Tackling the challenge of low-cost RFID chip assembly
 Mr Hugo Pristauz, Head of Department Advanced Technology
Datacon Technology GmbH, Austria
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Company ProfileDatacon Technology GmbH is one of the most innovative equipment suppliers in the Semiconductor industry and technology leader in advanced packaging, providing customer service and support worldwide. Products include multi-chip and flip chip die-bonders for SIP, CSP, COB, MCM, BGA, stacked die applications etc. - also for handling 300mm wafers. Datacon has furthermore a lot of expertise handling flexible customized solutions and is an expert in flip chip technology. Also for the future market of RFID applications, Datacon can provide the most cost efficient solution. Speaker CVPersonal Information Hugo Pristauz, born at 29.12.1958 at Kufstein/Tirol, living now at Kitzbuehel/Tirol. Academic Career 1978-1985: Study of electrical engineering at TU-Graz 1987-1995: University assistant at department of control science/TU-Graz 1990: Dissertation / control science 1996-1998: Lector at FH-Joanneum/Kapfenberg for control engineering Fokus of interest: nonlinear control system with constraints, fuzzy control, servo control, autotuning of controllers, education in control science Industrial Career 1995-1998: Leading Manager of research & development at Computer Process Automation Gmbh / Graz. Fields of work: Hard- and software development of distributed control systems, development of self tuning pressure booster systems, industrial process automation Since 1999: Manager of Datacon Semiconductor Equipment GmbH. Datacon Career 1999-2001: Manager of Advanced Technology Department Fields of work: die bonder improvements, advanced packaging technologies, new trends in semiconductor packaging, technological investigations, theoretical analysis 2001-2003: Product Group Manager Volume Machines Fields of work: development of a new high speed flip chip platform Since 2003: Vice President R&D Fields of work: responsibility for all Datacon R&D activities Since 2005: Director Advanced Technology & Business Development RFID Fields of work: development of RFID assembly lines, development of advanced machine and process technologies, development of RFID business Upcoming Event&# | http://www.smartlabelsusa.com; Smart Labels USA 2006 Westin Copley, Boston, MA March 28-29, 2006 The fifth event in this series - in previous years over 400 people and 45 exhibitors have attended.
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