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| 1. | EXECUTIVE SUMMARY AND CONCLUSIONS |
| 1.1. | Definitions |
| 1.1. | The 3000 organisations tackling printed and potentially printed devices and their materials |
| 1.1. | Description and analysis of the main technology components of printed and potentially printed electronics |
| 1.2. | Market forecast by component type for 2011 to 2021 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites |
| 1.2. | Market forecast by component type for 2011-2021 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites |
| 1.2. | Overall Market Size in 2021 |
| 1.3. | 3000 Organizations active in the field |
| 1.3. | Market forecasts for 2030 in US$ billion |
| 1.3. | Market forecasts for 2030 in US$ billion |
| 1.4. | Leading market drivers 2021 |
| 1.4. | Leading market drivers 2021 |
| 1.4. | Organic versus Inorganic Electronics |
| 1.5. | Markets in 2011 |
| 1.5. | Spend on organic versus inorganic materials 2011-2021 US$ Billion |
| 1.5. | Some potential benefits of printed and partly printed organic and inorganic electronics and electrics over conventional devices and non-electronic printing in various applications. |
| 1.6. | The different states of readiness of organic and inorganic electronic technologies (semiconductors and conductors) |
| 1.6. | Market value $ billions of only printed electronics 2011-2021 |
| 1.6. | Market by territory |
| 1.7. | Total market value of printed versus non printed electronics 2011-2021 US$ Billion |
| 1.7. | Spend on organic versus inorganic materials 2011-2021 US$ Billion |
| 1.8. | Split of material types by component |
| 1.8. | Market value $ billions of only flexible/conformal electronics 2011-2021 |
| 1.9. | Total market value of flexible versus non flexible electronics 2011-2021 |
| 1.9. | Market value $ billions of only printed electronics 2011-2021 |
| 1.10. | Total market value of printed versus non printed electronics 2011-2021 US$ Billion |
| 1.10. | Giant industries collaborate for the first time |
| 1.11. | Some of the potential markets |
| 1.11. | Market value $ billions of only flexible/conformal electronics 2011-2021 |
| 1.12. | Total market value of flexible/conformal versus rigid electronics 2011-2021 |
| 1.12. | How printed electronics is being applied to products |
| 1.13. | Examples of organic and inorganic electronics and electrics potentially tackling different technologies and applications. |
| 1.13. | End user markets relevant to printed and potentially printed electronics |
| 1.14. | Possible breakdown of the market for printed and potentially printed electronics in 2030 by numbers and value |
| 1.14. | The potential annual global sales of each type by 2021 in US$ billions |
| 1.15. | The potential annual global sales of each type by 2030 in US$ billions |
| 1.15. | The market for printed and potentially printed electronics by territory in $ billion |
| 1.16. | Market by Territory 2011-2021 |
| 1.17. | BlueSpark printed manganese dioxide zinc battery supporting integral antenna and interconnects. |
| 1.18. | The emerging value chain is unbalanced |
| 1.19. | Those going to market first move right |
| 2. | INTRODUCTION |
| 2.1. | Market volume in Euro billions |
| 2.2. | Smart iontophoretic skin patches |
| 2.2. | Twenty year forecasts of unusual breadth |
| 2.3. | Terminology and definitions |
| 2.3. | Esquire magazine with animated display September 2008 |
| 2.3. | Types of printed/thin film photovoltaics beyond silicon compared, with examples of suppliers |
| 2.4. | Some of today's disposable electronics and why inorganic technology is needed to make it more saleable and useful |
| 2.4. | Plastic Logic E-reader |
| 2.4. | Scope for printed electronics and electrics |
