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A Contribution to the 1 Cent Tag Target - 'Printed' Copper Antenna - and on Paper

Mr David Potter, Commercial Director
Additive Process Technologies Ltd, United Kingdom
 
 
This presentation was given at RFID Europe 2007 on Sep 19, 2007.
 

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Presentation Summary

  • Is copper the optimum material - what are the choices?
  • Is 'print and etch' at its limit?
  • Addprotec's unique, 'green' low cost, high volume, precision R2R production process for high performance RFID antenna on any substrate

Speaker Biography (David Potter)

David Potter, Commercial Director of the Additive Technology Group Ltd, whose subsidiaries include Additive Process Technologies Ltd, has an Honours degree in Metallurgy and Materials Technology, and a wide business background ranging across senior management positions in industries including Education, Engineering, Electronics and Finance.
 
Immediately prior to setting up Additive Technology Group in November 2005 David ran his own technical consultancy for a period of 10 years with customers including Local and Central Government, BT, Pera and the Smart Card Club of Asia Pacific.

Company Profile (Additive Process Technologies Ltd)

Additive Process Technologies Ltd, based in Market Harborough in the UK, is part of the Additive Technology Group.
 
The group's primary skills and expertise lie in Additive Processes in electroplating, screen printing and precise positioning for which it presently has 5 globally granted main concept patents as well as a number of subsidiary process and detail patents.
 
Within printed electronics, its origins date back to 1996 when it demonstrated working printed ink RFID antenna to the US Post Office and Department of Defense.
 
The main focus of the company is in developing, supplying and installing production systems for manufacturing companies using both its Focussed Field Deposition (FFD) technology and its unique pro-active Optical Alignment System (OAS). FFD is a high speed non immersion selective electroplating process, designed to produce flexible circuitry using electrodeposited metals including copper, with OAS based systems providing absolute registration accuracies down to 5 microns.