagged things with potential of over one billion tags yearly. |
1.4. | Where else will chipless RFID be needed? |
1.4. | Layers of logistic units |
1.4.1. | Ubiquitous Sensor Networks |
1.4.2. | Transit |
1.4.3. | Self adjusting use by date |
1.4.4. | Assets |
1.4.5. | Laundry and rented garments |
1.4.6. | Books at manufacture |
1.4.7. | Postal items |
1.4.8. | Conveyances, logistics, traffic management |
1.5. | Technologies appropriate to the different levels of tag cost and volume. |
1.5. | Silicon chips and EPCglobal |
1.5.1. | Shortcomings of silicon chip RFID |
1.5.2. | Shortcomings of Gen2 EPC - universality by tag complexity |
1.5.3. | Robustness of the layered approach backed by EPCglobal |
1.5.4. | Implications |
1.6. | Constraints on market growth |
1.6. | The adoption curve |
1.6.1. | Impediments to highest volume RFID |
1.7. | Ultimate potential |
1.7.1. | Potential for different applications |
1.7.2. | Tag price sensitivity at highest volumes |
1.7.3. | Price sensitivity curve for RFID (adoption curve) |
1.8. | The overall price-volume sensitivity envelope |
2. | PRINTED AND CHIPLESS RFID TECHNOLOGIES |
2.1. | Ten different types of chipless RFID technology |
2.1. | Principle of a SAW tag |
2.2. | SAW tag system |
2.2. | The ten types of first generation chipless RFID technologies compared. |
2.2. | Comparison - first generation |
2.3. | Commercial successes |
2.3. | Advantages and disadvantages of RFSAW devices |
2.3. | Carinthian Technical Research |
2.3.1. | Acoustomagnetic tags - error prevention |
2.3.2. | SAW tags - X-CYTE, MicroDesign, iRay Technologies, Thoronics, CTR |
2.4. | HID Barkhausen cards - secure access |
2.4. | Sensor System Development |
2.5. | CTR heavy duty SAW RFID tag |
2.5. | Lessons from the limited success or failure of other approaches |
2.6. | Electromagnetic - Flying Null, Link-Sure, Confirm Technologies, REMOSO, Holotag, Zebra Technologies, Scipher TSSI, MXT, Fuji Electric, Unitika |
2.7. | Swept RF LC array - Miyake, Lintec, CWOSRFID, Navitas, Checkpoint, TagSense, RFCode |
3. | SECOND GENERATION CHIPLESS RFID - POTENTIALLY OPEN SYSTEMS |
3.1. | The main contenders compared |
3.1. | Comparison of the main contenders |
3.1. | Layout of the ACREO ink stripe RFID |
3.2. | Main Features of the M-real/ VTT technology HidE chipless RFID and IDTechEx portrayal of a typical format for conductive ink stripes on this product and the ACREO product about 1centimeter by six centimeters. |
3.2. | Detailed comparison of second generation chipless options |
3.2. | Electromagnetic conductive ink stripe RFID - Mreal, VTT, Panipol, ACREO, Somark Innovations, Menippos, Printed Systems |
3.2.1. | New ink stripe format |
3.2.2. | Potential advantages and disadvantages vs silicon |
3.2.3. | Market thrust |
3.2.4. | Technical development |
3.2.5. | The Somark Innovations product |
3.2.6. | The Mreal/ VTT Technologies/ Panipol product |
3.2.7. | ACREO |
3.2.8. | Printechnologics (formerly Menippos) |
3.3. | Printed radar arrays, InkSure, Nicanti and Vubiq |
3.3. | Size of the application areas |
3.3. | HidE hidden Electronic Product Code production roadmap |
3.3.1. | Inksure |
3.3.2. | Nicanti |
3.3.3. | Vubiq |
3.4. | Surface Acoustic Wave - RFSAW, Thoronics |
3.4. | Conductance in ohms per square for the different printable conductive materials compared with bulk metal |
3.4. | Potential applications of HidE ink stripe RFID |
3.4.1. | Potential advantages and disadvantages vs silicon |
3.4.2. | Market thrust |
3.4.3. | Technical development |