| 2.5. | There is a bigger picture |
| 2.5. | T-equaliser animated t-shirt |
| 2.5. | Primary assumptions of organic electronics in full production 2011 to 2021 |
| 2.6. | XEL-1 by SONY |
| 2.6. | Printed electronics products today |
| 2.6.1. | New technologies, more opportunity |
| 2.6.2. | With or without a silicon chip |
| 2.6.3. | Highest volume products with no silicon chip |
| 2.6.4. | Printed electronics with silicon chips |
| 2.6.5. | Electronic apparel |
| 2.6.6. | Display and lighting |
| 2.6.7. | Photovoltaic power by the mile |
| 2.6.8. | Stretchable electronic products for sale |
| 2.6.9. | A view from Toppan Forms |
| 2.7. | Displays are the main sector for now |
| 2.7. | How printed electronics is being applied to products |
| 2.8. | Printed Electronics Applications |
| 2.8. | Photovoltaics beyond conventional silicon are the second largest market |
| 2.9. | How printed electronics is being applied |
| 2.9. | Typical price breaks for high volume electronics and examples of potential advances |
| 2.10. | Surprisingly poor progress with low cost electronics so far |
| 2.11. | Threat - silicon chips keep getting cheaper |
| 2.12. | Printed electronics for smart packaging |
| 2.13. | Driving forces for disposable electronics |
| 2.14. | Balance of reporting on printed and organic electronics |
| 2.15. | Inorganic patterning shows the way |
| 2.16. | Great uncertainty |
| 2.17. | Challenging conventional electronics |
| 2.18. | Flexible is a Big Market |
| 2.19. | Assumptions for our forecasts |
| 2.20. | Despite recession, finance for printed electronics is not drying up |
| 3. | LOGIC AND MEMORY |
| 3.1. | Logic and Memory Market Forecasts 2011-2021 |
| 3.1. | Traditional geometry for a field effect transistor |
| 3.1. | Global market for printed electronics logic and memory 2011-2021 in billions of dollars, with % printed and % flexible |
| 3.1.1. | Logic and memory forecasts 2011-2021 |
| 3.2. | Impact on silicon |
| 3.2. | Semiconductor options |
| 3.2. | Scope for printed TFTCs to create new markets or replace silicon chips |
| 3.3. | Advantages of printed and thin film transistors and memory vs traditional silicon |
| 3.3. | Performance of Kovio's ink versus others by mobility |
| 3.3. | Transistor design |
| 3.3.2. | New TFT geometry |
| 3.3.3. | Advantages of printed and thin film transistors and memory vs traditional silicon |
| 3.3.4. | The main options for the printed semiconductor |
| 3.3.5. | Benefits and applications envisaged for TFTCs in general |
| 3.3.6. | Development path |
| 3.3.7. | Obtaining higher frequency performance |
| 3.3.8. | Shakeout of organic transistor developers |
| 3.3.9. | Breakthrough in printed inorganic performance in from Kovio |
| 3.3.10. | NanoGram/Teijin |
| 3.3.11. | Progress towards p-type metal oxide semiconductors |
| 3.3.12. | Do organic transistors have a future? |
| 3.3.13. | 3D printed silicon transistors - Japan |
| 3.3.14. | Choice of printing technologies |
| 3.3.15. | Company strategy and value chain |
| 3.4. | Memory |
| 3.4. | Road map |
| 3.4. | Comparison of some of the main options for the semiconductors in printed and potentially printed transistors |
| 3.5. | Envisaged benefits of TFTCs in RFID and other low-cost applications when compared with envisaged silicon chips |
| 3.5. | NanoGram's Laser Reactive Deposition (LRD) technology |
| 3.5. | Flexible Memristor |
| 3.6. | RFID |
| 3.6. | Transparent Zinc Oxide transistors |
| 3.6. | Typical carrier mobility in different potential TFTC semiconductors (actual and envisaged) vs higher mobility silicon, not printable. |
| 3.6.1. | Market for RFID |
| 3.6.2. | Ultimate potential for highest volume RFID |
| 3.6.3. | Penetration of chipless/printed RFID |
