Novel enabling technology for high speed RFID tag assembly
Mr Marc de Pater, Marketing Manager - Europe
Emerson & Cuming, Belgium
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DownloadsIf you already have access, please [Login] Access can be purchased via IDTechEx Credits Presentation SummaryNovel enabling technology for high speed RFID tag assembly, employing low temperature, snap cure adhesives RFID tag cost is a critical parameter for the commercial success of the wide-scale implementation of RFID technology. A high speed assembly process for RFID tags plays an important role in contributing to lower finished tag cost. Emerson & Cuming have developed unique adhesive technology platforms for the interconnection of chips and antennas in RFID tags. These technology platforms deliver very fast interconnection enabling high speed assembly and the use of heat-sensitive, low cost substrates Company ProfileFor over 50 years, Emerson & Cuming's focus has been on designing and manufacturing high performance material solutions for electronic industries around the world. Our expansive breadth of encapsulant, adhesive, and thermal management technologies combined with our decades of experience allow us to create solutions to difficult electric and electronic engineering challenges, providing maximum design latitude for our customers. Our vision is to be your first choice for circuit and component assembly solutions in the broadest sense. Speaker CVMarc de Pater is a chemical industry professional with over 13 years of industry experience and nearly 2 years of management consulting experience. Marc has gained his industry experience in various European countries, fulfilling positions in technology, sales, business development and marketing at managerial levels:
Since 2003, Marc also heads up Emerson & Cuming's global team efforts for the development and commercialisation of RFID materials, carrying responsibility for the global strategy and its implementation for this market. Emerson & Cuming's RFID team comprises Marketing, R&D, Tech Service and other professionals from around the world Marc holds a Master's degree in Polymer Chemistry from the University of Groningen, the Netherlands and has enjoyed further training in materials science and various business subjects, including marketing. He is fluent in English, speaks German well and has a basic knowledge of French. Upcoming Event
Smart Labels USA 2006 Westin Copley, Boston, MA March 28-29, 2006 The fifth event in this series - in previous years over 400 people and 45 exhibitors have attended. |


