Conductive Inks: EMI shielding, In-Mold Electronics, and Sintered Die Attach

In this webinar we discuss the latest developments in the world of conductive inks and pastes. More specifically, we focus on three promising trends: package-level EMI shielding, In-Mold Electronics (IME) and sintered die attach paste for high-power electronics. We also provide high-level overviews of many other core and emerging market segments.
For package-level EMI shielding, we examine the recent and ongoing major trend to transition from board-level to package-level EMI shielding. We consider the adoption of package-level shielding in various consumer electronic devices and consider the components which have benefited, and will benefit, from such shielding technology. We then introduce the incumbent process used for realising such shielding before discussing the ink-based alternatives. Here, we examine two approaches: spraying and inkjet, and consider ink formulation trends and requirements. Finally, we outline the latest market trends and offer a future outlook.
For In-Mold Electronics (IME), we first offer a detailed introduction to the process itself and outline some technical challenges that slow market adoption. Next, we consider performance requirements for conductive inks and other elements within the printed material stack. We outline the latest prototypes and products before outlining the latest market trends and offering a future outlook.
For sintered metal die attach paste, we first consider high-level trends which characterise the power electronics market. In particular, we discuss the rise of wide bandgap material and the trends towards high power densities and higher operating temperatures, which will drive a change in the design and material selection of packages. Next, we consider solder-alternatives including metal sintering that can sustain the roadmap towards high power densities/temperatures. We examine how metal sintering die attach pastes benchmark against alternatives before considering how they are applied today. Next, we follow the key innovation trends in sintering profile (pressure-less or -free, form factor, material, etc). To conclude, we consider the update and the trends in the electric vehicle market before pointing out other promising markets such as high-power amplifiers for 5G, high-power LEDs, VSCLE (for lidars), etc.
Finally, we offer a quick high-level review of various market segments such as solar cells, touch screens, e-textile and other stretchable electronics, transparent conductive films, and many more.
This webinar shares some of the research carried out for the new IDTechEx report, Conductive Ink Markets 2019-2029: Forecasts, Technologies, Players.


Dr Khasha Ghaffarzadeh
Dr Khasha Ghaffarzadeh
Research Director