1. | EXECUTIVE SUMMARY AND CONCLUSIONS |
1.1. | Conductive inks and paste: everything is changing and the rising tide of PV |
1.2. | Traditional Markets |
1.2.1. | Photovoltaics |
1.2.2. | Touch screen market |
1.2.3. | Automotive |
1.2.4. | Sensors |
1.3. | RFID |
1.4. | Emerging applications |
1.4.1. | 3D antennas |
1.4.2. | ITO replacement |
1.4.3. | Stretchable inks |
1.4.4. | Desktop PCB printing |
1.4.5. | 3D Printed Electronics |
2. | CONDUCTIVE INKS AND PASTES |
2.1. | PTF vs Firing Paste |
3. | PERFORMANCE OF DIFFERENT PTF AND FIRING TYPE PASTES |
3.2. | Curing and sintering |
3.3. | Value chain |
3.4. | Silver nanoparticle inks |
3.5. | Silver nanoparticle inks are more conducting |
3.6. | Curing temperature and profile of silver nanoparticle inks |
3.6.1. | Enhanced Flexibility |
3.6.2. | Inkjet Printability |
3.7. | Price competiveness of silver nanoparticles |
3.8. | Performance of silver nanoparticle |
3.9. | Value chain |
4. | SILVER NANOPARTICLE PRODUCTION METHODS |
5. | PARTICLE FREE CONDUCTIVE INKS AND PASTES |
6. | COPPER INKS AND PASTE |
6.1. | Methods of preventing copper oxidisation |
6.1.1. | Superheated steam |
6.1.2. | Reactive agent metallization |
6.1.3. | Photocuring and photosintering |
6.2. | Air curable copper pastes |
6.3. | Emerging copper paste and ink suppliers |
6.4. | Pricing strategy and performance of copper inks and pastes |
6.5. | Copper oxide nanoparticles |
6.6. | Silver-Coated Copper |
7. | CONDUCTIVE PASTES IN THE PHOTOVOLTAIC MARKET |
7.1. | Background to the PV industry |
7.2. | The return of the boom and bust to the PV sector? |
7.3. | Massive Chinese investments buoys the market |
7.4. | China takes markets to new heights but have the changes in FiTs finally cooled it down? |
7.5. | Conductive pastes in the PV sectors |
7.6. | Alternative and improved metallization techniques |
7.7. | Silicon inks |
7.8. | Copper metallization in solar cells |
7.9. | Trends and changes in solar cell architecture |
7.10. | Market dynamics |
7.11. | Ten-year market forecasts for conductive paste in solar cells |
7.12. | Silver nanoparticles are finally adopted in the thin film photovoltaic business? |
8. | AUTOMOTIVE |
8.1. | De-misters or de-foggers |
8.2. | Laser transfer printing as a new process? |
8.3. | Transparent conductors as replacement for printed heaters? |
8.4. | Car seat heaters |
8.5. | Seat sensors |
8.6. | High power electronics represent a major growth opportunity |
8.6.1. | A few words on LTCC |
9. | TOUCH PANEL EDGE ELECTRODES |
9.1. | Narrow bezels change the market |
9.2. | Laser cut vs photopatternable inks |
9.3. | Ten-year market projections for conductive inks and paste in the touch screen industry |
10. | CONDUCTIVE INKS IN RFID |
10.1. | RFID market size and business dynamics |
10.2. | Processes, Material Options and Market Shares |
10.3. | Transparent ultra low-resistivity RF antenna using printed metal mesh technology |
10.4. | Ten-year market projections for conductive inks in UHF and HF RFID antennas |
11. | 3D ANTENNAS AND CONFORMAL PRINTING ON CURVED SURFACES |
11.1. | Laser Direct Structuring and MID |
11.2. | Observations on the MID market |
11.3. | Aerosol deposition |
11.4. | Ink requirements for aerosol printing |
11.5. | Others ways of printing structurally-integrated antennas |
11.6. | Market projections for printed 3D antennas |
12. | THERMOFORMED OR IN-MOLD ELECTRONICS |
12.1. | Automotive |
12.2. | Definition of terms |
12.2. | In-mold electronics in consumer electronics |
12.2.1. | Trend towards commercialization |
12.2.2. | Currently commercial examples of In-Mold Electronics |
