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1. | EXECUTIVE SUMMARY |
1.1. | Overview - Market Forecasts 2014-2024 |
1.1. | Ten year forecast market data for conductive inks and paste across different market segments (millions) |
1.1. | Ten year market forecast for conductive inks and paste across different market segments |
1.2. | Ten year volume forecast for conductive inks and paste across different market segments |
1.2. | Ten year forecast market data for conductive inks and paste across different market segments (tonnes) |
1.2. | Technologies |
1.3. | Markets |
1.3. | Companies developing alternatives to silver conductive inks and paste |
1.3. | Ten year volume forecast for silver flake conductive paste across different market segments |
1.3.1. | Photovoltaic Market |
1.3.2. | Touch Screen Market |
1.3.3. | Other Markets |
1.4. | Players |
1.4. | Categorizing 85 companies commercialising conductive inks and paste by technology and territory |
1.4. | Ten year market forecast for silver flake conductive paste across different market segments |
1.5. | Business landscape for silver flake conductive paste |
1.6. | Ten year volume forecast for silver nano conductive inks across different market segments |
1.7. | Ten year market forecast for silver nano conductive inks across different market segments |
1.8. | Business landscape for silver flake conductive paste |
1.9. | Historical silver price |
1.10. | Ten year forecast for number of wafers in the c-Si PV industry |
1.11. | Ten year forecast for installed capacity of solar cells globally |
1.12. | Ten year market forecast for conductive pastes/inks in the a-Si and c-Si PV industries |
1.13. | Ten year volume forecast for conductive pastes/inks in the c-Si PV industry |
1.14. | Ten year forecast for number of touch devices sold globally |
1.15. | Ten year forecast in area for touch devices sold globally |
1.16. | A typical configuration for touch screens |
1.17. | Ten year forecast for conductive paste in touch screen markets |
1.18. | Ten year volume forecast for conductive paste in touch screen markets |
1.19. | Membrane switch applications |
1.20. | Printed circuit boards |
2. | PRINTABLE CONDUCTIVE INKS- A SURVEY |
2.1. | Silver Flakes |
2.1. | Merits of silver flake inks |
2.1. | Process flow for producing silver flake conductive paste |
2.1.1. | Conductivity |
2.1.2. | Printing Technique |
2.1.3. | Cost |
2.1.4. | Target Markets |
2.1.5. | Summary (SWOT) |
2.1.6. | Players |
2.2. | General trends in silver flake inks |
2.2. | The table below lists the key players supplying various types of silver flake paste (firing and low-T types). |
2.2. | Nanoparticle Silver Ink |
2.2.1. | High Conductivity |
2.2.2. | Reduced Sintering Temperature |
2.2.3. | Enhanced Flexibility |
2.2.4. | Inkjet Printability |
2.2.5. | Improved Surface Smoothness |
2.2.6. | Material Savings |
2.2.7. | Cost |
2.2.8. | Price Parity |
2.2.9. | Production Methods |
2.2.10. | Target Markets |
2.2.11. | Summary (SWOT) |
2.2.12. | Players |
2.3. | Silver flake ink prices from 1975 |
2.3. | Silver Nanowires |
2.3. | Volume resistivity and annealing temperature of nanoparticle silver inks offered by various suppliers |
2.3.1. | Transparency |
2.3.2. | Flexibility |
2.3.3. | Conductivity |
2.3.4. | Fabrication and Printability |
2.3.5. | Target Markets |
2.3.6. | Summary (SWOT) |
2.4. | Target markets for silver flake pastes (both fired and low temperature). Target markets are categorised by volume and growth rate. |
2.4. | Company offering ink-jet printable conductive inks |
2.4. | Players |
2.5. | Silver Ion Inks |
2.5. | Parameters of each production method |
2.5. | Categorising silver nanoparticle companies by size and commercialization stage |
2.6. | Examples of printed and sintered silver nanoparticle inks |
2.6. | Main processing categories of nanoparticles |
2.6. | Copper Nanoparticles and Pastes |
2.6.1. | Variety |
2.6.2. | Annealing Methods |
2.6.3. | Target Markets |
2.6.4. | Summary (SWOT) |
2.6.5. | Players |
2.7. | Melting temperature as a function of gold particle size |
2.7. | Copper Oxide Nanoparticle Ink |
2.7. | Processing category by parameter |
2.8. | Merits of silver nanoparticle inks |
