Flex-On-Flex Attachments Using Anisotropic Conductive Adhesives (Printed Electronics Europe 2018)

This presentation concentrates on flex-on-flex (FOF) attachments using anisotropic conductive adhesives (ACA). FOF attachments are getting more common and important. However, they have not been studied widely and their stability and reliability are not adequately understood. This presentation deals with FOF ACA technology and the reliability of different FOF attachments.

Laura Frisk is CEO and co-founder of Trelic Ltd, a company offering solutions for electronics packaging, materials and reliability issues. Before Trelic, she worked for several years in academic research related to electronics materials and reliability. She received her Ph.D. (2007) from Tampere University of Technology (TUT), Finland and in 2013 she was granted Adjunct professorship (TUT) in the field of Reliability issues in electrical engineering. From 2013 to 2015 she worked as an EU Marie Curie Research Fellow in Imperial College London (ICL). Dr. Frisk has authored over 100 papers in peer-reviewed journals and conference proceedings.

Trelic (Oy, Ltd) is a start-up company providing consultation and experimental work on electronics materials, packaging technologies and reliability testing. We help our customers to adapt new manufacturing and miniaturization technologies and materials and verify their usability and reliability. We also offer small scale production for challenging technologies. Moreover, we can help with reliability analysis using various test methods, development of tailored reliability testing methods and in-depth failure analysis.