will be showcasing their innovative stretchable materials designed for interconnects, heating and bonding on in-mold electronics (IME), flexible hybrid electronics (FHE) and e-textiles applications. These materials offer stable performance over repeated elongation with outstanding durable utilizing standard manufacturing process for ease of use.
All materials are designed to be ready for high volume manufacturing making implementation easy and economical. The result is a proven set of materials providing companies the ability to develop cutting edge solutions with flexibility in design compared to embedding electronics in clothing.
The silver-based conductive material XE181 series is designed for printing interconnects of low-voltage circuitry on rigid sheet for thermoforming applications or elastic film and textile. This novel material offers low resistivity, approximately 2 x 10-5 Ω-cm, capable for deep draw thermoformed parts or high stretch-ability and bending on flexible substrates. The XE181 series can be stretched to double its length when applied on a highly stretchable substrate such as TPU (thermoplastic urethane while maintaining high conductivity then recover to almost its initial resistance once returned to original size. The XE181 is easily applied to a wide variety of substrates such as urethanes, polyester elastomers, PET, untreated polyolefins and polycarbonates with capability of fine line printing down to 100 um line.
The carbon-based material XE182 series exhibits a resistance value of approximately 1 Ω · cm allowing it to be used for printing interconnects or a PTC (positive temperature coefficient) function in a low power heater offering uniform heating, thin thickness and flexible design on thermoforming parts or elastic film and textile. The high stretchability of XE181 silver-based material offers high reliability due to excellent moisture resistance for a robust solution.
The stretchable conductive adhesive XE184 series is used to bond components, such as LEDS, sensors, and connectors, to sheets before thermoforming or elastic film and textile with high flexibility due to low elastic modulus and ability to cure as low as 70⁰C. The XE184 series has been formulated to be easily dispense using standard dispense equipment for ease of manufacturing.
The insulating material XE185 series is designed to protect conductive circuits, especially on wearable applications, or insulator for cross-over circuits offering maintaining high stretchability and excellent insulation with conductive past. The XE185 dramatically improves the wash resistance of the overall circuitry to meet stringent industry requirements.
These innovative materials provide designers and engineers the freedom to develop the next generation of smart fabrics, advanced flexible hybrid electronics (FHE) or in-mold electronics with unmatched reliability and cutting-edge technology.
NAMICS is a global technology materials leader for producers of semiconductor devices, passive components and solar cells with over 70 years of experience and expertise. We build more than products; we build relationships, and NAMICS sets the gold standard for customer service by offering customizing products, world class customer support to provide a solution for your personal application. Let's work together to discover how NAMICS can contribute to your goals.
To learn more about NAMICS novel stretchable materials on both thermoformed packages and flexible substrates drop by Booth N16 at IDTechEx
Show! on November 20-21, 2019 at Santa Clara Convention Center, CA.
For more information, contact:
226 Airport Parkway, Suite 660
San Jose, CA 95110
Telephone (408) 516-4611
All Image Sources: NAMICS Technologies