Process Monitoring for RFID Inlay Assembly

RFID inlay assembly is now easier than it ever was before, since total manufacturing solutions are available, which are based on robust assembly processes implemented on highly productive assembly equipment. In addition to inline inspection and inline testing features of the assembly equipment a complementary offline process monitoring is recommended to secure high quality production.

Datacon, the world's leading supplier of advanced-packaging equipment, is first source for high capability chip assembly equipment for RFID inlay manufacturing. With a small die capability down to 0.3 mm flip chip and a placement accuracy of 15µm@3 sigma the big number of installed Datacon RFID chip assembly lines are already capable to handle smallest chip sizes which will become standard in the next couple of years. As a pioneer who introduced high speed dot dispensing technology up to 10,000 dots per hour for chip-on-web attach Datacon has set the challenging benchmark for the best in class total cost of ownership. Based on the TTT-program ("Triple-T") Datacon offers total solutions for RFID inlay/tag manufacturing.