Decisions and Drivers for Efficient Development of Printed Electronics Applications
![]() Dr David G Sime, Director of Technology Transfer
Soligie
United States
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This presentation was
given at Printed Electronics and Photovoltaics USA 2011 on Dec 01, 2011.
DownloadsIf you already have access, please [Login] Access can be purchased via IDTechEx Credits Presentation SummarySpeaker Biography (David G Sime)Dr. David G. Sime is the Director of Technology Transfer at Soligie, Inc. Educated in Applied Physics and Information Science, Dr. Sime spent many years in the Atmospheric and Space Sciences working on instrument development, experiments, and analysis with NASA and NSF including roles as Program Scientist and Principal Investigator. He also served as Program Director at NSF. Dr. Sime has worked in the business and technical sides of new technology development in the optics, display, and functional printing industry for almost 20 years. This has included work with lighting, display, sensor, and control systems, involving both basic development and commercialization." Company Profile (Soligie)Soligie is the leading company to utilize high speed manufacturing to produce printed electronics with a variety of conductive, resistive and proprietary materials on flexible substrates such as PET, paper and foil. State of-the-art design and development capabilities enable customers to realize products that push traditional boundaries. Soligie engages in development projects from the product concept phase through high volume manufacturing. The Company is on the cutting edge of the production of electronic components using high speed, fully additive roll-to-roll processes. Soligie offers a full range of services from concept design, circuit design, design for manufacturability and final volume production. Soligie currently serves the medical device, smart packaging, RFID and flexible interconnect markets. Through the combined use of emergent materials and proprietary manufacturing processes, electronics components such as memory, sensors, displays and batteries will soon be integrated into applications on thin flexible substrates. |




