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Printed Electronics Technology: Risk Mitigation to Enable a New Manufacturing Paradigm

Dr Devanand K Shenoy, Program Manager
DARPA MTO, United States
United States
 
 
This presentation was given at Printed Electronics & Photovoltaics Europe 2010 on Apr 13, 2010.
 

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Presentation Summary

  • Significant challenges continue to exist in materials, processes, design, and manufacturing
  • Mitigate technology risks to achieve 10x improvement in performance of key technical parameters
  • Enable dual-use applications that need printable electronics technology

Speaker Biography (Devanand K Shenoy)

Dr. Shenoy is a program manager at the Defense Advanced Research Projects Agency (DARPA) since 2005. He joined DARPA from the Naval Research Lab (NRL) in Washington, DC. Dr. Shenoy's interests are in exploiting novel concepts based on new materials, processes, and device architectures for revolutionary electronic and photonic microsystems. At DARPA, he developed and is managing programs in the following areas: Standoff detection of explosives (RIEDAR), Devices based on non-linear optical (NLO) materials for RF photonics and sensor protection (MORPH), Curved focal plane array for wide field of view sensing in the VIS-NIR-SWIR bands (HARDI), Spin based memory (STT-RAM), and an E-Field Detector (E-FED). He is currently working on a new program to develop Non-Volatile Logic devices.

Company Profile (DARPA)

DARPA is the research and development office for the US Department of Defense. DARPA funds unique and innovative research through the private sector, academic and other non-profit organizations as well as government labs.
DARPA research runs the gamut from conducting scientific investigations in a laboratory, to building full-scale prototypes of military systems. We fund research in biology, medicine, computer science, chemistry, physics, engineering, mathematics, material sciences, social sciences, neuroscience, and more.

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