You are here: IDTechEx.com » Events » Access company presentations

RFID Antennae Production – Today and Tomorrow

Mr Jeroen van Nunen, Product Manager
Meco Equipment Engineers B.V., Netherlands
 
 
This presentation was given at RFID Europe 2007 on Sep 19, 2007.
 

Presentation Summary

  • Overview of today's production methods.
  • Does scale up of antenna production show similarities with the semicon leadframe production path towards industry maturity?
  • Meco's additive copper process the next step toward low cost production.
  • Antenna design guidelines for additive copper.

Speaker Biography (Jeroen van Nunen)

Jeroen van Nunen is a product manager for Meco and responsible for the Sales & Marketing of the RFID business within the company. He hold a BSc degree in business engineering and has over 10 years experience in business engineering of high tech production equipment of which a major part has been focused on processes and systems for semiconductor plating production.

Company Profile (Meco)

Meco Equipment Engineers B.V. (member of the BESI group) is a leading equipment supplier of plating systems for the semiconductor, connector and film & foil industry.
 
Meco's new development, the Flex Antenna Plating system (Meco FAP) is the solution for tomorrow's low cost antenna production where high volume, product flexibility and process robustness become key!
 
Over the years, the Meco systems have established an international reputation for high performance, outstanding reliability, top quality and unbeatable economy.

Events


Reports


Conductive Ink Markets 2012-2018
Silver & Copper Inks & Pastes and Beyond

Presentations

RFID Smart Label: A New Business Opportunity for Label Converters?
Mr Michael Bauer, Product Management Mühlbauer, Germany at RFID Europe 2007

A Contribution to the 1 Cent Tag Target - 'Printed' Copper Antenna - and on Paper
Mr David Potter, Commercial Director Additive Process Technologies Ltd, United Kingdom at RFID Europe 2007

Manufacturing RFID Inlays With Conductive Inks and Adhesive Interconnect
Mr Peter Van Vegten, Global Business Development Director Acheson Colloids, Netherlands at RFID Europe 2007

Assembly of the RFID-Chip to the Antenna, Current and Possible Future Processes
Mr Volker Arning, Scientist Degussa GmbH, Germany at RFID Europe 2007

Articles




email Forward Page