| 3.7. | 3D printing of silicon from Seiko Epson |
| 3.7. | Objectives and challenges of organisations developing printed and potentially printed transistor and/ or memory circuits and/or their materials |
| 3.8. | Some of the small group of contestants for large capacity printed memory. |
| 3.8. | Options for high speed, low-cost printing of TFTCs |
| 3.9. | Value chain for TFTCs and examples of migration of activity for players |
| 3.9. | Total value of tags by application - passive RFID tags only 2011-2021 |
| 3.10. | Chipless versus Chip RFID, in numbers of units (billions) (Chip includes Active RFID tags) 2011-2021 |
| 3.10. | An all-organic permanent memory transistor |
| 3.11. | TFE memory compared with the much more complex DRAM in silicon |
| 3.11. | Market size of various chipless solutions, 2011-2021 |
| 3.12. | Structure of TFE memory |
| 3.13. | TFE priorities for commercialisation of mega memory |
| 3.14. | Total value of tags by application 2011-2021 (US Dollar Millions) |
| 3.15. | Prototype 13.56 MHz RFID smart labels from reel to reel production of organic TFTCs by PolyIC |
| 3.16. | Potential, in billions yearly, for global sales of RFID labels and circuits printed directly onto products or packaging. Item level is shown in red. These are examples. |
| 3.17. | Chipless versus Chip RFID, in numbers of units (billions) 2011-2021 |
| 3.18. | Market size of a variety of chipless solutions, US$ millions |
| 4. | DISPLAYS |
| 4.1. | Market drivers |
| 4.1. | Basic structure of an OLED |
| 4.1. | Some new and established display technologies compared |
| 4.2. | Comparison of the features of various technologies for advertising and signage |
| 4.2. | Samsung OLED television, Philips OLED shaver and Eastman Kodak OLED camera. |
| 4.2. | OLEDs as displays for electronic products |
| 4.2.2. | Developers of OLEDs |
| 4.2.3. | Mobile phones and OLEDs |
| 4.2.4. | Digital Cameras and OLEDs |
| 4.2.5. | Audio/Visual players and OLEDs |
| 4.2.6. | TV sets and OLEDs |
| 4.2.7. | OLED market forecasts 2011-2021 |
| 4.2.8. | Impediments to OLED adoption |
| 4.2.9. | Unmet technical needs for OLEDs |
| 4.3. | Electrophoretic |
| 4.3. | Concept of apparel that illuminates with flexible OLED displays |
| 4.3. | Examples of OLED materials and displays investment until the beginning of 2010 |
| 4.3.2. | Applications of E-paper displays |
| 4.3.3. | E ink |
| 4.3.4. | The Killer Application |
| 4.3.5. | Sipix, Taiwan |
| 4.3.6. | Polymer Vision/Wistron |
| 4.3.7. | Kent Displays |
| 4.3.8. | Electrowetting displays |
| 4.3.9. | Liquavista, The Netherlands (Samsung, Korea) |
| 4.3.10. | ITRI, Taiwan and PVI, Taiwan |
| 4.3.11. | Electrophoretic and Bi-Stable displays market forecasts 2011-2021 |
| 4.4. | Electrochromic |
| 4.4. | LEP process flow |
| 4.4. | Examples of companies developing OLEDs |
| 4.4.2. | Electrochromic displays market forecasts 2011-2021 |
| 4.5. | AC Electroluminescent |
| 4.5. | An OLED display from Samsung which folds in the middle. More than half of Samsung's stand was previewing OLED displays |
| 4.5. | Market forecasts for OLED panel displays 2011-2021 |
| 4.5.1. | Applications |
| 4.5.2. | Electroluminescent displays market forecasts 2011-2021 |
| 4.6. | Other display technologies |
| 4.6. | A 4" flexible AM OLED from LG on stainless steel |
| 4.6. | Advantages and disadvantages of electrophoretic displays |
| 4.6.1. | Thermochromic |
| 4.6.2. | Electrochemical displays on paper |
| 4.6.3. | Flexible LCDs |
| 4.7. | A Sony OLED display illustrating its thinness |
| 4.7. | Comparison between OLEDs and E-Ink of various parameters |
| 4.8. | Electrophoretic and Bi-stable displays market forecasts 2011-2021 |
| 4.8. | WOLED displays from Samsung |