3.4.4. | SAW Standards EPCglobal |
3.4.5. | Companies seeking SAW open systems - RFSAW, IBM Global Services, Thoronics |
3.4.6. | Case study: Highway non-stop tolling USA - RFSAW |
3.4.7. | Case study: SAW tags in space on the International Space Station |
3.5. | Thin Film Transistor Circuits (TFTCs) |
3.5. | Comparison of performance of conductive layers for RFID antennas in ohms per square meter |
3.5. | Strengths and weaknesses of HidE chipless RFID |
3.6. | Vubiq |
3.6. | Examples of ink suppliers progressing printed RFID antennas etc |
3.6. | Other |
3.6.1. | How to Eat RFID |
3.7. | Lowest cost antenna design |
3.7. | Comparison of metal etch (e.g. copper and aluminium) conductor choices |
3.7. | Planned miniature SAW tag with 2.45 GHz dipole antenna |
3.7.1. | Choice of electrodes and interconnects |
3.8. | Inorganic conductors |
3.8. | Electroless metal plate - Additive print process with weakly conductive ink (e.g. plastics or carbon) followed by wet metal plating |
3.8. | Options for interconnect, antenna and electrode materials to make high speed transistor circuits |
3.8.2. | Comparison of metal options |
3.8.3. | Polymer - metal suspensions |
3.8.4. | Silver solution |
3.9. | Progress with new conductive ink chemistries and cure processes |
3.9. | Electro metal plate - Additive print process with weakly conductive ink (e.g. plastics or carbon) followed by dry metal plating |
3.9. | InkTec soluble silver inks. Left: Transparent Electronic Ink. Right: Transparent Inkjet Inks |
3.10. | Patterning using InkTec ink |
3.10. | Printable metallic conductors cure at LT e.g. silver based ink |
3.11. | A typical process cost comparison for RFID antennas |
3.11. | Typical SEM images of CU flake C1 6000F. Copper flake |
3.12. | Novacentrix PulseForge |
3.12. | Possibilities for various new printed conductors. |
3.13. | Curing layers |
4. | THIN FILM TRANSISTOR CIRCUITS (TFTCS) |
4.1. | Potential advantages and disadvantages vs silicon |
4.1. | Envisaged benefits of TFTCs in RFID and other low-cost applications when compared with envisaged silicon chips |
4.1. | Coplanar electrode thin film transistor |
4.2. | Options for high speed, low-cost printing of TFTCs |
4.2. | Typical features demanded of high volume RFID tags |
4.2. | Technical development - geometry, carrier mobility, substrate |
4.2.1. | Transistor geometry or mobility? |
4.2.2. | The compromises in choosing substrates |
4.2.3. | TFTCs best suited for non-RFID applications in the short term? |
4.2.4. | A key limitation is frequency |
4.2.5. | Low cost not guaranteed |
4.3. | Why TFTCs will be the biggest breakthrough in electronic smart packaging |
4.3. | Probable value split of the global passive RFID market as a function of frequency, in 2016 |
4.3. | Evolving level of difficulty of substrates in creating low-cost TFTCs |
4.4. | Experimental PolyIC (formerly Siemens) 32-bit RFID smart label using printed polymer semiconductors |
4.4. | Benefits of the best TFTCs versus very small silicon chips |
4.4. | Thin film silicon vs organics or inorganics |
4.4.1. | First came thin film silicon |
4.4.2. | Organic semiconductors - two choices |
4.4.3. | PolyIC developments |
4.4.4. | Dai Nippon Printing semiconductor development |
4.4.5. | OrganicID, Weyerhauser |
4.4.6. | Power conservation - CMOS |
4.4.7. | Progress towards flexible/biodegradable substrates for organic TFTs |
4.4.8. | Move to inorganic semiconductors |
4.4.9. | Kovio - inorganic semiconductors |
4.4.10. | Carbon Nanotubes |
