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Aerosol Jet: Produces Fine Pitch Interconnects for Advanced 3D Semiconductor Packaging

Mr Mike O'Reilly, Product Manager - Aerosol Jet Systems
Optomec
United States
 
 
This presentation was given at Printed Electronics & Photovoltaics USA 2010 on Dec 02, 2010.
 

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Presentation Summary

  • Enabling significant pitch reductions
  • Increased interconnect densities
  • Greater semiconductor packaging functionality

Speaker Biography (Mike O'Reilly)

Michael O'Reilly is responsible for leading Optomec's M3D® Aerosol Jet® commercialization efforts within printed electronics and related markets. Prior to joining Optomec, Mr. O'Reilly was Vice President of Marketing at Cadence Design Systems responsible for new and enhanced product introductions enabling sales of >$300M annually. Previously he held executive level marketing and sales positions at Integrated Computing Engines, Synopsys, Inc., Avid Technologies, Rosetta, and Computervision. Mr. O'Reilly has over 30 years experience introducing advanced technology into the commercial sector.

Company Profile (Optomec)

Optomec® is the world-leading provider of additive manufacturing systems for high-performance applications in the Electronics, Photovoltaic, and Aerospace & Defense markets. Optomec's Aerosol Jet ® Deposition System (formerly known as M3D) is a breakthrough additive technology enabling finer feature sizes than traditional ink-jetting and screen printing processes. The Aerosol Jet system utilizes an innovative aerodynamic focusing technology that produces electronic and physical structures with feature sizes down to 10 microns. The Aerosol Jet system supports a wide variety of materials including nanoparticle inks and screen-printing pastes, conductive polymers, insulators, adhesives, and even biological matter that can be accurately deposited onto non-planar substrates.
 
Aerosol Jet is a registered trademark of Optomec, Inc.

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