| 4.9. | Principle of operation of electrophoretic displays |
| 4.9. | Electrochromic displays market forecasts 2011-2021 |
| 4.10. | Electroluminescent displays market forecasts 2011-2021 |
| 4.10. | E-paper displays on a magazine sold in the US in October 2008 |
| 4.11. | Retail Shelf Edge Labels from UPM |
| 4.12. | Secondary display on a cell phone |
| 4.13. | Amazon Kindle 2, launched in the US in February 2009 |
| 4.14. | Electrophoretic display on a commercially sold financial card |
| 4.15. | A Polymer Vision/Wistron display |
| 4.16. | Droplet contracting and relaxing from Liquavista |
| 4.17. | Droplet driven electrowetting displays from adt, Germany |
| 4.18. | Display on an EnOcean wireless switch |
| 4.19. | Transmissive electrowetting displays frm Liquavista |
| 4.20. | Demonstrator from Liquavista |
| 4.21. | Flow chart of the manufacture process |
| 4.22. | Electrochromic display on a Valentine's card sold by Marks and Spencer in the UK in 2004 and electrochromic display with drive circuits in a laminate for smart cards |
| 4.23. | Boardroom lighting in Alcatel France that switches to various modes |
| 4.24. | EL décor, signage and instrumentation in the new Jaguar concept model |
| 4.25. | Animated EL artwork in a two meter suspended ball for event lighting |
| 4.26. | Educational AC electroluminescent floor covering |
| 4.27. | Coyopa rum with four segment sequentially switched pictures |
| 4.28. | TV controller |
| 4.29. | Switched image on face of Fossil watch |
| 4.30. | Car instrument illumination by electroluminescent display |
| 4.31. | Duracell battery tester |
| 4.32. | Interactive game on a beer package by VTT Technologies in Finland |
| 4.33. | The dollhouse. When energy is added to the system the colour of the wallpaper changes and a picture appears on the wall |
| 4.34. | Two state electrolytic display on paper |
| 4.35. | Seven segment display printed with bi-stable inks |
| 4.36. | Color LCD by photo alignment |
| 4.37. | Photo alignment of LCD |
| 4.38. | The HKUST optical rewriting |
| 4.39. | Color printable flexible LCD |
| 5. | LIGHTING |
| 5.1. | Significance of lighting and challenges |
| 5.1. | Impact of the various forms of lighting, with the overlap showing degree of competition |
| 5.1. | Incandescent, fluorescent, inorganic LED and the potential performance of OLED lighting compared |
| 5.2. | Some relevant statistics in millions of units sold worldwide in 2008 |
| 5.2. | Value chain for manufacture of OLEDs for lighting and signage |
| 5.2. | Comparisons of lighting technologies |
| 5.3. | General illumination market |
| 5.3. | The space saving of OLED lights and their exceptional colour tunability |
| 5.3. | Lighting forecasts 2011-2021 |
| 5.4. | Sales of inorganic LED lighting 2002-2008 in billions of units |
| 5.4. | Example of OLED Lighting |
| 5.4. | Lighting forecasts 2011-2021 |
| 5.5. | Value Chain and examples of OLED lighting |
| 5.5. | Motion lighting concept |
| 5.6. | AC electroluminescent lighting |
| 5.7. | LEDs |
| 6. | POWER: PHOTOVOLTAICS AND BATTERIES |
| 6.1. | Photovoltaics |
| 6.1. | Some of the overlapping requirements for photovoltaics |
| 6.1. | The leading photovoltaic technologies compared |
| 6.1.1. | Thin film Photovoltaics |
| 6.1.2. | Comparison of technologies |
| 6.1.3. | Solar cell production by company |
| 6.1.4. | Trends by territory |
| 6.1.5. | Parameters for comparing Photovoltaic technologies |
| 6.2. | Photovoltaics Forecasts |
| 6.2. | Progress of confirmed research-scale photovoltaic device efficiencies, under AM 1.5 simulated solar illumination, for a variety of technologies |
| 6.2. | Comparison of the typical power conversion technologies of different types of solar cell technologies |
