5G deployment is in full swing with mid-band infrastructure installed by the end of 2021 representing nearly 6 times what it was in 2019. However, this doesn't mean that all of the challenges have been solved. Much of the 5G infrastructure is repurposed 4G equipment at lower frequency bands. The real transition to 5G comes from the adoption of higher frequencies which have largely been categorised into sub-6 GHz and mmWave (> 20 GHz) bands. One of the key challenges is thermal management. As 5G deployment transitions to higher frequency, the antenna design, technology and material choices transition too. This will impact several factors such as the semiconductor technology, the associated die attach materials and thermal interface materials.
This webinar covers:
- An introduction to changes in telecommunications infrastructure
- The choice of semiconductor technology for sub-6 GHz and mmWave 5G
- Case studies of sub-6 GHz and mmWave antenna
- An overview of die attach materials and methodology
- Thermal interface materials for infrastructure and smartphone