Cu and Insulating Inks for Printed Electronics

Dr Hideo Nakako, Researcher

Hitachi Chemical Ltd

Japan

This presentation was given at Printed Electronics and Photovoltaics USA 2011 on Nov 30, 2011.

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Presentation Summary

Cu and insulator inks were developed for fabrication by ink-jet and screen print.
Low temperature metallization process was developed. It brought highly conductivity and dense Cu layer.
Wiring pattern fabricated from these inks showed good printing properties and electro reliabilities.

Speaker Biography (Hideo Nakako)

Dr Hideo Nakako is researcher of Hitachi Chemical Co., Ltd. since 2000. His targets are the ink/paste materials and its processes for printed electronics. He graduated from Kyoto University with a Ph.D. in Engineering of polymer science in 2000.

Company Profile (Hitachi Chemical)

Hitachi Chemical Co., Ltd. was established in 1962, independent from Hitachi Ltd., and the headquarter is located in Tokyo. In 2010, paid-in capital was 15,454 million Japanese YEN, non-consolidated sales was 263 billion Japanese YEN, and the number of employee is 4,095. The principal lines of business are electronics related materials, advanced performance resins & materials, life-science & pharmaceuticals, carbon & ceramics, and automotive related products.