I hope you are well.
Dr Yu-Han Chang, Technology Analyst at IDTechEx, has recently published the below article on the topic of advanced semiconductor packaging. We thought that this would be of interest to you.
This article follows the release of the brand new IDTechEx report, "Advanced Semiconductor Packaging 2023-2033".
Sample pages are available for this report, please do let me know if you would like to receive these.
Dr Chang will be presenting a free-to-attend webinar on the topic later this month - details can be found at the end of this article.
Advanced Semiconductor Packaging Paves Way to Data-Centric Future
If the future were to be categorized in one word, it would be "data-centric". For decades, IC vendors have designed chips that have all functions integrated on the same die; however, scaling monolithic IC becomes more difficult and costly as the industry sees the slowdown of Moore's law. IC vendors have been pushed towards "advanced semiconductor packaging" to meet the world's data needs.
Today, there is an explosion of data at every level and in almost every industry. Every second, the digital world generates 4,000 terabytes of data, and this amount is only expected to go considerably up in the future. Data-rich applications such as machine learning and AI are the key data enablers in a wide range of applications, including data centers, 5G, and autonomous vehicles. A powerful processor is required to run these apps, of which the foundation is an integrated circuit (IC) built on Si.
What is advanced semiconductor packaging?
The semiconductor packaging process plays a key role in semiconductor manufacturing and design. For example, in the IC packaging process, the IC bare die is encapsulated in a supporting case with electrical contacts. The casing protects the IC bare die from physical harm and corrosion and links the IC to a PCB board to other devices. Semiconductor packaging has existed for decades - the first volume production of semiconductor packaging came in in the early 1970s. So, what is new?
As mentioned, due to the slowdown of Moore's law and the increasing cost of manufacturing a monolithic IC, vendors required new design approaches to enable high-performance, cost-effective processors. A new design called a "chiplet" is the key trend going forwards.
The idea behind chiplets is to "split" a monolithic IC into multiple functional blocks, reconstitute the functional blocks into separate chiplets, and then "re-assemble" these at the package level. Ideally, a processor based on chiplet design should have the same or greater performance but lower total production cost than a monolithic IC. Packaging methods, particularly those used to link several chiplets, play a crucial role in chiplet design since they affect the system's performance as a whole. These packaging technologies, including 2.5D IC, 3D IC, and high-density fanout wafer level packaging, are categorized as "advanced semiconductor packaging" and are the subject of IDTechEx's newly released research report "Advanced Semiconductor Packaging 2023-2033". They allow for the merging of multiple chiplets at various process nodes on a single substrate and have small bump sizes to enable higher interconnect densities and higher integration capabilities.
The brand new IDTechEx report includes a detailed examination of the latest innovations in advanced semiconductor packaging technology, key technical trends, analysis across the value chain, major player analysis, and granular market forecasts. Furthermore, this study gives a comprehensive evaluation of the semiconductor industry in general.
Advanced semiconductor packaging serves as a critical foundation for next-generation ICs that will be utilized in four key markets: data centers, 5G, autonomous vehicles, and consumer electronics. IDTechEx leverages its expertise in these sectors to provide the reader with a thorough understanding of how advanced semiconductor packaging is influencing these fields and what the future may hold.
For a further understanding of the overall advanced semiconductor packaging markets, players, technologies, opportunities, and challenges, please refer to the IDTechEx report "Advanced Semiconductor Packaging 2023-2033".
Sample pages are available for this IDTechEx report, please do let me know if you would like to receive these.
Upcoming Free-to-Attend Webinar
Market and Technology Trends in Advanced Semiconductor Packaging
Dr Chang will be presenting a webinar on the topic on Thursday 25 August 2022 - Market and Technology Trends in Advanced Semiconductor Packaging.
This webinar will provide an overview of the current state of the advanced semiconductor packaging industry. The contents include:
- Analysis of advanced semiconductor packaging markets and their mid-long-term opportunity.
- Key applications' growth drivers
- Player analysis - the dynamics of advanced semiconductor packaging battleground
- Advanced semiconductor packaging technologies - current challenges and innovative trends
Click here to find out more and register your place on one of our three sessions.
Kind regards,
Annick
Content Marketing Manager
Tel: +44 (0)1223 812 300
www.IDTechEx.com