Contract Manufacturing And Engineering In Flexible Electronics (Printed Electronics Europe 2017)

Boris Galkin, Managing Director
TENFlecs
Russian Federation
 

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Europe 2017 Presentation - TENFlecs*
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Presentation Summary

Flexible thin-film ICs and TFT backplanes were on the way from university labs to advanced R&D over last ten years. Next ten years will be marked by the multiple attempts to find a killer application for flexible electronics with the move from advanced R&D to full industrialisation. Seeding new markets for TFT-applications will be impossible without contract prototyping and small-scale manufacturing facilities.

Speaker Biography (Boris Galkin)

Boris Galkin is a managing director of TENFlecs. Boris has over 10 years in various leader positions in technology and media areas. He is also a member of TechnoSpark serial entrepreneur venture building team, overseeing a few startups in the field of flexible electronics.

Company Profile (TENFlecs)

TENFlecs logo
TENFlecs is a contract manufacturing facility for thin-film ICs and TFT backplanes based on IGZO and organic TFT technologies. Target applications are logic (RFID, NFC, memory, CMOS), sensors (fingerprint, X-Ray, pressure) and displays (LCD, OLED and EPD) with total capacity of up to 10,000 sqm of TFTs a year.
TENFlecs technology partners IMEC, Holst Centre and FlexEnable have decades of applied R&D experience in various fields of flexible electronics. TENFlecs partners with the leading material and equipment suppliers which make the line compatible with the technologies of Asian foundries for ramp up when demand is secured.
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