Tackling the challenge of low-cost RFID chip assembly

 

Datacon, the world's leading supplier of advanced-packaging equipment, is first source for high capability chip assembly equipment for RFID inlay manufacturing. With a small die capability down to 0.3 mm flip chip and a placement accuracy of 15µm@3 sigma the big number of installed Datacon RFID chip assembly lines are already capable to handle smallest chip sizes which will become standard in the next couple of years. As a pioneer who introduced high speed dot dispensing technology up to 10,000 dots per hour for chip-on-web attach Datacon has set the challenging benchmark for the best in class total cost of ownership. Based on the TTT-program ("Triple-T") Datacon offers total solutions for RFID inlay/tag manufacturing.