Cu Ink for Inkjet Printing - Low Temperature Sintering

Dr Kazunori Yamamoto, Manager High Performance Materials R&D

Hitachi Chemical Co Ltd, Japan

Japan

This presentation was given at Printed Electronics & Photovoltaics Europe 2010 on Apr 14, 2010.

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Presentation Summary

Cu ink for inkjet printing process was developed.The feature of this Cu ink is low temperature sintering below 200 deg C, because Cu nanoparticles are not covered with organic materials which act as a dispersant as well as an oxidation inhibitor.

Speaker Biography (Kazunori Yamamoto)

I graduated from Tokyo Institute of Technology in 1982 and received the degree of doctor of Engineering. I joined Hitachi Chemical Co., Ltd . in 1983, and engaged in the development of the materials for Printed Circuit Boards as well as die bonding materials for semiconductor devices.

Currently, I am a general manager of the High-performance Materials

R&D Center of Tsukuba Research Laboratory.My technical background is polymeric materials and science.

Company Profile (Hitachi Chemical Co Ltd)

Hitachi Chemical Co., Ltd. was established in 1962, independent from Hitachi Ltd., and the headquarter is located in Tokyo. In 2009, paid-in capital was 15,454 million Japanese YEN, non-consolidated sales was 223 billion Japanese YEN, and the number of employee is 4,095.The principal lines of business are electronics related materials,advanced performance resins & materials, life-science & pharmaceuticals, carbon & ceramics, and automotive related products.