2.8. | Silver-Coated Copper Inks and Pastes |
2.8. | Nanoparticles can fill in the gaps to reduce resistivity |
2.8.1. | PDOT:PSS |
2.8.2. | SWOT Analyses |
2.8.3. | Players |
2.9. | Improving surface smoothness |
2.9. | Graphene |
2.9. | Comprehensive table comparing printing method, annealing temperature, price, resistivity, and solvent of silver nanoparticle inks offered by key players |
2.9.1. | Graphene Inks |
2.9.2. | SWOT Aanalyses |
2.9.3. | Players |
2.10. | Nanoparticle silver prices $ per kg. It is noted that there is a scatter in prices as companies offer inks ranging from 100 to 1.5/2 $/g by solid content. We think that 4.5-5 $/g is close to the market average today at reasonable |
2.10. | Merits of silver nanowires |
2.11. | Key companies working on silver nanowires |
2.11. | Categorising target markets on the basis of growth rate and volume* |
2.12. | Categorising silver nanoparticle companies by size and commercialization stage |
2.12. | Results from thermal cycle or aging test |
2.13. | Merits of copper nanoparticle inks |
2.13. | Examples of nanowire networks |
2.14. | Silver nanowires as transparent conductors |
2.14. | Companies developing copper pastes |
2.15. | SWOT analysis of PEDOTPSS and similar organic transparent conducting materials |
2.15. | Flexibility of silver nanowires |
2.16. | Conductivity depends on the concentration of silver nanowires |
2.16. | Companies developing PEDOT and other similar organic transparent conductive materials/films |
2.17. | Merits of graphene |
2.17. | Categorising target markets on the basis of growth rate and volume* |
2.18. | Silver ion ink |
2.18. | Graphene companies that offer printable inks today |
2.19. | Comparing the surface finish between a ion-silver ink (left) and a conventional ink (right). |
2.20. | Anti-reflectors used in plasma displays |
2.21. | Raw copper prices as a function of year |
2.22. | Copper nanoparticles |
2.23. | Weight loss as a function of temperature |
2.24. | Apparatus use for annealing printed Cu inks and paste using the super-steam approach |
2.25. | The growth process of crystalline Cu islands (large flakes) in the presence of reactive gas and heat |
2.26. | Comparing a photolithographic and printing process used to create a pattern on a printed circuit board |
2.27. | Categorising target markets on the basis of growth rate and volume |
2.28. | Novacentrix RFID antennas |
2.29. | Silver-coated copper particles/flakes |
2.30. | Chemical structure of PDOT:PSS |
2.31. | Schematic picture of a dispersed gel particle |
2.32. | A process flow for patterning PDOT:PSS using photolithography and CELVIOSTM etchant |
2.33. | A process flow for patterning PDOT:PSS using gravure (or screen) printing and CELVIOSTM etchant |
2.34. | Comparing the performance of ITO on foil (similar to ITO on PET) with PEDOT:PSS in 2002 |
2.35. | Optical transmission (%) as a function of wavelength for different grades of PDOT:PSS on glass |
2.36. | Improvements in performance of PDOT:PSS |
2.37. | Improvement in conductivity for PDOT:PSS has a function of year |
2.38. | Optical transmission as a function of sheet resistance for PDOT:PSS/PET films (here referred to as Baytron) compared with common ITO-on-PET films on the market |
2.39. | Optical transmission (%) of PDOT/PET and PET as a function of wavelength (screen printed PDOT) |
2.40. | Relative changes in sheet resistance as a function of number of bending cycles (bending radius 8mm) for ITO/PET and PDOT:PSS/PET films |
2.41. | Changes in sheet resistance as a function of radius of curvature for ITO/PET and PEDOT:PSS/PET films |
2.42. | Sheet resistance as a function distance from fixed point in PDOT:PSS films |
2.43. | Silver nanowires, metal mesh ad PDOT |
2.44. | Change in sheet resistance as a function of exposure time to effective sunlight |
2.45. | Trade-offs involved in choosing a graphene production technique |
2.46. | Companies having moved or moving up the value chain to offer graphene intermediary products such as inks |
2.47. | Examples of RFID and smart packing prototypes and applications by Vorbeck |
2.48. | Categorising graphene companies on the basis of their manufacturing technology |