12.3. | Ink requirements in In-Mold Electronics |
12.3.2. | The portfolio approach is essential |
12.3.3. | Other requirements for conductive inks |
12.3.4. | Design, assembly and the need for adhesives |
12.4. | Suppliers of IME inks rapidly multiply |
12.5. | Other materials used in in-mold electronics: the merit of a portfolio approach |
12.5.1. | IME PEODT |
12.5.2. | IME Carbon nanotubes |
12.5.3. | IME Metal mesh |
12.5.4. | Insert moulding or transfer attachment will do just fine? |
12.6. | Value chain |
12.7. | Market forecasts for IME conductive inks |
13. | STRETCHABLE INKS FOR ELECTRONIC TEXTILES |
13.1. | Electronic textile industry |
13.2. | Stretchable inks: general observations |
13.3. | Stretchable e-textile inks multiply |
13.4. | Performance of stretchable conductive inks |
13.5. | Future performance improvements for stretchable inks |
13.6. | The role of particle size and resin in stretchable inks |
13.7. | The role of pattern design in stretchable conductive inks |
13.8. | Washability for stretchable conductive inks |
13.9. | Encapsulant choice for stretchable inks |
13.10. | The role of the substrate in stretchable inks |
13.11. | Applications of inks in e-textiles |
13.12. | Examples of products with conductive yarns |
13.13. | Graphene as a stretchable e-textile conductive ink |
13.14. | PEDOT as a conductive e-textile material |
13.15. | Market projections for stretchable conducive inks |
14. | STRETCHABLE CONDUCTIVE INKS IN FLEXIBLE AND/OR STRETCHABLE CIRCUIT BOARDS |
15. | HIGH THERMAL CONDUCTIVITY SINTERED DIE ATTACH PASTE |
15.1. | Performance of sintered Ag paste |
15.1. | The rise of nanoparticles |
15.1.2. | Power electronics functions and technology trends inside electric vehicles |
15.1.3. | Key trends in power module materials to enable high temperature operations |
15.2. | Material choices for die attach pastes |
15.2. | Commercial progress |
15.3. | Benchmarking different die and substrate attach technology |
15.3. | Supplier overviews |
15.4. | Sintering profile and temperature |
15.4. | Is Cu a viable sintering alternative |
15.5. | Prices |
15.6. | Market forecasts for nano or hybrid sintered Ag die attach paste in value and tonnes |
16. | EMI SHIELDING USING CONDUCTIVE INKS |
16.1. | Background to EMI shielding solutions |
16.2. | Current market estimates for EMI shielding solutions |
16.3. | Printing or spraying conductive paste as conformal EMI shielding |
16.4. | Sputtering vs spraying for conformal EMI shielding |
16.5. | Nano vs micro inks for EMI shielding |
16.6. | Sputtering currently dominates but printing is a major medium-term future opportunity |
16.7. | Numbers of suppliers working on or launching conformal on-chip EMI shielding pastes increases |
16.8. | Has spraying package-level shielding had commercial success? |
16.8.1. | Jetted comportment shielding gains traction? |
16.9. | The challenge of magnetic shielding at low frequencies |
16.10. | Value proposition for magnetic shielding using printed inks |
16.11. | Market forecasts for conductive inks/pastes in consumer electronics EMI shielding- can it be the next big market outside PV? |
17. | PRINTED CIRCUIT BOARD MANUFACTURING AND PROTOTYPING |
17.1. | Background to the PCB industry |
17.2. | 'Printing' PCBs for the hobbyist and DIY market |
17.2.1. | Comments |
17.3. | 'Printing' professional multi-layer PCBs |
17.4. | Print seed and plate approach |
17.5. | Progress on seed-and-plate PCBs |
17.6. | Comparison of different PCB techniques |
17.7. | Market for conductive inks in desktop and professional PCB printing |