4.5. | The main options for the printed semiconductor |
4.5. | Overall choices of semiconductor |
4.5. | Basic setup and issues |
4.5.2. | Do organic transistors have a future? |
4.5.3. | RFID printed directly on products and packaging |
4.6. | Opportunities for active TFTC RFID |
4.6. | Typical carrier mobility in different potential TFTC semiconductors (actual and envisaged) vs higher mobility silicon, not printable. |
4.6. | Chemical structure of polymer FET |
4.6.1. | Company strategy and value chain |
4.7. | TFTC players compared |
4.7. | Comparison of some of the main options for the semiconductors in printed and potentially printed transistors |
4.7. | PolyIC integrated rectifier |
4.8. | Development of continuous printing methods by PolyIC |
4.8. | Transistors - first significant commercial product in 2009 |
4.8. | Printed memory for RFID- HP, Ricoh, Matsushita, Thin Film Electronics, Fuji Film and others |
4.9. | Objectives and challenges of organisations developing printed and potentially printed transistor and/ or memory circuits and/or their materials |
4.9. | Slides from PolyIC show their progress with printed TFTCs for RFID. |
4.10. | Printable organic semiconductors - the compromise. |
4.10. | Some of the small group of contestants for large capacity printed memory |
4.11. | Performance of Kovio's ink versus others by mobility |
4.12. | Road map |
4.13. | Requirements of organic electronics to the process |
4.14. | Requirements of organic electronics to the substrate |
4.15. | Comparison of PET - Surfaces |
4.16. | Possible film substrates |
4.17. | More possible film substrates |
4.18. | Paper as a substrate for organic electronics |
4.19. | Value chain for TFTCs and examples of migration of activity for players |
4.20. | An all-organic permanent memory transistor |
4.21. | TFE memory compared with the much more complex DRAM in silicon |
4.22. | Structure of TFE memory |
4.23. | TFE priorities for commercialisation of mega memory |
5. | DISPLAYS AND SENSORS FOR PRINTED RFID |
5.1. | Choice of displays |
5.1. | Qualities of the various display options for printed RFID |
5.1. | Experimental printed flexible polymer OLED by Dai Nippon Printing |
5.1.2. | Thermochromic |
5.1.3. | Electrochromic |
5.1.4. | Electrophoretic |
5.1.5. | Applications of E-paper displays |
5.2. | Advantages and disadvantages of electrophoretic displays |
5.2. | Choice of sensors |
5.2. | Duracell battery tester |
5.3. | Interactive game on a beer package by VTT Technologies in Finland |
5.3. | Comparison between OLEDs and E-Ink of various parameters |
5.4. | Electrochromic display on a Valentine's card sold by Marks and Spencer in the UK in 2004 and electrochromic display with drive circuits in a laminate for smart cards. |
5.5. | Principle of operation of electrophoretic displays |
5.6. | E-paper displays on a magazine sold in the US in October 2008 |
5.7. | Retail Shelf Edge Labels from UPM |
5.8. | Amazon Kindle 2, launched in the US in February 2009 |
5.9. | Electrophoretic display on a commercially sold financial card |
5.10. | Electrophoretic display combined with a UHF RFID tag (silicon chip tag) |
6. | MARKETS FOR CHIPLESS RFID 2011-2021 |
6.1. | Historical sales of chipless RFID tags |
6.1. | Historical sales of chipless tags |
6.1. | An AstraZeneca syringe with chipless RFID tag |
6.1.2. | Cumulative sales chip vs chipless |
6.2. | Chipless share of RFID market by numbers 2011-2021 |
6.2. | Cumulative global sales of RFID tags chip vs chipless/printed to end of 2009 in millions |
