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Conference Agenda

Wednesday, 03 Dec 2008   The Application of Printed Electronics to Products 08:30 IDTechEx 08:55 Nokia Research Center 09:20 Structural Graphics 09:45 Avery Dennison Industrial Products Division 10:10 Break   Radical New Printed Electronics Products 10:50 Toppan Forms Co Ltd 11:30 Plastic Logic Ltd 11:55 Kovio 12:20 Stora Enso Packaging Boards 12:45 LUNCH Track 1   Healthcare and Bionic Man 08:50 RF-iT Solutions 14:00 University of St Andrews 14:25 Toumaz Technology Ltd.   Thin, Flexible Printed Batteries 14:50 Blue Spark Technologies 15:15 NEC Corporation 15:40 Break 16:20 Infinite Power Solutions Inc 16:45 Lux Research Track 2   Electronics as Art, Signage, Human Interface - Large Area Displays 14:00 Rogers Corporation 14:25 E Ink Corporation 14:50 TRED Displays 15:15 Apple Inc 15:40 Break 16:20 Acreo AB   Smart Substrates and Stretchable Electronics 16:45 University of Cambridge 17:10 University of Washington Track 3   Thin Film Transistor Circuits - New Possibilities 14:00 Epson 14:25 PolyIC GmbH & Co KG 14:50 Terepac 15:15 Northrop Grumman 15:40 Break   Sensors Networks & Actuators 16:20 Palo Alto Research Center (PARC) 16:45 University of California 17:10 NXT Technology Inc

Thursday, 04 Dec 2008 Track 1   Thin Film and Printed Photovoltaics 08:30 Boeing Spectrolab 08:55 Konarka Technologies Inc   PV: Panel Discussion 09:20 Lux Research IDTechEx Boeing Spectrolab HelioVolt Corporation 10:10 Break   PV: Nano-Enabled Technologies 11:00 University of Washington 11:25 Applied Nanotech Inc   PV: Inorganic Photovoltaic 11:50 HelioVolt Corporation   PV: Organic PV- Organic Concentrators 12:15 Plextronics Inc 12:40 Lunch 14:00 Solarmer Energy 14:25 MIT 14:50 Arizona State University 15:15 Break   Novel RFID approaches 16:00 Friendly Technologies Ltd   Printed Electronics Standards and Global Progress 16:25 OE-A 16:50 IDTechEx Track 2   Materials:Organic and Inorganic Semiconductors, Dielectrics 08:30 BASF Future Business GmbH 08:55 Korea Institute of Science and Technology 09:20 Faculdade de Ciencias e Tecnologia   Materials: Carbon Nanotubes and Graphene 09:45 EIKOS 10:10 Break 11:00 Rutgers University   Materials: Conductive Materials 11:25 NanoMas Technologies 11:50 Sun Chemical 12:15 SSCP CO. 12:40 LUNCH 14:00 Chisso Petrochemical co.   Materials: Meta-Materials 14:25 Imperial College London   Materials: Material Scarcity 14:50 H.C. Starck Inc 15:15 Break 16:00 University of Augsburg   Materials: The Big Need: Barrier/ Encapsulation Materials 16:25 Vitex Systems Inc 16:50 IDTechEx Track 3   Printing:Roll-to-Roll Printed Electronics: Co-Deposition of Components 08:30 Soligie   Printing: Breakthrough in Room Temperature Cure 08:55 NovaCentrix Corp   Printing: Digital Printing Breakthroughs 09:20 Optomec Inc 09:45 Pixdro/OTB 10:10 Break 11:00 FUJIFILM Dimatix 11:25 imaging Technology international (iTi) 11:50 Asahi Kasei Chemicals 12:15 RFidium 12:40 LUNCH   Process/Inspection/Testing Systems 14:00 Northfield Automation Systems Inc   Printing: Conformal/Flexible Displays 14:25 DuPont Displays 14:50 Add-Vision 15:15 Break 16:00 AJJER 16:25 CDT Limited

 

 

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Wednesday December 03, 2008

Thin Film Transistor Circuits - New Possibilities (14:00 - 16:20)

Epson, United States, Mr Paul Patterson, General Manager - IJIA Business Development

14:00 - 14:25 "Inkjet Printing: A Nano technology production process"

• Emerging technologies
• Critical inkjet printing process development
• Inkjet printing processes and applications in production

 

PolyIC GmbH & Co KG, Germany, Mr Wolfgang Mildner, Managing Director

14:25 - 14:50 "First Generation Roll-to-Roll printed RFID - Status and Future"

• 2007 PolyIC demonstrated the first Roll-to-Roll printed RFID - current status and applications
• Description of the development approach and technology milestones
• Projected future work and roadmap

 

Terepac, Canada, Dr Jayna Sheats, CTO

14:50 - 15:15 "Printing Silicon Integrated Circuits"

• ULSI silicon is by far the least expensive source of small circuits for ubiquitous electronics, including RFID, wireless sensors, etc.
• Only silicon can provide the performance and security required by most applications
• The required breakthrough in handling and packaging of ultrasmall and thin chips is enabled by Terepac's transfer printing technology

 

Northrop Grumman, United States, Ms Hong Zhang, Scientist

15:15 - 15:40 "Nanotube Radio Paper"

 

 

15:40 Break

 

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