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Novel enabling technology for high speed RFID Die Strap tag assembly

Dr Adam Hilton, Market Manager
Emerson & Cuming, Belgium
 
 

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Presentation Summary

  • Demonstrating the wide range of adhesive solutions for antenna assembly
  • Highlighting the necessary adhesive properties for high throughput and low cost manufacture
  • Die strap attach mechanisms employing Isotropic Conductive Adhesive underlining snap curability and stable contact resistance to harsh reliability exposures
  • Company profile and Emerson & Cuming's vision for the future

Speaker Biography

Adam Hilton is the Market Manager for RFID technologies at Emerson & Cuming and responsible for adhesive solutions of direct die and die strap attach within Europe.
 
Adam joined ICI after completing a Doctorate in Industrial Chemistry from the ESPCI (l'Ecole Supérieure de Physique et de Chimie Industrielles) in Paris. Working initially for Acheson Industries, a sister company, he joined Emerson & Cuming in 2003 as an Application Specialist in the conductive adhesive field of the business before taking up a marketer role in 2006.

Company Profile

Emerson & Cuming is a world leader in the design and manufacture of high performance polymers for the most challenging circuit and component assembly applications. With performance and reliability our high quality assembly and protection materials are the first choice for designers and engineers seeking solutions for difficult engineering challenges.
 
For over 50 years, Emerson & Cuming has focused on designing high performance adhesives, encapsulants, and coatings for electronic industries around the world. Our application focus has yielded material solutions in industries ranging from automotive, defence and wireless to new industries like RFID and printed electronics. Our novel snap cure isotropic conductive, anisotropic conductive and non-conductive adhesives enable low cost RFID tag assembly at high production speeds.
 
  • Extensive Experience
  • Global Presence
  • Application Expertise

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