| 6.2.1. | Forecast analysis |
| 6.2.2. | Photovoltaic subsidies - should more be given? |
| 6.2.3. | The need for storage |
| 6.2.4. | Installation of photovoltaics |
| 6.2.5. | Hope for silicon photovoltaics to reach grid price parity |
| 6.2.6. | Strategies of market entry for new, potentially cheaper technologies |
| 6.2.7. | Photovoltaics in 2009/2010 after the mid 2008 peak |
| 6.3. | Batteries |
| 6.3. | Construction of a traditional bulk heterojunction organic photovoltaic cell |
| 6.3. | Efficiency, lifetime and cost of laminar organic photovoltaics |
| 6.3.1. | Importance of laminar batteries |
| 6.3.2. | Button batteries vs laminar batteries |
| 6.3.3. | Choices of laminar battery |
| 6.3.4. | Applications of laminar batteries |
| 6.3.5. | Infinite Power Solutions |
| 6.3.6. | Solicore, USA |
| 6.3.7. | Power Paper |
| 6.3.8. | Blue Spark |
| 6.3.9. | VoltaFlex |
| 6.3.10. | Enfucell |
| 6.4. | Printed batteries forecasts 2011-2021 |
| 6.4. | Module stack for photovoltaics |
| 6.4. | Performance of various types of photovoltaic cell compared |
| 6.4.2. | Laminar batteries - missing the big opportunity? |
| 6.5. | Fuel cells |
| 6.5. | The 3000 organisations tackling printed and potentially printed devices and their materials |
| 6.5. | Photovoltaics forecasts 2011-2021 |
| 6.6. | Shapes of battery for small RFID tags advantages and disadvantages |
| 6.6. | Only East Asia has many giant companies involved in non-silicon photovoltaic devices |
| 6.7. | Power PlasticTM Advantage - High Energy Yield |
| 6.7. | The spectrum of choice of technologies for laminar batteries |
| 6.8. | Examples of potential sources of flexible thin film batteries |
| 6.8. | Supply of PV in 2008 |
| 6.9. | Demand of PV |
| 6.9. | Some examples of marketing thrust for laminar batteries |
| 6.10. | Batteries forecasts 2011-2021 |
| 6.10. | Infinite Power Solutions batteries. |
| 6.11. | Power Paper printed battery |
| 6.12. | Reel to reel screen printing of Blue Spark batteries |
| 6.13. | VoltaFlex organic polymer lithium battery |
| 6.14. | Estee Lauder smart skin patch which delivers cosmetics using the iontophoretic effect |
| 7. | SENSORS AND OTHER ELECTRONIC COMPONENTS |
| 7.1. | General situation and examples |
| 7.1. | The main options for organic sensors |
| 7.1. | Examples of companies developing organic sensors and other components and their main emphasis |
| 7.2. | Sensor forecasts 2011-2021 |
| 7.2. | Plastic film scanner with no moving parts |
| 7.2. | Photodetector arrays |
| 7.2.1. | Printed flexible scanners |
| 7.3. | Touch screens |
| 7.4. | Successes and failures |
| 7.5. | Sensor Forecasts 2011-2021 |
| 8. | MARKET BY TERRITORY, COMPONENTS, MATERIALS, OPPORTUNITIES |
| 8.1. | Market by territory |
| 8.1. | Organisations involved in printed and potentially printed electronics across the world, by type of interest |
| 8.1. | The market for printed and potentially printed electronics by territory in $ billion |
| 8.1.1. | Number of active organisations globally in this field |
| 8.1.2. | Geographical split 2011-2021 |
| 8.1.3. | Giant corporations of the world and their progress with printed electronics |
| 8.2. | The total market opportunity by component |
| 8.2. | Primary devices being developed |
| 8.2. | Examples of giant corporations intending to make the printed and potentially printed devices with the largest market potential, showing East Asia dominant. |
| 8.3. | Examples of giant corporations, making or intending to make materials for printed and potentially printed electronics |
| 8.3. | Market by Territory 2011-2021 |
| 8.3. | Organic versus Inorganic |
| 8.4. | Printed versus non printed electronics |
| 8.4. | Number of printed electronics products by country |
