Prasanna Kulkarni is a Senior Staff Engineer at Motorola in Schaumburg, IL. He received his B.E. and M.Tech. in Materials Engineering. He received his Ph.D. in Materials Engineering from Auburn University. He joined Motorola's Manufacturing Research Center to develop advanced IC packaging and assembly solutions for next generation mobile platforms. He is presently member of the Printed Electronics Technology Group in Motorola Labs, leading the novel device design, modeling and simulation.

 

Dr. Kulkarni has authored more than 15 research publications in reputed journals, conferences and symposiums. He has 2 U.S. patents and several inventions filed while working at Motorola. He is a reviewer of IEEE Transactions on Components and Packaging Technology.