Wärmemanagement für Rechenzentren 2025-2035: Technologien, Märkte und Chancen
This report analyzes air cooling, single and two-phase cold plate/direct-to-chip cooling, immersion cooling, as well as the associated coolant distribution units (CDUs), coolants, thermal interface materials (TIMs), and pumps used in data centers. It evaluates the advantages and disadvantages of each cooling method, presents a roadmap illustrating the market adoption of these technologies by data center server rack capacity and applications, such as AI, based on insights from industry leaders. The report conducts a cost analysis on the supply chain and evaluates the potential supply chain consolidation opportunities, as well as outlines crucial factors that companies need to consider when supplying components to the data center cooling industry.
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