7 Dec 2023

High Performance Computing for Automotive
Computers on wheels. That's how people currently see cars. Practically everything that happens in a vehicle is being monitored and actuated by a microcontroller, from opening windows to calculating the optimal fuel-air mixture for the current torque demand. But the surface has only just been scratched in terms of how much computing power is making its way into vehicles.
Full profile interview
6 Dec 2023

Vitron (Through-Glass Via Manufacturing) — A LPKF Trademark
Vitron is a supplier that offers laser drilling tools and manufacturing services to its clientele in advanced semiconductor packaging industry (glass packaging). IDTechEx spoke with Vitron at SEMICON Europe 2023.
Topic overview
5 Dec 2023

US CHIPS Act
This premium article discusses the key aspects of the US CHIPS Act and highlights which companies are likely to benefit the most. It also explains what impact the CHIPS Act is likely to have on the supply of semiconductor components into the automotive industry. Although automotive accounts for a relatively small part of total semiconductor demand, COVID-19 showed how sensitive the industry is to supply shortages.
1 Dec 2023

Future Technologies, Materials, and Markets for Thermal Management
The battery deservedly takes the major focus when it comes to technology development in EVs. But an EV's powertrain has to act holistically to operate with optimal performance and interact with the passenger cabin's conditioning system. This means that the thermal management of the motors, power electronics, and how this all interacts is just as important as the battery.
Full profile interview
27 Nov 2023

TSMC (Advanced Semiconductor Packaging)
In the world of advanced semiconductor packaging, where innovation and competition drive the industry forward, various packaging technologies and strategies are shaping the future. Previously, IDTechEx had the opportunity to engage in a conversation about advanced semiconductor packaging with Dr. Cheng-Lin Huang, TSMC Advanced Packaging Department Manager. This dialogue provided valuable insights into the technology and the dynamic landscape of this industry. For further details, please refer below.
Full profile interview
22 Nov 2023

Accelsius — Two-Phase Direct-to-Chip Cooling
Accelsius Technology is a US-based startup specializing in two-phase direct-to-chip cooling. IDTechEx interviewed the company and analyzed its technologies and business outlook.
Full profile interview
8 Nov 2023

PROPHESEE
PROPHESEE is a fabless developer of sensors and software for event-based (neuromorphic) vision systems, which mimic how the human eye perceives light. Primarily used in machine vision systems, PROPHESEE has now released multiple generations of sensor.
Full profile interview
29 Sep 2023

Enovix
Enovix are a US company commercialising their 100% silicon anode cell design.
Full profile interview
29 Aug 2023

DeGirum
DeGirum has developed a cloud platform that allows edge artificial intelligence (AI) developers to test models on various hardware. In addition, DeGirum has designed an AI accelerator, known as ORCA. IDTechEx spoke with Shashi Chilappagari, Co-Founder and Chief Architect.
25 Aug 2023

Why Data Centers Adopt Cold Plates for Liquid Cooling Over Immersion
The increasing power density of data center racks, driven by technologies like cloud computing, generative AI, and crypto mining, has led to the exploration of liquid cooling as a thermal management solution.