Speakers from the world's largest organisations will share their needs & experiences with many world first announcements. Learn of the requirements and case studies from end users and hear all about the latest innovations from companies across the value chain. In total, hear insights from 250 speakers.
3D Printed Electronics - Agile Manufacture Of Mechatronic Systems
Estrel Convention Center, Berlin, Germany
14:40 - 15:00
This presentation will review the state-of-the-art related to the production of 3D mechatronic systems via Additive Manufacturing (AM) processes and the scalability to high volume manufacture.
A reconfigurable array of structural and electronics printing, pre- and post processing techniques are combined with SMD technologies to enable digitally driven 3D electronics manufacturing. The resultant flexible process chains can be easily reconfigured to cope with rapid changes in product type whilst retaining the ability to be scaled through to high volume manufacture. Selection of the most appropriate print, pre- and post-processing methods with the subsequent effect on process speed and cost will be discussed. A review of current applications, spanning 3D electronic circuits, antenna, sensor and heater patterns will be conducted along with an update on the progression to First Time Right manufacture of complex devices.
Speaker Biography (Martin Hedges)
Graduated BSc (Materials Science) from the University of Manchester (UK) in 1987. Completed a PhD in Materials Science in 1990 from UMIST (UK).
Founded the company Neotech in Nuremberg in 2001 to develop additive manufacturing processes with a focus on Printed Electronics
Since 2009 the company has been pioneering the development of 3D Printed Electronics
Company Profile (Neotech AMT)
Neotech AMT GmbH is one of the leading companies developing systems for 3D Printed Electronics (3D PE). The company installed the first 5 axis 3D PE system in 2010. Rapid advances lead to the first commercial installation for mass production for printed 3D circuits in mobile communications devices in 2015.