| 8.4. | Most supported technology by number of organisations identified in North America, East Asia and Europe |
| 8.5. | Summary of the trends by territory |
| 8.5. | Number of organisations active in printed electronics by country in Europe |
| 8.5. | Flexible/conformal versus rigid electronics |
| 8.6. | Market forecasts for materials 2011-2021 |
| 8.6. | Display project distribution in East Asia: OLED left, electroluminescent center, electrophoretic right. |
| 8.6. | Market forecast by component type for 2011 to 2021 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites |
| 8.7. | Market forecasts for 2030 $ Billions |
| 8.7. | Number of projects by device type in North America |
| 8.7. | Impact of printed electronics on conventional markets |
| 8.7.2. | Impact on end-use markets |
| 8.7.3. | Potential markets |
| 8.8. | Printed electronics: fundraising, investors, list of companies |
| 8.8. | Market forecast by component type for 2011-2021 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites |
| 8.8. | Spend on organic versus inorganic materials 2011-2021 US$ Billion |
| 8.8.1. | Printed Electronics Commercial Fund Raising Activities |
| 8.8.2. | Printed Electronics Government Funded Activities |
| 8.9. | Market forecasts for 2030 |
| 8.9. | Split of material types by component |
| 8.10. | Market value $ billions of only printed electronics 2011-2021 |
| 8.10. | Spend on organic versus inorganic materials 2011-2021 US$ Billion |
| 8.11. | Market value $ billions of only printed electronics 2011-2021 |
| 8.11. | Market value $ billions of only flexible/conformal electronics 2011-2021 |
| 8.12. | Materials market forecasts 2011-2021 US$ billion |
| 8.12. | Market value $ billions of only flexible/conformal electronics 2011-2021 |
| 8.13. | Relative investments from the key areas of printed electronics development |
| 8.13. | End user markets relevant to printed and potentially printed electronics |
| 8.14. | Materials market forecast 2011-2021 |
| 8.15. | Examples of organic and inorganic electronics and electrics potentially tackling different technologies and applications |
| 8.15. | Examples of fundraising activities in printed electronics since the beginning of 2008 |
| 8.16. | Examples of government funded programs for printed electronics |
| 8.16. | The potential annual global sales of each type by 2021 in US$ billions |
| 8.17. | The potential annual global sales of each type by 2030 in US$ billions |
| 8.18. | Some of the potential markets |
| 9. | UNMET NEEDS, OPPORTUNITIES AND PROGRESS |
| 9.1. | Statistics for materials running out |
| 9.1. | Indium price 2001-2006 |
| 9.1. | Water vapour and oxygen transmission rates of various materials. |
| 9.1.1. | Indium |
| 9.1.2. | Rare Earths |
| 9.1.3. | Escape Routes |
| 9.1.4. | Selenium |
| 9.1.5. | Quantum dots, carbon nanotubes, common compounds |
| 9.1.6. | Material supply and sustainability of thin film CIGS and CdTe Photovoltaics |
| 9.2. | Low temperature processes/curing |
| 9.2. | Typical SEM images of CU flake C1 6000F. Copper flake |
| 9.2. | Requirements of barrier materials |
| 9.2.1. | New ink formulations |
| 9.2.2. | Breakthrough in metal ink cure from Novacentrix: room temperature on cheap substrates |
| 9.2.3. | New Copper ink |
| 9.3. | Backplane transistor arrays hold up AMOLED market penetration |
| 9.3. | Thermal requirements and capabilities of different materials |
| 9.4. | The NovaCentrix process |
| 9.4. | Need for better flexible, transparent, low cost barriers |
| 9.5. | Lack of standardised benchmarking |
| 9.5. | Pre and post sintering |
| 9.6. | SEM Image of the copper oxide ink as printed (left) followed by the same film (right) post-processing showing densification and conversion to copper with the PulseForge 3100 |
