Low Temperature Snap Cure Adhesives for Flip-Chip Bonding: Process Improvement at Maximum Velocity

DELO has 45 years of experience in the field of industrial adhesives. DELO develops for special applications and has established itself with high-tech adhesives and individual customer solutions on the international market. DELO has been working in the smart card sector with several proven records of success: The DELO products for the flip-chip industry enable secure electrical contacting and very short production times; opaque chip encapsulation compounds protect the chip against unauthorized viewing and copying; the Dam&Fill method patented by DELO enables defined geometries as well as minimum encapsulation heights. Detailed introductory tests, continuous monitoring and consequent further development guarantee first-class products. The special strength of the company are system solutions. In close cooperation with the customer technical requirements are analysed and extensive conceptions are created, e. g. for the integration of bonding processes in large production lines. DELO also offers curing lamps, dispensing units, cleaners and AUTOMIX systems for ideally adapted processes.