You are here: IDTechEx.com » e-ストア

Low Temperature Snap Cure Adhesives for Flip-Chip Bonding: Process Improvement at Maximum Velocity

Mr Robert Saller, Head of International Sales Division
Delo Industrial Adhesives, Germany
 
 

ダウンロード

Delo presentation - updated*
Delo audio*

If you already have access, please [Login]
Access can be purchased via IDTechEx Credits
 

プレゼンテーション概要

 

会社紹介 (Delo)

DELO Industrial Adhesives is a leading expert in the field of customized industrial adhesives with its headquarters close to Munich in Germany. A team of 230 experts works on fast and reliable bonding solutions for individual customer needs.
 
Innovative developments such as edge and area sealants for e-paper displays or flexible solar cells belong to the company's portfolio. A wide range of different flexibilities together with lowest water vapor transmission rates offers optimum solutions for rigid glass based as well as flexible displays. Moreover, we developed optically clear adhesives for window cover or touch panel bonding on LCD displays.

Presentations

How to achieve hassle free RFID project success: a firsthand perspective
Mr Patrick Sweeney, CEO & President ODIN Technologies, United States at RFID Smart Labels USA 2006

The chip, heart of an RFID Tag: what determines its cost?
Mr Thierry Roz, Business Unit Manager EM MICROELECTRONIC-MARIN SA, Switzerland at RFID Smart Labels USA 2006

RFID Developments in Japan
Ms Midori Taniyama, Business Promoter, RFID Systems Department Fujitsu, Japan at RFID Smart Labels USA 2006

The Six Basic Questions of RFID Tag Selection
Mr John Bartos, Product Strategist, RFID Tags & Media Intermec Technologies, United States at RFID Smart Labels USA 2006

Next generation of RF Tag based Track&Trace technologies - InkSure's approach
Mr Don Taylor, Vice President, Global Marketing Inksure, United States at RFID Smart Labels USA 2006

Printed Electronics: Low Cost Smart Label Opportunities
Dr Jie Zhang, Principal Staff Engineer Motorola, United States at RFID Smart Labels USA 2006

Fully Printed RFID for high volume application
Dr Wolfgang Clemens, Head of Applications PolyIC GmbH & Co KG, Germany at RFID Smart Labels USA 2006

Articles




email この記事を紹介する