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1. | EXECUTIVE SUMMARY |
1.1. | Hierarchy |
1.2. | Comparison of solders to ECAs |
1.3. | Top three technical requirements |
1.4. | Forecasts |
1.5. | Conclusions |
2. | INTRODUCTION |
2.1. | The need to replace solder |
2.2. | Lead-free solders |
2.3. | Electronic Materials |
2.4. | Hierarchy |
2.5. | Conductive Adhesives vs Solders |
2.6. | Stability in Conductive Adhesive Market |
3. | ISOTROPIC VS ANISOTROPIC |
3.1. | Schematic of Interconnects |
3.2. | Factors which influence the choice of material |
4. | ISOTROPIC CONDUCTIVE PASTE (ICP) |
4.1. | Isotropic Conductive Paste |
4.2. | Composition |
4.3. | Resins |
4.4. | Key Parameters of Commercial ICP |
4.5. | Other Characteristics of Commercial ICP |
4.6. | Processing |
4.7. | Thermal Curing |
4.8. | ICP for printed electronics |
4.9. | Silver migration control |
5. | INNOVATIONS IN ICP |
5.1. | Conductive, structural adhesives |
5.2. | Reduced silver content |
5.3. | Nanotechnology |
5.4. | ICP for back-contact PV modules |
6. | ANISOTROPIC CONDUCTIVE ADHESIVES |
6.1. | Introduction |
6.2. | ACP vs ACF |
7. | ANISOTROPIC CONDUCTIVE PASTE |
7.1. | Anisotropic Conductive Pastes |
7.2. | Market Demands |
7.3. | Materials for ACPs |
7.4. | Properties of Commercial ACP |
7.5. | Nanotechnology in ACP |
7.6. | MesoGlue |
8. | FUNCTIONS OF ACPS |
8.1. | Display Interconnection |
8.2. | Chip-on-Glass |
9. | ANISOTROPIC CONDUCTIVE FILM |
9.1. | Anisotropic Conductive Film |
9.2. | ACF Introduction |
9.3. | ACF Bonding Process |
9.4. | Filler Particles |
9.5. | Filler Particle Examples |
9.6. | Thickness of commercially available products |
9.7. | Issues |
9.8. | Technical Developments |
9.9. | Key Application Opportunities |
10. | FUNCTIONS OF ACFS |
10.1. | Typical ACF Assemblies |
10.2. | Touch Panels |
10.3. | Sensors |
11. | INNOVATIONS IN ACF |
11.1. | Dexerials - Particle-Arrayed ACF |
11.2. | Hitachi Chemical |
11.3. | Nanotechnology in ACF |
11.4. | Transparent ACF |
12. | APPLICATIONS |
12.1. | Cameras |
12.2. | Displays |
12.3. | Photovoltaics |
12.4. | Interconnections for Photovoltaics |
12.5. | Advantages of using ECAs in PV applications |
12.6. | Market Share of ECAs in PV applications |
12.7. | LEDs and OLEDs |
12.8. | Optoelectronics |
12.9. | Smart Cards and RFID |
13. | EMERGING MARKETS |
13.1. | Automotive Electronics |
13.2. | Flexible Displays |
13.3. | Future of Flexible Displays in Portable Devices |
13.4. | Displays for automotive industry |
13.5. | In-mould electronics |
13.6. | OLED lighting |
13.7. | Thin Film Photovoltaics |
13.8. | Thin Film Photovoltaics |
13.9. | E-textiles |
14. | VALUE CHAIN |
14.1. | Value Chain |
15. | FINANCIALS |
15.1. | Isotropic Conductive Paste |
15.2. | ACF |
15.3. | ACF - Dexerials |
16. | FORECASTS |
16.1. | Forecast: ICP |
16.2. | Forecast: ACF by Function |
16.3. | Forecast: Revenue by Type |
17. | CONCLUSIONS |
17.1. | Conclusions |
17.2. | On-going research |
18. | MANUFACTURERS |
18.1. | IDTechEx Portal Profiles |
19. | COMPANIES PRODUCING ICP |
19.1. | Chemtronics |
19.2. | Daejoo |
19.3. | DELO |
19.4. | EMS |
19.5. | Epotek |
19.6. | Ferro |
19.7. | Heraeus |
19.8. | Nepes |
20. | COMPANIES PRODUCING ACP |
20.1. | DELO |
20.2. | Henkel |
20.3. | Panacol |
20.4. | Panacol Products |
20.5. | Sun Ray Scientific |
20.6. | Tatsuta |
20.7. | Three Bond |
21. | COMPANIES PRODUCING ACF |
21.1. | 3M |
21.2. | Btech |
21.3. | Hitachi Chemical |
21.4. | Kyocera |
21.5. | Tatsuta |
22. | COMPANY PROFILES |
22.1. | Creative Materials Inc. |
22.2. | Daejoo Electronic Materials Co., Ltd |
22.3. | Dai Nippon Printing |
22.4. | Dexerials America Corporation |
22.5. | Fujikura Kasei Co Ltd |
22.6. | Henkel |
22.7. | Mosaic Solutions AS |
22.8. | Nagase America Corporation |
22.9. | Seashell Technology |
22.10. | Showa Denko |
22.11. | TactoTek |
슬라이드 | 172 |
---|---|
Companies | 31 |
전망 | 2026 |