18. | FLEXIBLE HYBRID ELECTRONICS |
18.1. | Novel approaches towards placement of complex IC with high I/O on flex substrates |
18.2. | Low temperature solder: overcoming a major technical barrier? |
18.3. | Conductive paste bumping on flexible substrates |
18.4. | Photonic sintering of solder |
18.5. | Logic and memory |
18.6. | Metallization trends: towards fine-feature high-conductivity metallization on low-temperature substrates |
18.7. | Conclusions |
19. | ITO REPLACEMENT (TRANSPARENT CONDUCTING FILMS) |
19.1. | Market forecast for transparent conductive films |
19.2. | Changing market requirements |
19.3. | Technology choice for flexible display TCFs |
19.4. | A brutal consolidation set in but has now ended? |
19.5. | Progress and opportunities for conductive inks |
19.5.1. | Embossing followed by silver nanoparticle printing |
19.5.2. | Self-assembled silver nanoparticle films |
19.5.3. | Inkjet printed silver nanoparticles as transparent conducting films |
19.6. | Direct printing of fine line metal mesh |
19.7. | Direct printing can go ultra-fine feature, achieving sub-micron resolution? |
19.8. | Printing of metal mesh TCF using photo-patterned conductive pasts |
19.9. | Print seed layer and plate approaches |
19.10. | Direct screen printing of metal mesh films for ultra large area displays |
19.11. | UV patterned silver nanoparticle based metal mesh |
19.12. | Market Projections |
20. | OLED LIGHTING MARKET |
20.1. | OLED Lighting market dynamics and challenges |
20.2. | OLED lighting in search of a unique |
20.3. | Cost projections of OLED lighting |
20.4. | OLED lighting market forecast |
20.5. | Requirements from conductive inks in OLED lighting |
20.6. | Market projections |
21. | PRINTED AND FLEXIBLE SENSORS |
21.1. | Piezoresistive |
21.2. | Glucose sensors |
21.3. | Market forecasts for conductive inks in glucose test strips |
21.4. | Capacitive sensors |
22. | 3D PRINTED ELECTRONICS |
22.1. | Progress in 3D printed electronics |
22.1.1. | Nascent Objects (now Facebook) |
22.1.2. | Voxel8 (before re-focus) |
22.1.3. | nScrypt ad Novacentrix |
22.2. | University of Texas at El Paso (UTEP) |
22.3. | Nagase |
22.3.2. | Ink requirements for 3D printed electronics |
22.4. | Ten-year market projections for conductive inks and pastes in 3D printed electronics |
23. | LARGE AREA LED LIGHTING ARRAYS |
23.1. | Why large-area LED array lighting |
23.2. | Examples of LED array lighting |
23.3. | Role of conductive inks in large-area LED arrays |
23.4. | Competitive non-printed approach to making the base for large-area LED arrays |
24. | CONDUCTIVE PENS |
25. | MOBILE PHONE DIGITIZERS |
26. | PRINTED THIN FILM TRANSISTORS |
26.2. | Overall market situation for printed RFID logic |
26.3. | Market for printed backplanes for displays |
26.4. | Market for printed backplanes for large-area sensor arrays |
26.5. | Latest progress with solution-processable metal oxides |
26.6. | Latest progress with fully printed organic thin film transistor arrays |
26.7. | The need for printed nanoparticle inks and the latest progress |
26.8. | Market forecasts for silver nanoparticles in fully printed thin film transistors |
27. | PRINTED MEMORIES |
27.2. | Applications of printed thin film memory |
27.3. | The structure of printed memory and the role of printed conductors |
27.4. | Market forecasts for conductive inks in printed memories |
28. | CU PASTES FOR FLEXIBLE PCB MARKET |
29. | OBSERVATIONS, INSIGHTS, ESTIMATES AND FORECASTS FOR CU POWDER IN THE MLCC (MULTI-LAYER CERAMIC CAPACITOR) MARKET |
29.2. | Material usage and price analyses for MLCC |
