Flexible 'Printed' Copper Circuits - Even on Paper (Printed Electronics Europe 2007)

Mr David Potter, Commercial Director
Additive Process Technologies Ltd, United Kingdom


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Presentation Summary

  • An enabling process for wide scale implementation of printed electronics
  • Unique, low cost, high volume, roll to roll production process for copper, or other electrodeposited metals, on any substrate
  • green' 24 x 7 continuous process using low cost and scrap materials for feedstock

Speaker Biography

David Potter, Commercial Director of the Additive Technology Group Ltd, whose subsidiaries include Additive Process Technologies Ltd, has an Honours degree in Metallurgy and Materials Technology, and a wide business background ranging across senior management positions in industries including Education, Engineering, Electronics and Finance.
Immediately prior to setting up Additive Technology Group in November 2005 David ran his own technical consultancy for a period of 10 years with customers including Local and Central Government, BT, Pera and the Smart Card Club of Asia Pacific.

Company Profile

Additive Process Technologies Ltd, based in Market Harborough in the UK, is part of the Additive Technology Group.
The group's primary skills and expertise lay in Additive Processes in electroplating, screen printing and precise positioning for which it presently has 5 globally granted main concept patents as well as a number of subsidiary process and detail patents. Within printed electronics, its origins date back to 1996 when it demonstrated working printed ink RFID antenna to the US Post Office and Department of Defense.
Additive Process Technologies' main business is presently in process development and contract engineering, principally in applications for electronic circuits. The main focus of the company is in developing, supplying and installing production systems for manufacturing companies using it's Focussed Field Deposition (FFD) technology, which is a high speed non immersion selective electroplating process, designed to produce flexible circuitry using electrodeposited metals including copper.