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		<title>IDTechEx | by technology | Printed Electronics | Printed Electronics World | Materials</title>
		<link>http://www.idtechex.com/research/topics/materials_000227.asp</link>
		<description>IDTechEx provides independent analysis on the development and application of RFID, smart packaging and printed electronics</description>
		<language>en</language>
		<copyright>Copyright (C) IDTechEx Ltd</copyright>
		<topicid>227</topicid>
		<topicurl>/research/topics/materials_000227.asp</topicurl>
<item><title>Novaled achieves break through in organic CMOS-type tec</title><description>The success of today's digital electronics is based on the CMOS technology.</description><link>http://www.idtechex.com/research/articles/novaled_achieves_break_through_in_organic_cmos_type_tec_00001048.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/novaled_achieves_break_through_in_organic_cmos_type_tec_00001048.asp?rsstopicid=227</guid><pubDate>27 Aug 2008</pubDate></item>

<item><title>3D Metamaterial</title><description>Researcher claims to have made 3D metamaterial with a negative refractive index.</description><link>http://www.idtechex.com/research/articles/3d_metamaterial_00001033.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/3d_metamaterial_00001033.asp?rsstopicid=227</guid><pubDate>12 Aug 2008</pubDate></item>

<item><title>OLEDs to be rescued by inorganic chemistry?</title><description>The largest potential market for OLEDs is for mass produced, flexible, low cost versions, particularly wide area types with long life because they enable many exciting new product concepts to be realised rather than replace existing displays in familiar devices.</description><link>http://www.idtechex.com/research/articles/oleds_to_be_rescued_by_inorganic_chemistry_00001028.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/oleds_to_be_rescued_by_inorganic_chemistry_00001028.asp?rsstopicid=227</guid><pubDate>07 Aug 2008</pubDate></item>

<item><title>New generation frontside metallization material more efficient for PV</title><description>DuPont Microcircuit Materials introduces new Solamet&amp;reg; PV159 for photovoltaic solar cells.</description><link>http://www.idtechex.com/research/articles/new_generation_frontside_metallization_material_more_efficient_for_pv_00001029.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/new_generation_frontside_metallization_material_more_efficient_for_pv_00001029.asp?rsstopicid=227</guid><pubDate>07 Aug 2008</pubDate></item>

<item><title>The Square Kilometer Array programme launch</title><description>The Square Kilometre Array (SKA) is a radio telescope currently under development by an international consortium who aim to probe fundamental physics, the origin and evolution of the Universe, the structure of the Milky Way Galaxy, and the formation and distribution of planets.</description><link>http://www.idtechex.com/research/articles/the_square_kilometer_array_programme_launch_00001025.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/the_square_kilometer_array_programme_launch_00001025.asp?rsstopicid=227</guid><pubDate>06 Aug 2008</pubDate></item>

<item><title>Plastic Logic, receives new $50 million round of venture capital</title><description>Reinvestment supports next growth phase: Opening Dresden plant, establishing US headquarters, management team expansion.</description><link>http://www.idtechex.com/research/articles/plastic_logic_receives_new_50_million_round_of_venture_capital_00001026.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/plastic_logic_receives_new_50_million_round_of_venture_capital_00001026.asp?rsstopicid=227</guid><pubDate>06 Aug 2008</pubDate></item>

<item><title>Henkel's Wafer Backside Coating revolutionizes die attach processes</title><description>Utilizing the proven materials deposition techniques of stencil printing, screen printing and spin coating, Henkel's WBC solution allows packaging specialists to efficiently coat the back of wafers with die attach materials down to 20 microns in thickness.</description><link>http://www.idtechex.com/research/articles/henkels_wafer_backside_coating_revolutionizes_die_attach_processes_00001027.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/henkels_wafer_backside_coating_revolutionizes_die_attach_processes_00001027.asp?rsstopicid=227</guid><pubDate>06 Aug 2008</pubDate></item>

