Processing RFID Antennas; Ink to Chip

Laurie Kroupa is the global technology platform manager for Dow Corning's Organic Hybrid Technology Platform, which includes; new materials for RFID, flexible electronics, chip attach and PTFs. She has over 25 years at Dow Corning in technology development and project management and more than ten years of experience in the electronics field. She is currently leading a team to develop new organic and hybrid intermediates and products materials that offer novel solutions for emerging electronic applications. Laurie has a number of patents in sealant, gel and conductive elastomer technology and has been named the Saginaw Valley Patent Association Inventor of the Year and a Dow Corning Technical Achievement Award winner. Laurie earned her B. Chemical Engineering from the University of Detroit and her B.S. in Chemistry and Math from Madonna University.

Dow Corning has been a world leader in silicon-based technology since the company's inception in 1943, and our advanced materials can be found throughout the Electronics manufacturing process. We've invested significant resources to address the most pervasive and urgent issues surrounding smart card and label production, and after intensely focused development work, we've introduced a robust and highly versatile system of materials that speaks directly to antenna manufacturing, chip attachment and dielectric bridging.

 

New products include highly conductive silver inks for antenna manufacturing, delivering superior electrical properties and allowing manufacturers to design flexible antennas with smaller form factors, using less ink. Dow Corning also offers a wide range of complementary products for RFID inlay assembly, including dielectric bridging and protective materials to help manufacturers meet projected market volumes of 1.3 billion tags in 2006.

 

We've leveraged our extensive experience in Electronics and long-standing history of service in traditional label technology to develop next-generation products that deliver new levels of electrical performance and processing ease for smart card and label applications. With manufacturing facilities in North America, Asia, Europe, South America, Australia and the Middle East, Dow Corning is a truly global supplier dedicated to customer service and product excellence around the world.