3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets Read More
This IDTechEx report assesses the competing technologies that will enable PCBs to be replaced with integrated electronics. It covers technologies, materials and applications of electronics added to 3D surfaces (LDS, aerosol, valve jet/dispensing, LIFT and emerging techniques), in-mold electronics (IME), and fully printed 3D electronics. Also included are 29 market forecasts lines, over 40 company profiles, readiness level assessments, and identification of technological challenges/opportunities, thus providing a clear picture of the emerging 3D / additive electronics landscape.