6.2. | Dropping prices for RFID tags |
6.3. | Projections for Real Time Locating Systems 2007-2010 |
6.3. | Deliveries of chipless/printed tags to date by company |
6.3. | Chipless RFID by technology 2011-2021 |
6.4. | Unit price trends by chipless technology 2011-2021 |
6.4. | Overall global RFID market by numbers 2010-2021 with chipless and chip share |
6.5. | Sales in billions of the main types of chipless tag 2010-2021 |
6.5. | Chipless share of total RFID market value 2011-2021 |
6.6. | Chipless vs chip share of total RFID market by value 2011-2021 |
6.6. | Unit price in cents of the various types of chipless RFID 2010-2021 |
6.7. | Market value of global sales of chipless tags by technology in millions of dollars 2010-2021 |
6.7. | RFID market by system component 2011-2021 |
6.8. | RFID market by location of tag 2011-2021 and chipless targets |
6.8. | Chipless and chip share of the total global market for RFID tags 2010-2021 |
6.9. | Total global RFID market 2010-2021 by value of tags, interrogators and other |
6.9. | Move of markets to East Asia 2011, 2016, 2021 |
6.10. | Market for EPC and other interrogators 2011-2021 |
6.10. | Number (in millions) of tags by application 2010-2021 |
6.11. | Average tag price per application in US cents 2010-2021 |
6.11. | Ultra low cost RFID labels - market size |
6.12. | RFID printed directly onto products and packaging - market size |
6.12. | Value of tags by application 2010-2021 (US Dollar Millions) |
6.13. | Total spend on RFID systems, service and tags 2011, 2016, 2021 by territory |
6.13. | Low cost active RFID - market size |
6.14. | Radiation tolerant RFID - market size |
6.14. | Market for RFID interrogators by application, US dollars billions |
6.15. | Fault tolerant RFID - market size |
6.16. | Ultra thin low cost RFID - market size |
6.17. | Real Time Locating Systems (RTLS) - market size |
7. | TIMELINES FOR PRINTED AND CHIPLESS/PRINTED RFID MARKET PENETRATION |
7.1. | Timelines for developments in second generation chipless RFID |
7.1. | Timelines for developments in second generation chipless RFID |
7.1. | PolyIC roadmap for printed RFID |
7.2. | PolyIC roadmap to success for printed organic RFID |
7.2. | Timeline for printed RFID |
7.3. | Timeline for printed organic electronics |
7.3. | DNP roadmap for plastic electronics |
7.4. | Timeline for direct printing of chipless RFID onto products and packaging |
8. | SUPPLIER AND DEVELOPER PROFILES |
8.1. | 3M, USA |
8.1. | Printed Flexible Circuits from Soligie |
8.2. | Capabilities of Soligie |
8.2. | ACREO, Sweden |
8.3. | BASF |
8.3. | Printed electronics from Soligie |
8.4. | Printing presses used for printing electronics at Soligie |
8.4. | Dai Nippon Printing |
8.5. | IBM, USA |
8.5. | An e-label from Soligie |
8.6. | A flexible display sample |
8.6. | Inksure, Israel and USA |
8.7. | Kovio USA |
8.7. | Printed electronics samples |
8.8. | M-real, Sweden |
8.9. | OrganicID, USA |
8.10. | Panipol, Finland |
8.11. | Philips |
8.12. | PolyIC, Germany |
8.13. | RFSAW, USA |
8.14. | Soligie |
8.15. | Toppan Forms |
8.16. | Toppan Printing |
8.17. | VTT Technology, Finland |
8.18. | VubiQ, USA |
APPENDIX 1: IDTECHEX PUBLICATIONS AND CONSULTANCY | |
APPENDIX 2: PRINCIPLES OF OPERATION OF FIRST GENERATION CHIPLESS RFID | |
APPENDIX 3 THE ASTRAZENECA - SCIENTIFIC GENERICS SUCCESS | |
APPENDIX 4 GLOSSARY | |
TABLES | |
FIGURES |
Pages | 282 |
---|---|
Tables | 58 |
Figures | 78 |
Case Studies | 20+ |
Forecasts to | 2021 |