<item><title>The new chemistry of printed electronics</title><description>Things have now become really exciting with a huge range of new chemicals, nanotechnology and printing technology brought to bear and sophisticated thin film deposition techniques other than printing being tailored to play a part.</description><link>http://www.idtechex.com/research/articles/the_new_chemistry_of_printed_electronics_00001024.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/the_new_chemistry_of_printed_electronics_00001024.asp?rsstopicid=227</guid><pubDate>05 Aug 2008</pubDate></item>

<item><title>Silicon chip chemicals become a bridge to printing</title><description>Before the 1990s, silicon chip technology employed only six elements according to IBM but today we see a huge variety of compounds, alloys, solvents and dopants brought to bear.</description><link>http://www.idtechex.com/research/articles/silicon_chip_chemicals_become_a_bridge_to_printing_00001023.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/silicon_chip_chemicals_become_a_bridge_to_printing_00001023.asp?rsstopicid=227</guid><pubDate>04 Aug 2008</pubDate></item>

<item><title>Huge growth of Printed Electronics Asia conference</title><description>Printed Electronics Asia will display some of the latest manufacturing technologies from across the world.</description><link>http://www.idtechex.com/research/articles/huge_growth_of_printed_electronics_asia_conference_00001022.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/huge_growth_of_printed_electronics_asia_conference_00001022.asp?rsstopicid=227</guid><pubDate>01 Aug 2008</pubDate></item>

<item><title>Chemicals for printed electronics - Huge new market</title><description>Chemical companies have huge opportunities in the new world of printed electronics.</description><link>http://www.idtechex.com/research/articles/chemicals_for_printed_electronics_huge_new_market_00001021.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/chemicals_for_printed_electronics_huge_new_market_00001021.asp?rsstopicid=227</guid><pubDate>31 Jul 2008</pubDate></item>

<item><title>Progress towards p-type metal oxide semiconductors</title><description>In the last few years there has been increasing work on printed Zinc Oxide (ZnO) inorganic semiconductors. However, the materials developed have been used to demonstrated n-type transistors, but p-type transistors have not been commercially available. There are now two organizations that IDTechEx is aware of, and many more working on the topic, claiming p-type ZnO transistors are possible with reproducible results.</description><link>http://www.idtechex.com/research/articles/progress_towards_p_type_metal_oxide_semiconductors_00001017.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/progress_towards_p_type_metal_oxide_semiconductors_00001017.asp?rsstopicid=227</guid><pubDate>30 Jul 2008</pubDate></item>

<item><title>News from SEMICON West and InterSolar North America</title><description>IDTechEx report on the SEMICON West event held in San Francisco in mid July - an event with over one thousand exhibitors covering the silicon supply chain.</description><link>http://www.idtechex.com/research/articles/news_from_semicon_west_and_intersolar_north_america_00001012.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/news_from_semicon_west_and_intersolar_north_america_00001012.asp?rsstopicid=227</guid><pubDate>28 Jul 2008</pubDate></item>

<item><title>Creative Materials introduce die attach adhesives and adhesive films</title><description>Creative Materials announces a series of unique single-component, electrically conductive, B-stageable epoxy adhesives.</description><link>http://www.idtechex.com/research/articles/creative_materials_introduce_die_attach_adhesives_and_adhesive_films_00001013.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/creative_materials_introduce_die_attach_adhesives_and_adhesive_films_00001013.asp?rsstopicid=227</guid><pubDate>28 Jul 2008</pubDate></item>

<item><title>'Nanonet' circuits closer to making flexible electronics reality</title><description>Researchers created a flexible circuit containing more than 100 transistors, the largest nanonet ever produced and the first demonstration of a working nanonet circuit.</description><link>http://www.idtechex.com/research/articles/nanonet_circuits_closer_to_making_flexible_electronics_reality_00001011.asp?rsstopicid=227</link><guid isPermaLink="true">http://www.idtechex.com/research/articles/nanonet_circuits_closer_to_making_flexible_electronics_reality_00001011.asp?rsstopicid=227</guid><pubDate>25 Jul 2008</pubDate></item>

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