You are here: IDTechEx.com » e-ストア

Development of Isotropic conductive adhesive for metallic substrates used in RFID tag assembly

Mr Jay Shah, Senior Associate
Emerson & Cuming, United States
 
 

ダウンロード

Emerson & Cuming presentation - updated*
Emerson & Cuming audio*
 

プレゼンテーション概要

 

会社紹介 (Emerson & Cuming)

For over 50 years, Emerson & Cuming has focused on providing high performance conductive inks and adhesives for the most demanding electronic industries around the world. Their state-of-the-art antenna inks provide the best solution for solvent and temperature-sensitive substrates, while their novel snap cure die attach adhesives enable low cost tag assembly at high production speeds. The company remains at the forefront as a proven leader with exceptional antenna inks and die attach adhesives for RFID tag assembly.

Presentations

How to achieve hassle free RFID project success: a firsthand perspective
Mr Patrick Sweeney, CEO & President ODIN Technologies, United States at RFID Smart Labels USA 2006

The chip, heart of an RFID Tag: what determines its cost?
Mr Thierry Roz, Business Unit Manager EM MICROELECTRONIC-MARIN SA, Switzerland at RFID Smart Labels USA 2006

RFID Developments in Japan
Ms Midori Taniyama, Business Promoter, RFID Systems Department Fujitsu, Japan at RFID Smart Labels USA 2006

The Six Basic Questions of RFID Tag Selection
Mr John Bartos, Product Strategist, RFID Tags & Media Intermec Technologies, United States at RFID Smart Labels USA 2006

Next generation of RF Tag based Track&Trace technologies - InkSure's approach
Mr Don Taylor, Vice President, Global Marketing Inksure, United States at RFID Smart Labels USA 2006

Printed Electronics: Low Cost Smart Label Opportunities
Dr Jie Zhang, Principal Staff Engineer Motorola, United States at RFID Smart Labels USA 2006

Fully Printed RFID for high volume application
Dr Wolfgang Clemens, Head of Applications PolyIC GmbH & Co KG, Germany at RFID Smart Labels USA 2006

Articles




email この記事を紹介する