Download Presentations

Presentations and audio are available only where permission has been given by the speaker. If you have any problems please contact Ali Lewis at a.lewis@IDTechEx.com

Download individual presentations - please click on speaker/company names in the list below the table.

In order to open the Day 1 or Day 2 set of presentations (.ZIP) please click here to download the software required.

	Download the main conference DAY 1 presentations (PDF)
	Download the main conference DAY 2 presentations (PDF)

	Download the main conference DAY 1 audio recordings (MP3)
	Download the main conference DAY 2 audio recordings (MP3)

Conference Agenda

Wednesday, 03 Dec 2008   The Application of Printed Electronics to Products 08:30 IDTechEx 08:55 Nokia Research Center 09:20 Structural Graphics 09:45 Avery Dennison Industrial Products Division 10:10 Break   Radical New Printed Electronics Products 10:50 Toppan Forms Co Ltd 11:30 Plastic Logic Ltd 11:55 Kovio 12:20 Stora Enso Packaging Boards 12:45 LUNCH Track 1   Healthcare and Bionic Man 08:50 RF-iT Solutions 14:00 University of St Andrews 14:25 Toumaz Technology Ltd.   Thin, Flexible Printed Batteries 14:50 Blue Spark Technologies 15:15 NEC Corporation 15:40 Break 16:20 Infinite Power Solutions Inc 16:45 Lux Research Track 2   Electronics as Art, Signage, Human Interface - Large Area Displays 14:00 Rogers Corporation 14:25 E Ink Corporation 14:50 TRED Displays 15:15 Apple Inc 15:40 Break 16:20 Acreo AB   Smart Substrates and Stretchable Electronics 16:45 University of Cambridge 17:10 University of Washington Track 3   Thin Film Transistor Circuits - New Possibilities 14:00 Epson 14:25 PolyIC GmbH & Co KG 14:50 Terepac 15:15 Northrop Grumman 15:40 Break   Sensors Networks & Actuators 16:20 Palo Alto Research Center (PARC) 16:45 University of California 17:10 NXT Technology Inc

Thursday, 04 Dec 2008 Track 1   Thin Film and Printed Photovoltaics 08:30 Boeing Spectrolab 08:55 Konarka Technologies Inc   PV: Panel Discussion 09:20 Lux Research IDTechEx Boeing Spectrolab HelioVolt Corporation 10:10 Break   PV: Nano-Enabled Technologies 11:00 University of Washington 11:25 Applied Nanotech Inc   PV: Inorganic Photovoltaic 11:50 HelioVolt Corporation   PV: Organic PV- Organic Concentrators 12:15 Plextronics Inc 12:40 Lunch 14:00 Solarmer Energy 14:25 MIT 14:50 Arizona State University 15:15 Break   Novel RFID approaches 16:00 Friendly Technologies Ltd   Printed Electronics Standards and Global Progress 16:25 OE-A 16:50 IDTechEx Track 2   Materials:Organic and Inorganic Semiconductors, Dielectrics 08:30 BASF Future Business GmbH 08:55 Korea Institute of Science and Technology 09:20 Faculdade de Ciencias e Tecnologia   Materials: Carbon Nanotubes and Graphene 09:45 EIKOS 10:10 Break 11:00 Rutgers University   Materials: Conductive Materials 11:25 NanoMas Technologies 11:50 Sun Chemical 12:15 SSCP CO. 12:40 LUNCH 14:00 Chisso Petrochemical co.   Materials: Meta-Materials 14:25 Imperial College London   Materials: Material Scarcity 14:50 H.C. Starck Inc 15:15 Break 16:00 University of Augsburg   Materials: The Big Need: Barrier/ Encapsulation Materials 16:25 Vitex Systems Inc 16:50 IDTechEx Track 3   Printing:Roll-to-Roll Printed Electronics: Co-Deposition of Components 08:30 Soligie   Printing: Breakthrough in Room Temperature Cure 08:55 NovaCentrix Corp   Printing: Digital Printing Breakthroughs 09:20 Optomec Inc 09:45 Pixdro/OTB 10:10 Break 11:00 FUJIFILM Dimatix 11:25 imaging Technology international (iTi) 11:50 Asahi Kasei Chemicals 12:15 RFidium 12:40 LUNCH   Process/Inspection/Testing Systems 14:00 Northfield Automation Systems Inc   Printing: Conformal/Flexible Displays 14:25 DuPont Displays 14:50 Add-Vision 15:15 Break 16:00 AJJER 16:25 CDT Limited

 

 

Click here to show the detail of all presentations

 

Thursday December 04, 2008

Printing:Roll-to-Roll Printed Electronics: Co-Deposition of Components (08:30 - 08:55)

Soligie, United States, Dr David Sime, Fellow

08:30 - 08:55 "A Practical View of Manufacturing in Printed Electronics"

• There is now an established manufacturing element to the Printed Electronics (PE) industry resulting in part from the realization of the steps necessary to integrate individual technologies or devices into applications in which the proper value of these technologies can be expressed.
• Manufacturing can be achieved now with sufficient volume, precision, and reliability to serve existing and developing markets in a commercially attractive way.
• We will consider some existing and emerging applications in PE, including interface technologies, review the challenges in bringing technologies from the lab. into production, and discuss examples from revenue-producing products which indicate what can be achieved now.

 

Top