3. | CONDUCTIVE INKS IN PHOTOVOLTAICS |
3.1. | Bankruptcies, closures, acquisitions, sales and/or restructuring |
3.1. | Average selling price for PV modules |
3.1. | The Big Picture |
3.2. | Many Different Photovoltaic Technologies |
3.2. | IDTechEx forecast of the a-Si and c-Si PV market between 2014 and 2024 |
3.2. | Key characteristics of different PV technologies |
3.3. | A range of different materials can be used as conductors |
3.3. | Number of 6 inch c-Si PV wafers installed per year 2014-2024 |
3.3. | Big Numbers are Involved |
3.4. | Crystalline Silicon |
3.4. | Typical crystalline silicon PV structure |
3.5. | Crystalline silicon 'bus bars' grid pattern |
3.5. | Printed Conductive Tracks |
3.6. | Material Set |
3.6. | The ink is spread over the squeegee and pushed through the screen printing mesh |
3.7. | The schematic process flow for printing conductive tracks on PVs |
3.7. | Market Shares for Conductive Inks |
3.8. | Market Value |
3.8. | Predicted trend for minimum as-cut wafer thickness in mass production of solar cells and minimum cell thickness in module |
3.9. | Green, yellow and red represent known, developing and unknown technologies, respectively |
3.10. | Technology share in PV metallisation sector |
3.11. | Market value for different silver ink and paste types used in the PV sector. The market for silver flake paste shrinks thanks to lower consumption per wafer and also loss of market share to plating and other methods |
3.12. | The metric volume amount of different inks/pastes used in c-Si and a-Si technologies in tonnes 2014-2024 |
4. | TOUCH SCREEN |
4.1. | A typical configuration for touch screens. Here, the edge electrodes are clearly visible. |
4.1. | The Big Picture |
4.2. | The Market Value |
4.2. | Ten year forecast for mobile phone and smart phone sales |
4.3. | Sales of standard and touch notebooks as a function of year between 2013 and 2023* |
4.4. | Tablets sales as a function of year between 2013 and 2023 |
4.5. | Sales of standard and touch monitors as a function of year between 2013 and 2023* |
4.6. | Market share by technology type 2014-2024 |
4.7. | Conductive paste market share by technology in the touch sector between 2014 and 2024 |
4.8. | Ten-year market forecast for conductive pastes into the touch sector (bezel) segmented by application |
4.9. | Ten-year market forecast for conductive pastes into the touch sector (bezel) segmented by technology |
5. | ITO REPLACEMENT |
5.1. | Benchmarking different ITO alternative solutions on the basis of sheet resistance, colour, transmission, flexibility, ease of customisation, stability, cost, etc. |
5.1. | Market Value |
5.2. | Ten-year market forecast for use of silver nanowires and silver nanoparticles, at material level, as an ITO alternative |
6. | CONDUCTIVE INKS IN RFID |
6.1. | Key characteristics of RFID devices |
6.1. | Inductive and electric antenna |
6.1. | The Big Picture |
6.2. | Material Options and Market Shares |
6.2. | Examples of HF antennas |
6.2. | Key attributes of various materials |
6.3. | Examples of UHF antennas |
6.3. | Market Value |
6.4. | The approximate cost breakdown of different components in a typical UHF RFID tag |
6.5. | IDTechEx projections of the growth in the number of RFID tags |
6.6. | Material costs for making the antenna (excludes processing and substrate costs) |
6.7. | Market share in the RFID antenna sector by ink/paste technology |
6.8. | Demand for conductive inks and pastes in tonnes in the RFID antenna market |
6.9. | Ten year market forecast for supplying ink/paste into the RFID antenna market segmented by technology |
7. | CONDUCTIVE INKS IN VEHICLES |
7.1. | Application of conductive inks in vehicles |
7.1. | Application of conductive inks in vehicles |
7.1. | The Big Picture |
7.2. | Material Set and Market Share |
7.2. | Volume demand in tonnes as a function of year for internal and external automotive applications |
7.2. | Market uptake in the medium term |
7.3. | Market share between different conductive ink/paste technologies in the automotive sector |
7.3. | Market |
7.4. | Volume demand in tonnes as a function of year for internal and external automotive applications segmented by technology |
