Integration of Thin-Film Thermoelectrics in New Energy Harvesting Applications (Energy Harvesting and Storage Europe 2012)

Mr Dave Koester, Vice President of Engineering
Nextreme Thermal Solutions
United States
 
May 16, 2012.

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Speaker Biography (Dave Koester)

Dave Koester is VP of Engineering for Nextreme, Inc. Dave has over 15 years of experience in semiconductor technology and product development focused primarily in the fabrication and manufacturing of semiconductors and microelectromechanical systems (MEMS). He has been responsible for product development in numerous areas including optical and wireless communications, biomedical device applications, and various sensing devices. Dave has held key technical and managerial positions with MCNC, Cronos Integrated Microsystems, JDS Uniphase, MEMSCAP, Inc. and RTI International. Dave received a MS from North Carolina State University in materials science and a BS from Iowa State University in ceramic engineering.

Company Profile (Nextreme Thermal Solutions)

Nextreme Thermal Solutions logo
Nextreme Thermal Solutions offers energy harvesting and electronics cooling solutions for sensor, telecommunications, semiconductor, consumer, medical, aerospace and government markets. The company uses microscale thin-film thermoelectric technology and high-volume semiconductor manufacturing processes to address the growing needs for clean-energy solutions world-wide. Nextreme also offers sophisticated modeling, design, engineering, and contract manufacturing services to deliver fully-optimized solutions from standard and customized products that solve the most challenging power and thermal management issues. Nextreme's headquarters and manufacturing facility are based near Research Triangle Park, North Carolina. Visit www.nextreme.com.
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