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Conductive adhesives for high speed assembly: low temperature, spot cure technology

Ms Wanda O'Hara, Senior Applications Engineer
Emerson & Cuming, United States
 
 

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Emerson & Cuming presentation - updated 5 Jul*
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プレゼンテーション概要

 

会社紹介 (Emerson & Cuming)

For over 50 years, Emerson & Cuming has focused on providing high performance conductive inks and adhesives for the most demanding electronic industries around the world. Their state-of-the-art antenna inks provide the best solution for solvent and temperature-sensitive substrates, while their novel snap cure die attach adhesives enable low cost tag assembly at high production speeds. The company remains at the forefront as a proven leader with exceptional antenna inks and die attach adhesives for RFID tag assembly.

Reports

Conductive Ink Markets 2012-2018
Silver & Copper Inks & Pastes and Beyond



Presentations

The role for the label, printing and converting industry in Smart Labels
Mr Mike Fairley, Director, Strategic Development, Labels Group Tarsus, United Kingdom at Smart Labels USA 2005

Components for lowest systemic cost for RFID tagging
Mr Samuli Strömberg, Vice President Marketing UPM Rafsec, Finland at Smart Labels USA 2005

Achieving cost efficiencies through the automation of RFID
Mr Simon King, Director – RFID Business Development Domino Printing Sciences Plc, United Kingdom at Smart Labels USA 2005

Articles





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