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Printed Electronics in New Product Initiatives & the path to Commercialization

Mr Matthew Timm, President
Soligie, United States
 
 
This presentation was given at Printed Electronics Europe 2009 on 2009年04月7日.
 

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プレゼンテーション概要

  • Value proposition for Printed Electronics
  • Uses of Printed Electronics
  • Technical & manufacturing challenges
  • Roadmap and the path for moving forward

講演者の経歴 (Matthew Timm)

Mark Litecky joined Soligie in July of 2009 as Vice President of Sales. In this role, Mark is responsible for aligning the value Soligie provides with customer requirements resulting in products that push traditional boundaries. Mark brings a strong background in successfully ramping revenues for early stage companies and technologies. He has over 20 years of experience bringing new technical solutions to industrial process, microelectronic, flat panel display and medical markets resulting in revenue growth and realized value for customers. Mark holds a Bachelor of Science degree in Electrical Engineering from the University of Minnesota.

会社紹介 (Soligie)

Soligie is the leading company to utilize high speed manufacturing to produce printed electronics with a variety of conductive, resistive and proprietary materials on flexible substrates such as PET, paper and foil. State of-the-art design and development capabilities enable customers to realize products that push traditional boundaries. Soligie engages in development projects from the product concept phase through high volume manufacturing. The Company is on the cutting edge of the production of electronic components using high speed, fully additive roll-to-roll processes. Soligie offers a full range of services from concept design, circuit design, design for manufacturability and final volume production. Soligie currently serves the medical device, smart packaging, RFID and flexible interconnect markets. Through the combined use of emergent materials and proprietary manufacturing processes, electronics components such as memory, sensors, displays and batteries will soon be integrated into applications on thin flexible substrates.

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