Low-Loss Materials: A Key Enabler for 6G Telecoms

Low-Loss Materials: A Key Enabler for 6G Telecoms
New generations of wireless networks are typically introduced every 10 years. With 6G rollout expected to commence around 2030, material development is well underway to meet the requirements of next generation of telecommunication technologies. While the 5G rollout is in progress, this article looks to the future of 6G and the ongoing development of low-loss materials to support it.
 

 
New generations of wireless networks are typically introduced every 10 years, with each generation bringing greater data speeds and applications. While the industry is roughly halfway through the 5G rollout, the introduction of 6G is expected sometime around 2030 to afford greater bandwidth, sensing accuracy, and reducing latency. With demand for low-loss materials expected to grow 9-fold over the next decade according to IDTechEx forecasts, material development is well underway to meet the requirements of next generation of telecommunication technologies. IDTechEx's recently released report 'Low-Loss Materials for 5G/6G, Radar, and High-Speed Digital 2026-2036: Markets, Trends, and Forecasts' delves into materials development and R&D for low-loss materials in preparation for 6G.
 
 
An overview of the spectrum characteristics from low bands up to Sub-THz. Source: IDTechEx
 
5G Rollout and Towards 6G
 
Each generation of telecommunication networks introduces new frequency bands to bring forward new applications (e.g. video streaming, web-browsing, etc.). 5G has 2 frequency bands, sub-6GHz (3.5-6GHz) and mmWave (24-40GHz), though deployment of 5G mmWave has been very limited to date. The new frequency bands under consideration for 6G include 7-20GHz, W-band (above 91GHz), D-band (120-170GHz), 275-300GHz, with 6G expected to bring improvements in data rates, connectivity, and reduced latency.
 
To date, although 5G rollout has seen some success with fixed wireless, it has largely failed to deliver significantly new applications. For 6G however, the telecoms industry is heavily advocating to unlock new applications such as digital twinning and integrated sensing and communication (ISAC). For the deployment of 6G to be successful, it requires research and development across the telecommunications ecosystem, with stakeholders from telecommunications operators, component suppliers, materials suppliers, governments, and academic institutions. More information on 6G technologies can be found in IDTechEx's dedicated report '6G Market 2026-2036: Technology, Trends, Forecasts, Players'.
 
Materials Development Underway to Support 6G
 
Developing a new generation of wireless communication is expensive and complex, which also includes significant advances in low-loss materials. This is because high frequencies like those used for 5G mmWave, 6G and THz communications critically rely on low-loss materials to help minimize signal loss to enable new 6G technologies and applications.
 
 
Figure showing how increasing frequency impacts the dielectric properties of low-loss materials. Source: IDTechEx
 
There is still some uncertainty as to the precise standard that low-loss materials will need to reach to be suitable for 6G. However, research work has already commenced on identifying low-loss materials for 6G applications. Based on conversations with key materials players, IDTechEx thinks that the materials used for 6G mmWave will be similar to those used for 5G mmWave, but they will need to be ultra-low-loss as a minimum performance standard.
 
Depending on the final spectrum for 6G and the needs of future 6G devices, the dielectric properties such as dielectric constant (Dk) and dissipation factor (Df) of ultra-low-loss materials may need to drop even further to be suitable for 6G. For example, Celanese disclosed to IDTechEx that it believes 6G will likely use the same types of materials as 5G mmWave, although research and development is needed to introduce modifications to enhance dielectric properties for sub-THz and THz frequencies. Insights from exclusive interviews with players such as Isola, Celanese, and Kyocera inform IDTechEx's comprehensive market insights and are accessible through IDTechEx's report.
 
Integration of telecommunications components into ever smaller packages require specialized materials to facilitate integration. This shift is driving the exploration of organic materials such as liquid crystal polymers (LCP), modified polyimides (MPI), polyphenylene ether (PPE) and others, in addition to inorganic materials such as low-temperature co-fired ceramics (LTCC) and glass substrates. In addition to lowering Dk and Df of the materials, it is also critical to consider the mechanical and thermal properties to ensure performance and manufacturability, and the cost to maintain overall competitiveness.
 
In 'Low-Loss Materials for 5G/6G, Radar, and High-Speed Digital 2026-2036: Markets, Trends, and Forecasts', IDTechEx surveys the landscape of low-loss materials and benchmark the performance of over 150 products by several key factors, i.e. dielectric constant (Dk), dissipation factor/loss tangent (Df), frequency dependence of dielectric properties, thermal conductivity, coefficient of thermal expansion (CTE), glass transition temperature, moisture absorption, and more. In addition, the report also considers material cost and processability.
 
IDTechEx's report offers an independent and comprehensive analysis of market trends, examining key technologies and application areas driving demand for low-loss materials. Drawing on primary research, the report delivers insights into industry developments, analyzes leading market players, and benchmarks products across critical material performance characteristics. The report also includes 10-year demand forecasts segmented by application and material type.
 
For more information on this report, including downloadable sample pages, please visit www.IDTechEx.com/LowLossMats, or for the full portfolio of related research available from IDTechEx, see www.IDTechEx.com.