| 9.6. | Urgent need for creative product design |
| 9.7. | Current options and challenges for backplane TFTs |
| 9.8. | Schematic diagrams for encapsulated structures a) conventional b) laminated c) deposited in situ |
| 9.9. | Scanning electron micrograph image of a barrier film cross section6 |
| 9.10. | Progress of confirmed research-scale photovoltaic device efficiencies, under AM 1.5 simulated solar illumination, for a variety of technologies |
| 9.11. | Innovative product designers/ sellers are in short supply |
| 10. | COMPANY PROFILES |
| 10.1. | Semiconductor development at Evonik |
| 10.1. | Other players in the value chain |
| 10.1.1. | ACREO |
| 10.1.2. | Asahi Kasei |
| 10.1.3. | Asahi Glass |
| 10.1.4. | BASF |
| 10.1.5. | Cambrios |
| 10.1.6. | DaiNippon Printing |
| 10.1.7. | Evonik |
| 10.1.8. | Fujifilm Dimatix |
| 10.1.9. | G24i |
| 10.1.10. | HC Starck |
| 10.1.11. | Hewlett Packard |
| 10.1.12. | Holst Centre |
| 10.1.13. | InkTec |
| 10.1.14. | ITRI Taiwan |
| 10.1.15. | Konarka |
| 10.1.16. | Kovio Inc |
| 10.1.17. | Merck Chemicals |
| 10.1.18. | National Information Society Agency |
| 10.1.19. | Optomec |
| 10.1.20. | Philips |
| 10.1.21. | Plastic E Print |
| 10.1.22. | Plastic Logic |
| 10.1.23. | Plextronics |
| 10.1.24. | PolyIC |
| 10.1.25. | PVI |
| 10.1.26. | Samsung |
| 10.1.27. | Semiconductor Energy Laboratory |
| 10.1.28. | Seiko Epson |
| 10.1.29. | Soligie |
| 10.1.30. | Thin Film Electronics |
| 10.1.31. | Toppan Forms |
| 10.1.32. | Toppan Printing |
| 10.1.33. | University of Tokyo |
| 10.1.34. | Waseda University |
| 10.1.35. | Other players in this value chain |
| 10.2. | Target range for mobility and processing temperature of semiconductors. |
| 10.3. | Transfer characteristics of gen3 semiconductor system |
| 10.4. | Current efficiency of a Novaled PIN OLEDTM stack on an inkjet printed, transparent conductive ITO anode. |
| 10.5. | G24i Solar bag |
| 10.6. | Solar camera bag powered by G24i - due to launch Q1 2010 with dedicated camera battery charger |
| 10.7. | Inks developed by InkTec |
| 10.8. | InkTec Printing methods |
| 10.9. | Ubiquitous Sensor Networks (USN) |
| 10.10. | Simple sensors used in initial trials |
| 10.11. | USN services and applications |
| 10.12. | Left is diode logic OR gate and the right is a bridge rectifier |
| 10.13. | Micrograph of an SSD array and the 110 GHz microwave measurement setup |
| 10.14. | A prototype of the Plastic Logic E-reader |
| 10.15. | A prototype of the Plastic Logic E-reader |
| 10.16. | A prototype of the Plastic Logic E-reader |
| 10.17. | Samsung OLED display |
| 10.18. | Size of ink droplet volume versus it's radius |
| 10.19. | Printed Flexible Circuits from Soligie |
| 10.20. | Capabilities of Soligie |
| 10.21. | Printed electronics from Soligie |
| 10.22. | Printing presses used for printing electronics at Soligie |
| 10.23. | An e-label from Soligie |
| 10.24. | A flexible display sample |
| 10.25. | Printed electronics samples |
| 10.26. | New electronics targets physical space |
| 10.27. | Large-area electronics |
| 10.28. | 32" pressure sensor matrix |
| 10.29. | Wireless power transmission sheet |
| 10.30. | Device structure |
| 10.31. | Organic transistors |
| 10.32. | Organic transistor 3D ICs |
| 10.33. | Scanner with no moving parts |
| 10.34. | Scanning a wine bottle label |
| 10.35. | Stretchable electronics |
| 10.36. | Flexible battery that charges in one minute |
| APPENDIX 1: MATRIX OF PRINTED ELECTRONICS SUPPLIERS AND ACTIVITIES | |
| APPENDIX 2: IDTECHEX PUBLICATIONS AND CONSULTANCY | |
| TABLES | |
| FIGURES |
| Pages | 355 |
|---|---|
| Tables | 73 |
| Figures | 170 |
| Companies | 1000 |
| Forecasts to | 2021 |