Technology analysis and market forecasts for the global sale of AI chips by geography, processing type, architecture, packaging, application, and industry vertical, in addition to calculations for the costs associated with leading-edge AI chips
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This report characterizes the AI chip markets, technologies, and players. Granular forecasts over a 10-year period (up to and including 2033) across 6 different areas (therein 3 primary regional geographies, edge and cloud processing types, 4 device architectures (GPUs, CPUs, ASICs and FPGAs), 3 device packaging types, 4 application areas, and 9 industry verticals)), along with one-of-a-kind calculations pertaining to the design, manufacture, ATP, and operation of leading-edge AI chips, make this the most comprehensive study compiled for this AI processors and accelerators. This report reveals significant opportunity in various parts of the AI chip landscape, with the AI chip market forecast to grow to over US$250 billion by 2033.
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- Executive summary
- Market forecasts, including:
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- Calculations for leading-edge node design, manufacturing, assembly, test & packaging, and operational costs
- Comparison and analysis of costs relating to the production and operation of leading-edge nodes versus trailing nodes
- Total AI chip forecasts: all-inclusive, excluding multi-purpose, and excluding cloud-based offerings
- Granular forecasts: by geography (North America, APAC, Europe, Rest of World), processing type (edge, cloud), architecture (GPU, CPU, ASIC, FPGA), packaging (SoC, MCM, 2.5D+), application (language, computer vision, predictive, other), and industry vertical (industrial, healthcare, automotive, retail, media & advertising, BFSI, consumer electronics, IT & telecoms, other)
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- Technology overview of AI hardware, including:
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- Introduction to AI accelerators and processing units
- AI chip architecture and design approaches
- Number representation for handling ML workloads
- Transistor technology (physical background and developments)
- AI performance benchmarking
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- AI chip landscape and recent manufacturing investments, including:
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- Supply chain and player manufacturing capabilities
- Deconstruction and analysis of key government funding initiatives, including the US CHIPS and Science Act of 2022, the European Chips Act of 2022, Chinese government semiconductor investments (including Made in China 2025), and South Korean government semiconductor investments
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- Company profiles, including interviews
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Analyst access from IDTechEx
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All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.
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Japan - Asia Headquarters
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