Thermal Management Reports and Subscriptions

This report identifies the key and emerging thermal management and fire protection materials and systems used for BESS safety. Analysis of the regulatory landscape, along with assessment of market players, helps to formulate granular ten-year forecasts for the global BESS fire safety market.

This report covers in-depth technical analysis of different cooling technologies for data centers, including air cooling, single-phase direct-to-chip cooling, two-phase direct-to-chip cooling, single-phase immersion, two-phase immersion, and microfluidic cooling. The report covers historic data from 2022 to 2024 and forecasts the market size (US$) and volume demand (units) for liquid cooling components for the next 10 years (2026-2036). The report also analyses thermal interface material (TIM2 and TIM1/TIM1.5) for data center components and projects their market size and area (m2) demand over the next 10 years. The report is one of the most comprehensive reports in the market, analysing different types of cooling technologies for advanced processors and data center applications. With significant investments in data centers, IDTechEx forecasts that the liquid cooling component market size for data centers will exceed US$4 billion by 2036.

This report provides an in-depth technical analysis of thermal interface materials (including TIM1/TIM2/TIM1.5) for EV batteries, power electronics, advanced semiconductor packaging, space and satellite technologies, data centers, EMI shielding, 5G, ADAS, and consumer electronics. 10-year granular area (m2), mass (kg), revenue (US$), and TIM unit price (US$) forecasts are given by application. The report covers recent developments in TIM fillers, high-performance TIMs, successful commercial uses, and historic TIM player acquisitions and partnerships. The report also identifies future TIM trends.

This report analyses thermal management approaches for electric vehicle batteries, motors, power electronics, and the vehicle as a whole. A deep dive is taken into OEM strategies, materials, fluids, and technologies. 10 year granular market forecasts are included segmented by technology.

This report provides a comprehensive overview of thermal challenges in advanced semiconductor packaging (ASP), covering power delivery evaluation for 2.5D and 3D ICs, identification of key thermal bottlenecks, assessment of emerging thermal interface materials, and analysis of advanced cooling technologies for next-generation packaging technologies. Coverage across different emerging TIM1 and TIM1.5 for ASP, historic market size data from 2021 to 2025 and a market forecast for TIM1 and TIM1.5 from 2026 to 2036 are all included, along with the market forecast for liquid and microfluidic cooling.

This report characterizes the thermal protection system technology landscape for spacecraft. Past and future TPS materials and designs are assessed, and emerging opportunities in space logistics evaluated to present a market outlook up to 2035.

Despite a lower fire occurrence rate than combustion vehicles, fire safety is critical for electric vehicles and presents several material opportunities. This report considers the regulation and battery design trends and how this will impact fire protection materials such as ceramics, mica, aerogels, coatings, encapsulants, foams, compression pads, phase change materials, polymers, and more. Market forecasts are given in yearly mass demand and market value segmented by material and vehicle segment.

The report delves into the thermal management strategies employed in electric vehicle (EV) power electronics. It encompasses various aspects such as the thermal architecture within EV power semiconductor packaging, the materials (e.g., solder, silver sinter, copper sinter, etc.) utilized for die and substrate attachment, thermal interface materials, as well as cooling methods involving air, water, and oil. A thorough technological examination of die attach, substrate attach, and thermal interface materials (TIMs) utilized in SiC MOSFETs, Si IGBTs, and GaN technologies. It also provides market forecasts for TIMs in the EV power industry categorized by technology (Si, SiC, GaN) and component (Inverter, Onboard Charger, and DC-DC Converter). A number of commercial use cases are included in the report. With historical market data spanning from 2021 to 2023 and future projections extending from 2024 to 2034, this study offers a comprehensive understanding of thermal management in the EV power electronics sector. It underscores significant growth prospects, with the total market value of TIMs anticipated to surpass US$900 million by 2034.