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Total Barrier Solutions for Solar and Plastic Electronics Applications

Mr Senthil Ramadas, Chief Technology Officer
Tera-Barrier Films Pte Ltd
Singapore
 
 
This presentation was given at Printed Electronics and Photovoltaics Europe 2011 on Apr 06, 2011.
 

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Presentation Summary

  • Description about the present challenges on integrity of encapsulation, device failure analysis
  • A cost-effective solution (or solutions) for low-cost high barrier substrates.
  • Latest achievements on cost reduction
  • Roll to roll challenges and achievements

Speaker Biography (Senthil Ramadas)

Prior to founding Tera-Barrier Films, Senthil was most recently the Principal Investigator and Project Lead for ETPL/IMRE Flagship Project at IMRE for Barrier Films Development. Senthil has over 17 years expertise in Barrier Substrate Research, including 32 patents on Barrier technology, and has written over 30 scientific and technical papers. He also has a proven track record in setting up manufacturing plants in the following areas: Barrier Technology, Transformer Impregnation Plant, Vacuum flask manufacturing line, Heat Exchanger Plant.

Company Profile (Tera-Barrier Films)

TERA‐BARRIER FILMS is jointly founded by Senthil Ramadas and Mark Auch along with Exploit Technologies Pte. Ltd. TBF is a spin‐off company from the Institute of Materials Research and Engineering/A*STAR. The strong patent portfolio (29 patents) on transparent gas barrier technology, encapsulation and gas permeation measurement system has been transferred to the company. The technology know‐how and expertise could provide a total barrier solution for flexible solar cell and flexible electronics device manufacturers. Tera‐Barrier is working in nexus with solar, display and printed electronics customers and has received several product validation reports.
 
For more information, please visit:
www.tera-barrier.com

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