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RFID for Electronic Passports

Mr Patrick Henzen, Business Development - Infrastructure & Services
Philips Semiconductors, Austria
 
 

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Patrick Henzen Bio*
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Presentation Summary

 

Summary

  • Market outlook E-passports
  • Update from Semiconductor perspective
  • The Philips offering for E-passports

Company Profile (NXP)

With over 4.5 billion RFID-based chips sold to date, NXP Semiconductors is the world's leader in the design and manufacturing of ICs used in smart labels, tags and the corresponding reader components. The company has been in RFID since 1988; its most comprehensive IC portfolio (HITAG, ICODE, UCODE, reader IC's for LF and HF) covers all relevant RFID frequency bands and meets corresponding ISO/EPC standards. The NXP Application and System Centres in Austria and China improve the performance and reliability of existing RFID systems by thoroughly testing applications under real-life conditions for various industries.

Events


Reports


Presentations

RFID and Near Field Communication - Going Beyond the Internet of Things
Mr Trevor Crotch-Harvey, Sales Director Innovision Research & Technology, United Kingdom at Smart Labels Europe 2004

The Future of RFID Cards and Tickets in RATP Paris Public Transport
Michel Barjansky, Head of Electronic Ticketing RATP (Paris Transport), France at Smart Labels Europe 2004

RFID within Express Transport and Logistics
Mr Trevor Peirce, RFID Program Director DHL / Deutsche Post, Belgium at Smart Labels Europe 2004

RFID in Tires at Michelin
Dr Patrick King, Global Electronics Strategies Michelin, United States at Smart Labels Europe 2004

Using RFID to Measure Postal Mail Flows
Mr Constant Hardy, Director of Research and Development La Poste, France at Smart Labels Europe 2004

All Presentations
A zipped file of all presentation is available below at Smart Labels Europe 2004

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