3D Electronics covers all the methods of adding electronics both to 3D surfaces and incorporating them within 3D objects. This promises much greater design freedom and potentially reduced costs as assembly is substantially simplified. Other advantages include reduced weight and greater durability.
We will cover the three different approaches to 3D electronics, specifically applying electronics onto surfaces, in-mold electronics (IME) and 3D printed electronics. Applying electronics to 3D surfaces is the most developed of the three, primarily in the form of laser direct structuring (LDS). IDTechEx forecast substantial growth in printing conductive traces and mounting components directly onto 3D objects. IME is also set to become a widespread manufacturing method, primarily in the automotive sector, as it greatly simplifies the manufacture of functional interior panels. Fully 3D printed electronics is primarily used for prototyping at present, but as the process speeds up it should enable rapid on-demand manufacturing at low volumes.
This webinar includes:
- Discussion of the various approaches of manufacturing 3D electronics, their differentiating factors, readiness level, and the applications to which they are best suited.
- Case studies showing how 3D electronics can be used in many different applications.
- Overview of the latest market forecast for the different 3D-electronics categories, highlighting which techniques and applications are predicted to see the most growth over the next 10 years.
- Analysis of technological transitions and associated innovation opportunities.
More detailed information, including the full market forecasts, can be found in IDTechEx's extensive report on the topic: "3D Electronics 2020-2030: Technologies, Forecasts, Players
". This covers the three main categories of 3D electronics, along with many detailed case studies, multiple company profiles, and technological/commercial readiness assessments.