7.5. | Ten year market forecast for conductive inks/paste in the automotive sector segmented by technology |
8. | CONDUCTIVE INKS IN SMART PACKAGING AND BRAND ENHANCEMENT |
8.1. | Attributes of the available technologies |
8.1. | Conductive inks in smart and electronic packaging |
8.1. | The Big Picture |
8.2. | Market Value |
8.2. | Market share forecasts |
8.3. | Market value of conductive inks in the smart packaging and brand enhancement market segment. Graphene and CNTs are excluded. |
9. | SENSORS |
9.1. | Electrochemical blood glucose strips |
9.2. | Ten year forecasts for printed and non-printed glucose test strips |
9.3. | Ten year forecasts for volume demand and market value for conductive inks/pastes in glucose sensors |
10. | COMPANY PROFILES |
10.1. | Screen Printable Silver Paste |
10.1. | Properties of the low-melting-point alloy before and after melting (structure and conductivity) |
10.1. | Advanced Nano Products |
10.2. | AIST and NAPRA |
10.2. | Electron microscope images of the Napra-developed copper paste (left) and of commercially available resin silver paste (right) |
10.2. | Other Silver Pastes |
10.3. | Inkjet Printable Inks |
10.3. | Resistivity of silver and copper pastes (Commercially available copper pastes: A, B, and C; Napra-developed copper paste: D; and commercially available silver paste: E) |
10.3. | Amogreentech |
10.4. | Applied Nanotech Inc. |
10.4. | Resistivity vs. cure temperature for glass-coated silver nanoparticles |
10.4. | Applied Nanotech products |
10.5. | Ferro's metal products |
10.5. | The annealing process and equipment used for Hitachi Chemical's inks and pastes |
10.5. | Asahi Glass Corporation |
10.6. | Asahi Kasei |
10.6. | Performance of Hitachi Chemical's inks compared to printed circuit board solutions |
10.6. | Outline of Noritake product list |
10.7. | Silver and carbon pastes offered by Toyobo |
10.7. | The Pulse Forge principle |
10.7. | Cabot |
10.8. | Chang Sung Corporation |
10.8. | Copper pastes developed by Toyobo |
10.8. | Performance of Hitachi Chemical's inks compared to printed circuit board solutions |
10.9. | Flexographic formulation of Vor-Ink from Vorbeck |
10.9. | Cima Nanotech |
10.10. | Ferro |
10.10. | Packaging Natralock® with Siren™ Technology |
10.11. | Harima |
10.12. | Hitachi Chemical |
10.13. | Kishu Giken Kogyo Co.,Ltd. |
10.14. | Liquid X Printed Metals, Inc. |
10.15. | Indium Corporation |
10.16. | NanoMas Technologies |
10.17. | Noritake |
10.18. | Novacentrix |
10.19. | Novacentrix PulseForge |
10.20. | Taiyo |
10.21. | Toyobo |
10.22. | Vorbeck |
11. | COMPANY INTERVIEWS |
11.1. | Agfa Materials |
11.2. | Anderlab Technologies |
11.3. | Angstron Materials |
11.4. | Applied Graphene Materials |
11.5. | Applied Materials Baccini |
11.6. | Arkema |
11.7. | Bando Chemical |
11.8. | Bayer Material Science AG |
11.9. | Blue Nano |
11.10. | Cambrios Technology |
11.11. | Colloidal Ink |
11.12. | Conductive Compounds |
11.13. | Creative Materials |
11.14. | Daicel Corporation |
11.15. | DuPont Microcircuit Materials |
11.16. | DZP Technologies |
11.17. | Fujikura Kasei |
11.18. | Genes' Ink |
11.19. | Grafen Chemical Industries |
11.20. | Graphenano |
11.21. | Graphene Technologies |
11.22. | GSI Technologies |
11.23. | Henkel |
11.24. | Heraeus |
11.25. | Incubation Alliance |
11.26. | Inkron |
11.27. | InkTec |
11.28. | Intrinsiq Materials |
11.29. | KunShan Hisense Electronics |
11.30. | Methode Electronics |
11.31. | nanoComposix |
11.32. | Nanocyl |
11.33. | Nanogap |
11.34. | NanoIntegris |
11.35. | PChem Associates |
11.36. | Poly-Ink |
11.37. | Promethean Particles |
11.38. | Showa Denko |
11.39. | SouthWest NanoTechnologies |
11.40. | Sun Chemical |
11.41. | Thomas Swan |
11.42. | T-Ink |
11.43. | Toda Kogyo Corp |
11.44. | Tokusen USA Inc |
11.45. | Ulvac |
11.46. | UT Dots |
11.47. | Xerox Research Centre of Canada |
11.48. | XG Sciences |
11.49. | Xolve |
11.50. | Xymox |
12. | GLOSSARY |
APPENDIX 1 - IDTECHEX RESEARCH REPORTS AND CONSULTANCY | |
TABLES | |
FIGURES |
Pages | 259 |
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Tables | 38 |
Figures | 121 |
Forecasts to | 2024 |