29.3. | Key powder and paste suppliers in the MLCC electrode business |
30. | METAMATERIALS AND ENGINEERED STRUCTURES USING CONDUCTIVE INKS |
30.1. | Nantennas |
30.2. | Frequency-Selective Transparent Shielding Patterns |
31. | E-READERS |
31.1. | The use of conductive inks in wearable e-reader devices |
31.2. | Market forecasts for conductive inks in e-readers |
32. | OTHER NASCENT APPLICATION IDEAS |
32.1. | Battery Heaters |
32.2. | Plant heaters |
33. | SPECIAL CHAPTER: EXISTING AND EMERGING APPLICATIONS OF SILVER NANOPARTICLE INKS |
33.1.1. | Conformal printing |
33.2. | Desktop and professional single to multi-layer PCB printing |
33.3. | On-chip conformal EMI shielding |
33.4. | Sintered silver die attach pastes |
33.5. | Directly printed metal mesh |
33.6. | Hybrid (emboss then fill) metal mesh for ITO replacement |
33.7. | Inkjet printed metal mesh TCF |
33.8. | Seed layer for plating Cu films for FCCL |
33.9. | Replacing solder balls for chip assembly |
33.10. | Print seed and plate in wafer-based Si PV |
33.11. | Top up conductor layer in thin film PV |
33.12. | Seed layer in PCB |
33.13. | Transistor and memory |
33.14. | OLED lighting |
33.15. | Digitizer |
33.16. | Stretchable and in-mold electronic inks |
34. | INTERVIEWS |
34.1. | Advanced Nano Products |
34.2. | Agfa-Gevaert N.V. |
34.3. | AgIC |
34.4. | AIST and NAPRA |
34.5. | Amogreentech |
34.6. | Applied Nanotech Inc. |
34.7. | Asahi Glass Corporation |
34.8. | Asahi Kasei |
34.9. | Bando Chemical Industries |
34.10. | BeBop Sensors |
34.11. | BotFactory |
34.12. | Cabot |
34.13. | Cartesian Co |
34.14. | Chang Sung Corporation |
34.15. | Cima Nanotech |
34.16. | Cima NanoTech Inc |
34.17. | Clariant Produkte (Deutschland) GmbH |
34.18. | ClearJet Ltd |
34.19. | Colloidal Ink Co., Ltd |
34.20. | Conductive Compounds |
34.21. | Daicel Corporation |
34.22. | DuPont |
34.23. | DuPont Advanced Materials |
34.24. | Electroninks Writeables |
34.25. | Ferro |
34.26. | Flexbright Oy |
34.27. | Fujikura Kasei Co Ltd |
34.28. | Genes 'Ink |
34.29. | Giga Solar Materials Corp |
34.30. | Harima |
34.31. | Henkel |
34.32. | Hicel Co Ltd |
34.33. | Hitachi Chemical |
34.34. | Indium Corporation |
34.35. | Inkron |
34.36. | InkTec Co., Ltd |
34.37. | Intrinsiq Materials |
34.38. | Kishu Giken Kogyo Co.,Ltd. |
34.39. | Komori Corporation |
34.40. | KunShan Hisense Electronics |
34.41. | Liquid X Printed Metals, Inc. |
34.42. | Lord Corp |
34.43. | Methode Electronics |
34.44. | Nagase America Corporation |
34.45. | Nano Dimension |
34.46. | NanoComposix |
34.47. | NANOGAP |
34.48. | NanoMas Technologies |
34.49. | Noritake |
34.50. | Novacentrix |
34.51. | Novacentrix |
34.52. | Novacentrix PulseForge |
34.53. | O-film Tech Co., Ltd |
34.54. | Optomec |
34.55. | Perpetuus Carbon Technologies Limited |
34.56. | Printechnologics |
34.57. | Promethean Particles |
34.58. | Pulse Electronics |
34.59. | PV Nano Cell |
34.60. | Raymor Industries Inc |
34.61. | Samsung (former Cheil Industries) |
34.62. | Showa Denko |
34.63. | Sun Chemical |
34.64. | Taiyo |
34.65. | Tangio Printed Electronics |
34.66. | The Sixth Element |
34.67. | T-Ink |
34.68. | Toda Kogyo Corp |
34.69. | Tokusen USA Inc. |
34.70. | Toyobo |
34.71. | Ulvac Corporation |
34.72. | UT Dots Inc |
34.73. | Vorbeck |
34.74. | Vorbeck Materials |
34.75. | Voxel8 |
34.76. | Xerox Research Centre of Canada (XRCC) |
34.77. | Xymox Technologies |
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| The inks must satisfy the following conditions: |
| IDTECHEX RESEARCH REPORTS AND CONSULTANCY |