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 June 27-30 2005
Baltimore, Maryland, USA
 
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Masterclasses

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The six optional expert-led masterclasses are intended for audience participation and discussion. They are effectively interactive consultancy sessions. At each masterclass you will have the chance to handle many samples, see demonstrations, and take away printed copies of presentations. They will ensure you get the most from the conference and leave understanding the issues with answers to your questions.

All Masterclasses are held in Wyndham Baltimore Inner Harbor Hotel, the same venue as the main conference.

When and where to register           Delegate information page


      1. RFID
         Monday June 27 2005: 08:30-12:30, Mckeldin Room


Dr Peter Harrop, Chairman, IDTechEx, UK
Raghu Das, Managing Director, IDTechEx, UK
Baruch Levanon, Chairman, Smart Active Labels Consortium (SAL-C), USA
James Neilson, Business Manager, Information Mediary Corp, Canada
  • Chip and chipless tag technology evaluations and their applications
  • Market forecasts and trends
  • Examples of RFID being used, how many have been sold and
    into which markets
  • New applications and advice on entry to market
  • EPC: building blocks, challenges, product design and opportunities
  • RFID forecasts and trends 2005-2020

Lunch for all delegates 12:30-13:30

      2. Smart Packaging
         Monday June 27 2005: 13:30-17:30, Mckeldin Room

 

Sponsored by 

Creo


Dr Peter Harrop, Chairman, IDTechEx, UK
Raghu Das, Managing Director, IDTechEx, UK
Kevin Harrell, Director, Global Business Development, Creo Security, Brand Authentication & ID Systems, USA
  • Mechanical, chemical, electrical and electronic smarts
  • Organic and printed electronics technologies and their impact
  • Non-electronic & electronic laminates for brand enhancement & diagnostics
  • The exploding market for smart medicine and food condition monitoring
  • Opportunities for packaging - combining electronics with packaging
  • Packaging becoming part of the product/combining technologies

Lunch for all delegates 12:30-13:30

      3. Smart Labels "How To"
         Monday June 27: 13:30-17:30, Liberty Ballroom section B

 

Sponsored by 

OMRON

Masterclass 3 is now sold out - please register for Masterclass 6, which is identical to this one.

Intended for label converters, label industry suppliers, label specifiers and buyers, label designers, label and packaging technologists/technicians, brand owners and equipment/software suppliers.

Aim is to inform and educate all those in the smart label manufacturing and supply chain on the requirements, standards, procedures, manufacturing methods (RFID smart labelstocks, tag insertion technologies, chip placement, lamination, checking), software and systems, write and read units, data collection requirements.

Topics to be covered to include:

 
    • Should the label converter buy in smart labels on roll, print the antenna and add chips, or make the labels in line with tag inserting technology in house?
    • Methods of manufacturing smart labels;
        • Smart labelstock production
        • Antenna printing inks and printing methods and solutions
        • Tag and chip insertion equipment
        • Printing and overprinting of smart labelstocks
        • Web handling and web management requirements
        • Reading and checking data in line or on press
        • In house procedures and systems
 
    • Inks and materials for printing RFID tag antennas
    • Smart label application systems and requirements
    • Performance demands of smart labels
    • Investment to become a smart label producer

Lunch for all delegates 12:30-13:30

      Conference Day One (June 28 2005)

      Conference Day Two (June 29 2005)


 

      4. Implementing RFID
         Thursday June 30 2005: 08:30-12:30, Mckeldin Room


Bill Davidson, CTO and Executive VP, Samsys, Canada
Nick Samanich, Global Alliance Partner Director, Tyco Fire & Security, USA
Hugo Mallinson, Auto-ID Labs, University of Cambridge, UK
Patrick Sweeney, President & CEO, ODIN technologies, USA
  • Determining the paybacks of RFID and how to begin your project
  • Evaluating systems and the return on investment (ROI)
  • How to configure an RFID system for your needs
  • Step by step walk through of actual implementations
  • Learn lessons from experts to save you time and money

Lunch for all delegates 12:30-13:30

      5. Printed Electronics
         Thursday June 30 2005: 13:30-17:30, Schaefer Room


Dr Bruce Kahn, Assistant Professor, Rochester Institute of Technology, USA
Raghu Das, Managing Director, IDTechEx, UK

Designed for those who are new to this disruptive technology or need to understand the big picture to assess the challenges and opportunities, this Masterclass is designed to arm you with the latest knowledge of the applications and technology developments involving printed electronics. Led by experts, it is the ideal time to voice your questions as part of the interactive session and learn of the toolkit of technologies that are available and emerging. The session will cover:

  • Applications of printed electronics now and near future
  • Lessons to be learnt from early successes and failures
    • The value chain
    • Market forecasts
  • The need for printed electronics
    • Key markets that need printed electronics reasons why and their technology requirements
    • Creating new markets versus competing with conventional electronics in existing ones
  • Assessment of technologies, companies, strategies and progress so far, including
    • Thin film transistor circuits (organic, inorganic semiconductors, thin film silicon)
    • Displays (OLEDs, electrophoretic, electroluminescene, electrochromic and others)
    • Sensors and conductive inks
  • Batteries and actuators
  • A discussion of printing techniques, their relevancy and challenges
  • Challenges and the roadmap to the full printed electronics toolkit

All workshop attendees also receive 6 months access to Smart Packaging Journal and will be able to study some samples of printed electronics.

Lunch for all delegates 12:30-13:30

      6. Smart Labels "How To"
         Thursday June 30: 13:30-17:30, Mckeldin Room

 

Sponsored by 

OMRON

Intended for label converters, label industry suppliers, label specifiers and buyers, label designers, label and packaging technologists/technicians, brand owners and equipment/software suppliers.

Aim is to inform and educate all those in the smart label manufacturing and supply chain on the requirements, standards, procedures, manufacturing methods (RFID smart labelstocks, tag insertion technologies, chip placement, lamination, checking), software and systems, write and read units, data collection requirements.

Topics to be covered to include:

 
    • Should the label converter buy in smart labels on roll, print the antenna and add chips, or make the labels in line with tag inserting technology in house?
    • Methods of manufacturing smart labels;
        • Smart labelstock production
        • Antenna printing inks and printing methods and solutions
        • Tag and chip insertion equipment
        • Printing and overprinting of smart labelstocks
        • Web handling and web management requirements
        • Reading and checking data in line or on press
        • In house procedures and systems
 
    • Inks and materials for printing RFID tag antennas
    • Smart label application systems and requirements
    • Performance demands of smart labels
    • Investment to become a smart label producer

Lunch for all delegates 12:30-13:30

 

Attended by over 400 delegates from 22 countries.
Gold Sponsors


Smart Labels USA: learn how to make, implement and benefit from RFID!

Silver Sponsors

Emerson & Cuming

Spraylat Corp

Masterclass Sponsors

Creo

OMRON

Gala Dinner Sponsor

Hewlett-Packard

Lunch Sponsor

Bielomatik