Integrated Material Systems for Inlay Assembly

Michael Pinto joined Dow Corning in 1995. Over the past eight years, Michael has worked exclusively within the company's Electronics & Advanced Technologies division in various capacities, including Sales Manager for Southern Europe and more recently as Solutions Business Development Leader for Europe. Today, Michael leads Strategic Planning and Business Development efforts globally for the company's activities in the area of RFID. Michael earned a BA in International Affairs & Economics from the University of Brussels, in association with Boston University (MA). Michael also carries a Master's Degree in Environmental Technology from the University of Brussels.

Dow Corning was founded in 1943 as joint venture between Dow Chemical and Corning Incorporated to pioneer the development of silicon-based chemistry. Today, Dow Corning is recognized as a leading supplier of silicon-based performance-enhancing materials and related services in various sectors. The company is considered a key supplier and an enabling business partner in almost every step of the electronics industry value chain, providing an extensive range of materials for the construction, protection and assembly of IC devices and electronic circuits worldwide. In response to a growing need for highly reliable materials and efficient processes for RFID inlay assembly, Dow Corning has developed a unique system of complementary materials that offer customers in this space excellent performance and choice. The company's portfolio of material offerings for RFID includes a broad and growing range of highly conductive inks, chip attachment polymers and dielectric antenna bridging materials. Dow Corning generated sales of over $3.8 billion in 2005.