Printing Materials for Flexible Electronic Devices

Dr Kazunori Yamamoto, Senior Manager, High Performance Materials DC

Hitachi Chemical Co Ltd

Japan

This presentation was given at Printed Electronics and Photovoltaics Europe 2011 on Apr 06, 2011.

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Presentation Summary

Low level volume resistivity of copper conductive layer such as metallic copper can be obtained using copper ink without any dispersants. And, highly reliable dielectric ink material, which is suitable for the combination with copper ink, will be presented.

Copper paste for the screen printing will be also presented.

Speaker Biography (Kazunori Yamamoto)

I graduated from Tokyo Institute of Technology in 1982 and received the degree of doctor of Engineering. I joined Hitachi Chemical Co., Ltd . in 1983, and engaged in the development of the materials for Printed Circuit Boards as well as die bonding materials for semiconductor devices.

Currently, I am a general manager of the High-performance Materials

R&D Center of Tsukuba Research Laboratory.My technical background is polymeric materials and science.

Company Profile (Hitachi Chemical Co Ltd)

Hitachi Chemical Co., Ltd. was established in 1962, independent from Hitachi Ltd., and the headquarter is located in Tokyo. In 2009, paid-in capital was 15,454 million Japanese YEN, non-consolidated sales was 223 billion Japanese YEN, and the number of employee is 4,095.The principal lines of business are electronics related materials,advanced performance resins & materials, life-science & pharmaceuticals, carbon & ceramics, and automotive related products.

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